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1. 发明申请

US20090161313A1 HEAT DISSIPATING STRUCTURE 有权
标题翻译：热消散结构
公开(公告)号：US20090161313A1
公开(公告)日：2009-06-25
申请号：US12332032
申请日：2008-12-10
申请人： Hsueh-Lung Cheng , Ming-Feng Tsai
发明人： Hsueh-Lung Cheng , Ming-Feng Tsai
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.
摘要翻译：用于热源的散热结构包括位置调节单元，第一散热元件，第二散热元件和第一导热元件。位置调整单元具有弹性元件。第一散热元件与位置调节单元连接。第二散热元件与热源接触。第一导热元件的一端与第一散热元件接触，第一导热元件的另一端与第二散热元件接触。位置调整单元通过弹性元件调节第一散热元件相对于第二散热元件的位置。

2. 发明申请

US20090011131A1 METHOD FOR TREATING SURFACE OF HEAT DISSIPATING MODULE 审中-公开
标题翻译：热处理模块表面处理方法
公开(公告)号：US20090011131A1
公开(公告)日：2009-01-08
申请号：US12146475
申请日：2008-06-26
申请人： Yu-Cheng Chou , Te-Li Tsai , Ming-Feng Tsai , Chich-Hua Shen , Hsueh-Lung Cheng
发明人： Yu-Cheng Chou , Te-Li Tsai , Ming-Feng Tsai , Chich-Hua Shen , Hsueh-Lung Cheng
IPC分类号： B05D3/10 , B05D1/18
CPC分类号： H01L23/373 , C23C18/1208 , C23C18/1216 , C23C18/1225 , C23C18/127 , F28F19/02 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.
摘要翻译：提供了一种处理散热模块表面的方法。该方法包括以下步骤。首先，提供散热模块。接着，在散热模块的表面上形成纳米材料层。因此，散热模块的表面与空气隔离并有效防止氧化或污染。

3. 发明授权

US07944688B2 Heat dissipating structure including a position-adjusting unit 有权
标题翻译：散热结构包括位置调节单元
公开(公告)号：US07944688B2
公开(公告)日：2011-05-17
申请号：US12332032
申请日：2008-12-10
申请人： Hsueh-Lung Cheng , Ming-Feng Tsai
发明人： Hsueh-Lung Cheng , Ming-Feng Tsai
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20
摘要： A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.
摘要翻译：用于热源的散热结构包括位置调节单元，第一散热元件，第二散热元件和第一导热元件。位置调整单元具有弹性元件。第一散热元件与位置调节单元连接。第二散热元件与热源接触。第一导热元件的一端与第一散热元件接触，第一导热元件的另一端与第二散热元件接触。位置调整单元通过弹性元件调节第一散热元件相对于第二散热元件的位置。

4. 发明授权

US07755900B2 Heat dissipating module 有权
标题翻译：散热模块
公开(公告)号：US07755900B2
公开(公告)日：2010-07-13
申请号：US12273496
申请日：2008-11-18
申请人： Hsueh-Lung Cheng
发明人： Hsueh-Lung Cheng
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/20
摘要： A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.
摘要翻译：提供了包括第一散热器，第二散热器，连接器，枢轴和热管的散热模块。第一散热器设置在电路板上并接触热源。第二散热器具有第一枢转孔和限制开口。连接器具有第一连接部分和第二连接部分。第一连接部固定地连接到第一散热器。第二连接部具有与第一枢转孔对应的限制突起和第二枢转孔。枢轴穿过第一枢转孔和第二枢转孔，并且枢转地连接到连接器和第二散热器。限制突起突出到限制开口中以限制第二散热器相对于连接器的旋转角度。

5. 发明申请

US20090141454A1 HEAT DISSIPATING MODULE 有权
标题翻译：散热模块
公开(公告)号：US20090141454A1
公开(公告)日：2009-06-04
申请号：US12273496
申请日：2008-11-18
申请人： Hsueh-Lung Cheng
发明人： Hsueh-Lung Cheng
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.
摘要翻译：提供了包括第一散热器，第二散热器，连接器，枢轴和热管的散热模块。第一散热器设置在电路板上并接触热源。第二散热器具有第一枢转孔和限制开口。连接器具有第一连接部分和第二连接部分。第一连接部固定地连接到第一散热器。第二连接部具有与第一枢转孔对应的限制突起和第二枢转孔。枢轴穿过第一枢转孔和第二枢转孔，并且枢转地连接到连接器和第二散热器。限制突起突出到限制开口中以限制第二散热器相对于连接器的旋转角度。

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