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    • 1. 发明申请
    • THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
    • 薄膜晶体管阵列及其制造方法
    • US20120119229A1
    • 2012-05-17
    • US13159317
    • 2011-06-13
    • Hyun-Young KimSung-In RoCheoll-Hee Jeon
    • Hyun-Young KimSung-In RoCheoll-Hee Jeon
    • H01L33/62
    • H01L27/1259G02F1/13458G02F1/136227G02F2001/136236H01L21/28008H01L21/283H01L21/4885H01L27/124H01L27/1288
    • A thin film transistor array panel includes: a substrate including a display area and a drive region in which a driving chip for transmitting a driving signal to the pixels is located; a gate line in the display area; a storage electrode line; a gate driving pad coupled to the driving chip; a gate insulating layer; a first semiconductor layer on the gate insulating layer and overlapped with a gate electrode protruding from the gate line; a second semiconductor layer formed on the gate insulating layer and overlapped with a sustain electrode protruding from the storage electrode line; a data line crossing the gate line in an insulated manner and a drain electrode separated from the data line; and a pixel electrode coupled to the drain electrode, and the drain electrode comprises a drain bar facing the source electrode, and a drain extender overlapped with the second semiconductor layer.
    • 薄膜晶体管阵列面板包括:基板,包括显示区域和驱动区域,驱动区域中驱动信号发送到像素的驱动芯片; 显示区域中的栅极线; 存储电极线; 耦合到驱动芯片的栅极驱动焊盘; 栅极绝缘层; 栅极绝缘层上的第一半导体层,并与从栅极线突出的栅电极重叠; 形成在所述栅极绝缘层上并与从所述存储电极线突出的维持电极重叠的第二半导体层; 以绝缘方式与栅极线交叉的数据线和与数据线分离的漏电极; 以及耦合到所述漏电极的像素电极,并且所述漏电极包括面向所述源电极的漏极条和与所述第二半导体层重叠的漏极延伸器。
    • 4. 发明申请
    • DISPLAY DEVICE AND FABRICATION METHOD OF THE SAME
    • 显示装置及其制造方法
    • US20110255044A1
    • 2011-10-20
    • US13019876
    • 2011-02-02
    • Hyun-Young KIMJoo-Sun YOONJin-Yup KIM
    • Hyun-Young KIMJoo-Sun YOONJin-Yup KIM
    • G02F1/1343
    • H01L29/4908G02F1/1368H01L27/1255H01L29/42384
    • The embodiment relates to a display device having an improved aperture ratio and capacitance, and a fabrication method of the display device, in which the display device may include a thin film transistor, which includes: an active layer, a gate electrode, a source electrode electrically connected to the active layer, a drain electrode electrically connected to the active layer, and a gate insulating material formed between the active layer and the gate electrode, where the gate insulating material includes a first layer, a second layer and a third layer, where the second layer has a thickness between about 0.1 to about 1.5 times a thickness of the first layer, and where the third layer has a thickness between about 2 to about 12 times the thickness of the second layer.
    • 该实施例涉及具有改善的开口率和电容的显示装置,以及显示装置的制造方法,其中显示装置可以包括薄膜晶体管,其包括:有源层,栅电极,源电极 电连接到有源层,电连接到有源层的漏电极和形成在有源层和栅电极之间的栅极绝缘材料,其中栅极绝缘材料包括第一层,第二层和第三层, 其中所述第二层的厚度为所述第一层的厚度的约0.1至约1.5倍,并且其中所述第三层的厚度为所述第二层的厚度的约2至约12倍。
    • 6. 发明授权
    • Method of forming metal layer used in the fabrication of semiconductor device
    • 用于制造半导体器件的金属层的形成方法
    • US07416981B2
    • 2008-08-26
    • US11245366
    • 2005-10-05
    • Hyun-Suk LeeHyun-Young KimKwang-Jin Moon
    • Hyun-Suk LeeHyun-Young KimKwang-Jin Moon
    • H01L21/44
    • H01L21/76846C23C16/14C23C16/4408C23C16/45523C23C16/509H01L21/28556H01L21/76843
    • A method of forming a metal layer on the conductive region of a semiconductor device includes concurrently supplying a mixture gas including a hydrogen gas and a metal chloride compound gas, and a purge gas into a chamber having a sealed space for a predetermined time, thereby forming a first metal layer on the semiconductor substrate, using a plasma enhanced chemical vapor deposition (PECVD) method. The hydrogen gas and metal chloride gases are thereafter alternately supplied for a predetermined time while the purge gas is continuously supplied into the chamber, thereby forming a second metal layer on the first metal layer, using a PECVD method. Deterioration of semiconductor devices due to high heat by a conventional CVD method can be prevented using a PECVD method as a low temperature process, thereby improving a production yield.
    • 在半导体器件的导电区域上形成金属层的方法包括:将包含氢气和金属氯化物复合气体的混合气体以及吹扫气体同时供给到具有密封空间的室中预定时间,从而形成 使用等离子体增强化学气相沉积(PECVD)方法在半导体衬底上的第一金属层。 然后,将氢气和金属氯化物气体交替供给预定时间,同时将净化气体连续地供应到室中,从而使用PECVD方法在第一金属层上形成第二金属层。 使用PECVD法作为低温处理可以防止由于常规CVD法导致的高热导致的半导体器件劣化,从而提高了生产率。