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1. 发明专利

DE3413124C2 未知
公开(公告)号：DE3413124C2
公开(公告)日：1988-06-16
申请号：DE3413124
申请日：1984-04-06
申请人： ISHIDA, TAKESHI , ISHIDA, YOSHIHIRO, MATUBARASHI, OSAKA, JP
发明人： ISHIDA, TAKESHI , ISHIDA, YOSHIHIRO, MATUBARASHI, OSAKA, JP
IPC分类号： B29C45/27 , B29C45/46 , B29D11/00

2. 发明专利

DE3413124A1 Injection moulding device for the production of plastics concave lenses 未知
公开(公告)号：DE3413124A1
公开(公告)日：1985-10-24
申请号：DE3413124
申请日：1984-04-06
申请人： ISHIDA TAKESHI , ISHIDA YOSHIHIRO
发明人： ISHIDA TAKESHI , ISHIDA YOSHIHIRO
IPC分类号： B29C45/27 , B29C45/46 , B29D11/00
摘要： The invention relates to a device for the production of plastics concave lenses. Concave lenses of this type can be used, for example, for the production of spectacles for short-sighted persons or of projection lenses. According to the invention a plastics melt is injected into a metal injection mould in such a manner that no orientation of the material in the diametrical direction of the concave lenses takes place and in that, because of differences in the hardening of the plastics melt caused by temperature differences, no shrinkage lines or other marks occur.

3. 发明专利

CA2043038A1 LENS FOR PREBYOPIA FREE FROM SHORT DISTANCE AND INTERMEDIATE DISTANCE ABERRATION 未知
公开(公告)号：CA2043038A1
公开(公告)日：1992-11-23
申请号：CA2043038
申请日：1991-05-22
申请人： ISHIDA YOSHIHIRO
发明人： ISHIDA YOSHIHIRO
IPC分类号： G02C7/02
摘要： This invention relates to a lens for presbyopia free from short distance and intermediate distance aberration for use in correcting an old-age eyesight. In the lens for presbyopia with a front lens face having a smaller radius of curvature than a rear lens face, a lens face has a refractive index successively corrected as the lens face extends radially outwardly away from a geometric center of the lens so that lateral magnifications for all principal rays always equal a lateral magnification for a paraxial range. This construction is entirely free from distortional aberration, and secures a greatly enlarged range of distinct vision.

4. 发明申请

WO1996005613A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：WO1996005613A1
公开(公告)日：1996-02-22
申请号：PCT/JP1995001622
申请日：1995-08-15
申请人： CITIZEN WATCH CO., LTD. , ISHIDA, Yoshihiro , OHMORI, Yoshinobu , IKEDA, Ienobu , TERASHIMA, Kazuhiko , TOYODA, Takeshi
发明人： CITIZEN WATCH CO., LTD.
IPC分类号： H01L21/52
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2224/83385 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15182 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2224/45099 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： In a semiconductor device comprising an IC chip (8) mounted an a circuit substrate (7) and sealed with a molding resin (11), corner resist films (6a, 6b, 6c, 6d) are formed at positions corresponding to a corner (A) of the IC chip (8) on the circuit substrate (7), and the corner (A) of the IC chip (8) is bonded to these corner resist films by using a die bond (9). A die pattern (3a) is exposed outside the corner resist films, and a power supply pattern (3b) is so formed as to encompass their periphery. The power supply terminal, the die pattern (3a) and the power supply pattern (3b) are connected by bonding wires (10). In this way, the adhesion strength of the corner of the IC chip is improved and peel is prevented. Furthermore, bonding of a large number of bonding wires for power supply can be freely made.
摘要翻译：在包括安装有电路基板（7）并用模塑树脂（11）密封的IC芯片（8）的半导体器件中，在对应于角部的位置形成角部抗蚀剂膜（6a，6b，6c，6d） A），并且IC芯片（8）的角部（A）通过使用管芯接合（9）与这些角膜保护膜接合。裸片图案（3a）暴露在角部抗蚀剂膜的外侧，电源图案（3b）形成为包围其周边。电源端子，管芯图案（3a）和电源图案（3b）通过接合线（10）连接。以这种方式，提高了IC芯片的角部的粘合强度，并防止了剥离。此外，可以自由地形成大量用于电源的接合线的接合。

5. 发明申请

WO1997018584A1 METHOD FOR FORMING BUMP OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：形成半导体器件保护的方法
公开(公告)号：WO1997018584A1
公开(公告)日：1997-05-22
申请号：PCT/JP1996002871
申请日：1996-10-03
申请人： CITIZEN WATCH CO., LTD. , SATOU, Tetsuo , ISHIDA, Yoshihiro
发明人： CITIZEN WATCH CO., LTD.
IPC分类号： H01L21/321
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/0508 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/11334 , H01L2224/13011 , H01L2224/13099 , H01L2224/83136 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H05K3/3478 , H01L2224/05541 , H01L2224/05005 , H01L2924/013 , H01L2924/00014
摘要： A method for forming a bump of a semiconductor device including an adhesive applying step of applying an adhesive to a pad electrode of a semiconductor device, a solder grain attaching step of attaching one or more solder grains to the portion of the pad electrode where the adhesive is applied, and a solder melting step of forming a bump by melting the solder grains. In the solder melting step, a metallic core is put in the bump. Therefore, a semiconductor device where a highly reliable bump is formed is obtained through simple steps.
摘要翻译：一种用于形成半导体器件的突起的方法，包括将粘合剂施加到半导体器件的焊盘电极的粘合剂施加步骤，将一个或多个焊料颗粒附着到焊盘电极的部分的焊料颗粒附着步骤，其中粘合剂以及通过熔化焊料颗粒形成凸块的焊料熔化步骤。在焊料熔化步骤中，将金属芯放置在凸块中。因此，通过简单的步骤获得形成高可靠性凸块的半导体器件。

6. 发明申请

WO1997010613A1 GRINDING METHOD OF GRINDING DEVICE 审中-公开
标题翻译：研磨装置的研磨方法
公开(公告)号：WO1997010613A1
公开(公告)日：1997-03-20
申请号：PCT/JP1995001814
申请日：1995-09-13
申请人： HITACHI, LTD. , MORIYAMA, Sigeo , YAMAGUCHI, Katsuhiko , HONMA, Yoshio , MATSUBARA, Sunao , ISHIDA, Yoshihiro , KAWAAI, Ryousei
发明人： HITACHI, LTD.
IPC分类号： H01L21/304
CPC分类号： H01L21/31053 , B24B27/0076 , B24B37/04 , B24B37/042 , B24B37/24 , B24B37/245 , B24D3/002 , B24D3/28
摘要： A grinding method which uses grindstone comprising abrasive grains and a binding resin for binding the abrasive grains, and a grinding device for use in the same. Grindstone having a desired elastic modulus can be manufactured by means of a resin for binding abrasive grains. Accordingly, surfaces of a substrate having irregularity can be evenly flattened irrespective of dimensions of irregularity. Further, an abraded surface with less damage can be obtained by performing abrasion with an abrasive tool of a large elastic modulus after abrasion is preformed with an abrasive tool of a small elastic modulus. The present method is effective in flattening the surfaces of various substrates having irregularity.
摘要翻译：使用包含磨粒的磨石和用于粘合磨粒的粘合树脂的研磨方法以及用于其中的研磨装置。具有所需弹性模量的磨石可以通过用于粘合磨粒的树脂来制造。因此，具有不规则性的基板的表面可以均匀地平坦化，而与不规则的尺寸无关。此外，通过使用具有小弹性模量的研磨工具进行磨损后的具有大弹性模量的研磨工具进行磨损，可以获得具有较小损伤的磨损表面。本方法在使具有不规则性的各种基板的表面变平的情况下是有效的。

7. 发明申请

WO1997049954A1 BURNING/MELTING METHOD OF WASTE MELTING FURNACE 审中-公开
标题翻译：燃烧熔融炉的熔融/熔融方法
公开(公告)号：WO1997049954A1
公开(公告)日：1997-12-31
申请号：PCT/JP1997002149
申请日：1997-06-23
申请人： NIPPON STEEL CORPORATION , ISHIDA, Yoshihiro , TAWARA, Youichi , KATO, Yasuhiko , ONO, Yoshihiro , KURIBAYASHI, Kazuhiro , FUKINAKA, Norio , HARAJIRI, Hachiro , MURAHASHI, Kazuki
发明人： NIPPON STEEL CORPORATION
IPC分类号： F23G05/24
CPC分类号： F23G5/085 , F23G5/24 , F23L2900/07007 , Y02E20/344
摘要： Sinking of a charge in a cross-sectional direction of a melting furnace is made uniform, poor heat-exchange between the charge and a gas due to improper sinking of the charge and local concentration of a gas flow is reduced to minimum, a melting condition of wastes is stabilized irrespective of the composition of the wastes, and a charge of a treating speed of the wastes is restricted, too. A plurality of lower stage tuyeres are disposed vertically in a burning/melting zone, carbonaceous mass-like inflammable matters are mainly burnt by supplying a combustion support gas, a plurality of upper stage tuyeres are disposed vertically in a plurality of stages at the positions above the tuyeres, and a part of the wastes is burnt by supplying the combustion support gas. In this instance, the combustion support gas equivalent to oxygen content of 130 to 600 Nm /t of wastes is supplied, and the combustion support gas is supplied from the upper stage tuyeres so that the proportion of the oxygen content from the upper tuyeres is 0.2 to 0.8 of the sum of those of the lower and upper stages. Further, the supply quantity is controlled so that the oxygen content supplied from the lower stage tuyeres is at least 0.8 times the theoretical oxygen content of the carbonaceous mass-like inflammable matters, and the exhaust gas temperature on the packing layer of the wastes is set to 150 to 700 DEG C.
摘要翻译：使熔融炉的横截面方向的电荷沉降均匀，由于电荷的不适当的下降和气流的局部浓缩，电荷与气体之间的热交换差降低到最小，熔融条件废物的成分不管废物的组成是否稳定，并且废物的处理速度受到限制。多个下级风口垂直设置在燃烧/熔化区域，主要通过供给燃烧载体气体来燃烧碳质物质的易燃物质，多个上级风口在上述位置处以多级垂直设置风口和一部分废物通过供给燃烧载体气而燃烧。在这种情况下，供给相当于氧含量为130〜600Nm 3 / t废弃物的燃烧载体气体，并且从上级风口供给燃烧载体气体，使得来自上层的氧含量的比例风口是下段和上段总和的0.2〜0.8。此外，控制供给量使得从下级风口供给的氧含量为碳质物质状易燃物的理论氧含量的0.8倍以上，废弃物的包装层上的废气温度设定为至150〜700℃

8. 发明专利

JPS6328752A BURGLARPROOF DEVICE FOR VEHICLE 失效
公开(公告)号：JPS6328752A
公开(公告)日：1988-02-06
申请号：JP17182786
申请日：1986-07-23
申请人： RYOWA DENKI SANGYO KK , ITO SHOJI , ISHIDA YOSHIHIRO
发明人： OTA KAZUO , ITO SHOJI , ISHIDA YOSHIHIRO
IPC分类号： B60R25/01 , B60R25/10 , B60R25/24
摘要： PURPOSE:To protect a vehicle from burglary, by providing a portable transmitter for continuously transmitting a radio wave of preset frequency reachable within a limited distance and a vehicle mounted transmitter for unlocking the door lock only when said ratio wave is received. CONSTITUTION:When a person carrying a transmitter 1 approaches to a vehicle, a radio wave signal of preset frequency being transmitted from the transmitter 1 is received by a vehicle mounted receiver 2 and a control signal is outputted from a control signal output circuit 3. An unlock circuit 5 receives said control signal and unlocks the door lock of vehicle automatically. When the person parks the vehicle and departs from the vehicle by a distance longer than the reachable distance of radio wave, the control signal output circuit 3 stops production of control signal. Consequently, a lock circuit 6 detects the fact that the control signal is interrupted so as to lock the door lock automatically. Here, the door lock is unlocked only when a preset radio wave signal is received by the receiver 2.

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