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    • 1. 发明授权
    • Package structure
    • 包装结构
    • US08796844B2
    • 2014-08-05
    • US13393746
    • 2009-09-02
    • Hwee-Seng Jimmy ChewChee Kian Ong
    • Hwee-Seng Jimmy ChewChee Kian Ong
    • H01L23/02H01L23/34H05K1/02H01L25/065H01L23/538
    • H01L25/0655H01L23/5386H01L2224/16225H01L2224/16227H01L2224/73204H01L2924/00014H01L2924/09701H01L2924/15311H05K1/0243H05K2201/10378H05K2201/10522H05K2201/10674H01L2224/0401
    • A package structure including a first semiconductor element, a second semiconductor element, a semiconductor interposer and a substrate is provided. The first semiconductor element includes multiple first conductive bumps. The second semiconductor element includes multiple second conductive bumps. The semiconductor interposer includes a connection motherboard, at least one signal wire and at least one signal conductive column. The signal wire is disposed on the connection motherboard. The two ends of the signal wire are electrically connected to one of the first conductive bumps and one of the second conductive bumps respectively. The signal conductive column is electrically connected to the signal wire. The substrate is electrically connected to the signal conductive column. The first and the second semiconductor elements have the same circuit structure. The substrate of the package structure can simultaneously form a signal communication path with the first and the second semiconductor element respectively.
    • 提供包括第一半导体元件,第二半导体元件,半导体插入器和基板的封装结构。 第一半导体元件包括多个第一导电凸块。 第二半导体元件包括多个第二导电凸块。 半导体插入器包括连接母板,至少一个信号线和至少一个信号导电柱。 信号线设置在连接母板上。 信号线的两端分别电连接到第一导电凸块中的一个和第二导电凸块中的一个。 信号导电柱与信号线电连接。 衬底电连接到信号导电柱。 第一和第二半导体元件具有相同的电路结构。 封装结构的衬底可以分别同时形成与第一和第二半导体元件的信号通信路径。
    • 3. 发明申请
    • PACKAGE STRUCTURE
    • 包装结构
    • US20120153466A1
    • 2012-06-21
    • US13393746
    • 2009-09-02
    • Hwee-Seng Jimmy ChewChee Kian Ong
    • Hwee-Seng Jimmy ChewChee Kian Ong
    • H01L23/498
    • H01L25/0655H01L23/5386H01L2224/16225H01L2224/16227H01L2224/73204H01L2924/00014H01L2924/09701H01L2924/15311H05K1/0243H05K2201/10378H05K2201/10522H05K2201/10674H01L2224/0401
    • A package structure including a first semiconductor element, a second semiconductor element, a semiconductor interposer and a substrate is provided. The first semiconductor element includes multiple first conductive bumps. The second semiconductor element includes multiple second conductive bumps. The semiconductor interposer includes a connection motherboard, at least one signal wire and at least one signal conductive column. The signal wire is disposed on the connection motherboard. The two ends of the signal wire are electrically connected to one of the first conductive bumps and one of the second conductive bumps respectively. The signal conductive column is electrically connected to the signal wire. The substrate is electrically connected to the signal conductive column. The first and the second semiconductor elements have the same circuit structure. The substrate of the package structure can simultaneously form a signal communication path with the first and the second semiconductor element respectively.
    • 提供包括第一半导体元件,第二半导体元件,半导体插入器和基板的封装结构。 第一半导体元件包括多个第一导电凸块。 第二半导体元件包括多个第二导电凸块。 半导体插入器包括连接母板,至少一个信号线和至少一个信号导电柱。 信号线设置在连接母板上。 信号线的两端分别电连接到第一导电凸块中的一个和第二导电凸块中的一个。 信号导电柱与信号线电连接。 衬底电连接到信号导电柱。 第一和第二半导体元件具有相同的电路结构。 封装结构的衬底可以分别同时形成与第一和第二半导体元件的信号通信路径。