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1. 发明申请

WO2019014685A1 MODULAR AIR COOLING AND DISTRIBUTION SYSTEMS AND METHODS 审中-公开
公开(公告)号：WO2019014685A1
公开(公告)日：2019-01-17
申请号：PCT/US2018/042353
申请日：2018-07-16
申请人： INERTECH IP LLC
发明人： COSTAKIS, John , NGUYEN, Ken , ZHANG, Ming , SHAPIRO, Doron
IPC分类号： H05K7/20
摘要： Modular air cooling and distribution systems include a fan and heat exchanger cooling module or assembly. The cooling assembly includes a fluid-to-air heat exchanger and a variable speed fan. The fluid in the fluid-to-air heat exchanger may be propylene glycol or water. The heat exchanger minimizes pressure drop and maximizes heat transfer. The quantity of cooling assemblies is selected to match the indoor cooling requirements. The cooling assemblies are easily assembled together, stacked vertically, and/or connected horizontally, to match the cooling load. If additional cooling capacity is needed in the future, more cooling assemblies can easily be added, and the cooling assemblies may be expanded vertically and/or horizontally. The speed of the fans of the fan and heat exchanger assemblies are controlled based on fluid temperature and fluid velocity measurements, which may be obainted by an anemometer.

2. 发明专利

AU2011270812C1 Space-saving high-density modular data center and an energy-efficient cooling system 未知
公开(公告)号：AU2011270812C1
公开(公告)日：2017-05-11
申请号：AU2011270812
申请日：2011-06-23
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： H05K7/20
摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free- cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

3. 发明专利

SG193259A1 SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS 未知
公开(公告)号：SG193259A1
公开(公告)日：2013-10-30
申请号：SG2013065925
申请日：2011-12-28
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free- cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

4. 发明专利

AU2017202585B2 Space-saving high-density modular data center and an energy-efficient cooling system 未知
公开(公告)号：AU2017202585B2
公开(公告)日：2019-02-28
申请号：AU2017202585
申请日：2017-04-19
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： H05K7/20 , F25B49/00 , F25D17/00 , F28D15/00 , G06F1/20 , H01L23/34
摘要： SPACE-SAVING HIGH-DENSITY MODULAR DATA CENTER AND AN ENERGY-EFFICIENT COOLING SYSTEM A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free cooling system and a plurality of modular data pods (50), each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure (105) having at least five walls (1051, 1052. 1053, 1054, 1055) arranged in the shape of a polygon, a plurality of computer racks (501, 502, 503, 504, 505) arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod (50) also includes an auxiliary enclosure (515) containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure (515) contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system. Fig. 2A co co CO CO C:) CD CD C.0 CO co CD Co CD co cc co co co co I co CD cc cm co co co CD C:) Co co co co co co CD C-0 co co co co cz U') C5 U-) " CD LO CD Lo CD 'T- co U,:l Lo CD LO CD CD LO LO LOCO co C= co CD cm CD m C:) C=) C) cz C--) r cz LO LO ":Zr LO C::)Lr) LO LO cz LO c::) U") LO T- LO LO Ln LO cz C CD C=) C:) LO C=) zl- C::) LO CD LO LO CD 'T- C:) LO

5. 发明专利

AU2017202585A1 Space-saving high-density modular data center and an energy-efficient cooling system 未知
公开(公告)号：AU2017202585A1
公开(公告)日：2017-05-11
申请号：AU2017202585
申请日：2017-04-19
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： H05K7/20
摘要： SPACE-SAVING HIGH-DENSITY MODULAR DATA CENTER AND AN ENERGY-EFFICIENT COOLING SYSTEM A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free cooling system and a plurality of modular data pods (50), each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure (105) having at least five walls (1051, 1052. 1053, 1054, 1055) arranged in the shape of a polygon, a plurality of computer racks (501, 502, 503, 504, 505) arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod (50) also includes an auxiliary enclosure (515) containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure (515) contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system. Fig. 2A co co CO CO C:) CD CD C.0 CO co CD Co CD co cc co co co co I co CD cc cm co co co CD C:) Co co co co co co CD C-0 co co co co cz U') C5 U-) " CD LO CD Lo CD 'T- co U,:l Lo CD LO CD CD LO LO LOCO co C= co CD cm CD m C:) C=) C) cz C--) r cz LO LO ":Zr LO C::)Lr) LO LO cz LO c::) U") LO T- LO LO Ln LO cz C CD C=) C:) LO C=) zl- C::) LO CD LO LO CD 'T- C:) LO

6. 发明专利

AU2011360944A1 Space-saving high-density modular data pod systems and energy-efficient cooling systems 未知
公开(公告)号：AU2011360944A1
公开(公告)日：2013-09-19
申请号：AU2011360944
申请日：2011-12-28
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： G06F1/16 , G06F1/20
摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free- cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

7. 发明专利

AU2011360945A1 Modular IT rack cooling assemblies and methods for assembling same 未知
公开(公告)号：AU2011360945A1
公开(公告)日：2013-09-05
申请号：AU2011360945
申请日：2011-12-28
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： H05K7/20
摘要： A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

8. 发明专利

CA2827960A1 MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME 未知
公开(公告)号：CA2827960A1
公开(公告)日：2012-09-07
申请号：CA2827960
申请日：2011-12-28
申请人： INERTECH IP LLC
发明人： KEISLING EARL , COSTAKIS JOHN , MCDONNELL GERALD
IPC分类号： H05K7/20
摘要： A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

9. 发明专利

CA2926777C COOLING SYSTEMS AND METHODS INCORPORATING A PLURAL IN SERIES PUMPED LIQUID REFRIGERANT TRIM EVAPORATOR CYCLE 未知
公开(公告)号：CA2926777C
公开(公告)日：2021-11-02
申请号：CA2926777
申请日：2013-10-09
申请人： INERTECH IP LLC
发明人： MCDONNELL GERALD , KEISLING EARL
IPC分类号： F25B41/00 , F25B5/02 , F25B6/02 , F25B7/00 , F25B49/02
摘要： The cooling systems and methods of the present disclosure relate to a plural in- series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to incrementally further cool the air intake flow through the second evaporator coil when the temperature of the free-cooled first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

10. 发明专利

SG10202107907YA SYSTEM AND METHODS UTILIZING FLUID COOLERS AND CHILLERS TO PERFORM IN-SERIES HEAT REJECTION AND TRIM COOLING 未知
公开(公告)号：SG10202107907YA
公开(公告)日：2021-08-30
申请号：SG10202107907Y
申请日：2016-10-20
申请人： INERTECH IP LLC
发明人： COSTAKIS JOHN , ZHANG MING , KEISLING EARL , NGUYEN KEN
摘要： The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

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