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    • 2. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US07727787B2
    • 2010-06-01
    • US11976791
    • 2007-10-29
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L21/304
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。
    • 3. 发明申请
    • DOME TYPE STRUCTURE
    • DOME型结构
    • US20100313490A1
    • 2010-12-16
    • US12521419
    • 2007-12-17
    • Hyun Ju ParkSa Jin HongSeung Jun MoonUp Kim
    • Hyun Ju ParkSa Jin HongSeung Jun MoonUp Kim
    • E04B7/08E04B1/32
    • E04B1/3205E04B1/3211E04B2001/3276
    • Disclosed is a dome type structure induing main wall parts (10), forming four walls and a portion of a ceiling, each of which is provided with a lower end fixed to or buried under the ground in each of four directions and an upper end bent in a dome shape toward the center of the upper portion of the structure such that both edges of the upper ends of the neighboring main wall parts contact each other; corner wall parts (20) disposed at four corners of the structure between the neighboring main wall parts (10), and thus forming dome type corners; and a central ceiling part (30) closing a hole formed at the ceiling by connecting the main wall parts (10) such that the central ceiling part contacts the upper surfaces of the main wall parts (10), thereby being simply and rapidly assembled and disassembled.
    • 公开了一种引导主壁部分(10)的圆顶型结构,其形成四个壁和一部分天花板,每个天花板在四个方向中的每一个上设置有固定到或埋在地下的下端,并且上端弯曲 朝向结构的上部的中心的圆顶形状,使得相邻主壁部分的上端的两个边缘彼此接触; 设置在相邻的主壁部(10)之间的结构的四个角处的角壁部(20),从而形成圆顶型的角部; 以及中央顶板部(30),其通过连接所述主壁部(10)而封闭形成在所述天花板处的孔,使得所述中心顶部与所述主壁部(10)的上表面接触,从而被简单且快速地组装, 拆卸
    • 5. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20080105889A1
    • 2008-05-08
    • US11976791
    • 2007-10-29
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L33/00
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。
    • 9. 发明申请
    • NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 氮化物半导体发光器件及其制造方法
    • US20100193823A1
    • 2010-08-05
    • US12756528
    • 2010-04-08
    • Tae Jun KIMSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KIMSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L33/44
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。