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1. 发明授权

US08748513B2 Epoxy resin composition, and prepreg and printed circuit board using the same 有权
标题翻译：环氧树脂组合物，以及使用其的预浸料和印刷电路板
公开(公告)号：US08748513B2
公开(公告)日：2014-06-10
申请号：US12836871
申请日：2010-07-15
申请人： Hsien-Te Chen
发明人： Hsien-Te Chen
IPC分类号： B32B15/092 , B32B27/04 , C08K3/10 , C08K3/22 , C08L63/02 , H05K1/03
CPC分类号： H05K1/0326 , C08G59/504 , C08G59/621 , C08G59/623 , C08L61/34 , H05K1/0366 , H05K2201/0209 , Y10T428/31511 , Y10T428/31522
摘要： Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
摘要翻译：公开了一种用于印刷电路板的环氧树脂组合物，其包括（A）环氧树脂; （B）一种复合固化剂，其中包括以一定比例混合的氨基 - 三嗪 - 酚醛清漆树脂和二氨基二苯砜; （C）固化促进剂; 和（D）任选的无机填料。

2. 发明授权

US08580916B2 Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use 有权
标题翻译：由N，O-杂环制备的聚合物的稳定溶液及其制备方法和用途
公开(公告)号：US08580916B2
公开(公告)日：2013-11-12
申请号：US12966274
申请日：2010-12-13
申请人： Shih-Hao Liao , Chih-Wei Liao , Hsuan-Hao Hsu , Hsien-Te Chen , Tsung-Hsien Lin
发明人： Shih-Hao Liao , Chih-Wei Liao , Hsuan-Hao Hsu , Hsien-Te Chen , Tsung-Hsien Lin
IPC分类号： C08G59/00
CPC分类号： C08G73/0233 , C08L79/02 , C08L63/00
摘要： A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.
摘要翻译：提供由N，O-杂环化合物制备的聚合物的稳定溶液及其制备方法，其中通过使式I或II的N，O-杂环化合物进行开环聚合制备稳定溶液：其中 R1至R3，W1，W2，m，n，p和q如说明书中所定义。稳定的溶液可用作固化环氧树脂的固化剂。

3. 发明申请

US20120097437A1 Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same 审中-公开
标题翻译：树脂组合物，以及使用其制备的预浸料和印刷电路板
公开(公告)号：US20120097437A1
公开(公告)日：2012-04-26
申请号：US13006530
申请日：2011-01-14
申请人： Shih-Hao Liao , Chih-Wei Liao , Hsuan-Hao Hsu , Hsien-Te Chen , Tsung-Hsien Lin
发明人： Shih-Hao Liao , Chih-Wei Liao , Hsuan-Hao Hsu , Hsien-Te Chen , Tsung-Hsien Lin
IPC分类号： H05K1/03 , C08K3/34 , C08L63/00
CPC分类号： H05K1/0373 , C08G59/4014 , C08L63/00 , H05K1/0366 , H05K3/022
摘要： A resin composition is provided. The resin composition comprises: an epoxy resin; a polymer solution as a hardener, which is prepared by the following steps: (a) dissolving an N,O-heterocyclic compound into a first solvent to form a first reaction solution, wherein the N,O-heterocyclic compound is of Formula I or Formula II: wherein, R1 to R3, W1, W2, m, n, p and q are defined in the specification; (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization; and (c) cooling the first reaction solution to a second temperature to substantially terminate the ring-opening polymerization, and thus obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature, and wherein, the amount of the hardener, based on the solid, is about 20 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin.
摘要翻译：提供树脂组合物。树脂组合物包含：环氧树脂; 作为硬化剂的聚合物溶液，其通过以下步骤制备：（a）将N，O-杂环化合物溶解在第一溶剂中以形成第一反应溶液，其中所述N，O-杂环化合物为式I或式II：其中，R1至R3，W1，W2，m，n，p和q在说明书中定义; （b）将第一反应溶液加热至第一温度以进行开环聚合; 和（c）将第一反应溶液冷却至第二温度以基本上终止开环聚合，从而获得聚合物溶液，其中第一溶剂对N，O-杂环化合物不反应; 第一温度高于N，O-杂环化合物的软化温度，低于第一溶剂的沸点; 并且第二温度低于第一温度，并且其中，基于固体的固化剂的量为每100重量份环氧树脂约20重量份至约200重量份。

4. 发明申请

US20110253434A1 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开
标题翻译：环氧树脂组合物，以及使用其的印刷电路板和印刷电路板
公开(公告)号：US20110253434A1
公开(公告)日：2011-10-20
申请号：US12836983
申请日：2010-07-15
申请人： Hsien-Te CHEN
发明人： Hsien-Te CHEN
IPC分类号： C08L63/00 , H05K1/00 , C08G59/40
CPC分类号： H05K1/0326 , C08G59/4021 , C08G59/621 , C08G59/623 , H05K1/0366 , H05K2201/0209
摘要： Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
摘要翻译：公开了一种用于印刷电路板的环氧树脂组合物，其包括（A）环氧树脂; （B）以一定比例混合的包含氨基 - 三嗪 - 酚醛清漆树脂和双氰胺的复合固化剂; （C）固化促进剂; 和（D）任选的无机填料。

5. 发明申请

US20080122036A1 Reverse-biased PN diode decoupling capacitor 有权
标题翻译：反向偏置PN二极管去耦电容
公开(公告)号：US20080122036A1
公开(公告)日：2008-05-29
申请号：US11502094
申请日：2006-08-10
申请人： Hsien-Te Chen , Jen-Hang Yang , Chun-Hui Tai
发明人： Hsien-Te Chen , Jen-Hang Yang , Chun-Hui Tai
IPC分类号： H01L29/93
CPC分类号： H01L29/8611 , H01L27/0629 , H01L27/0805 , H01L27/0814
摘要： This invention discloses a decoupling capacitor in an integrated circuit, comprising a plurality of dedicated PN diodes with a total junction area greater than one tenth of a total active area of functional devices for which the dedicated PN diodes are intended to protect, a N-type region of the dedicated PN diodes coupling to a positive supply voltage (Vdd), and a P-type region of the dedicated PN diodes coupling to a complimentary lower supply voltage (Vss), wherein the dedicated PN diodes are reversely biased.
摘要翻译：本发明公开了一种集成电路中的去耦电容器，其包括多个专用PN二极管，其总结面积大于专用PN二极管旨在保护的功能器件的总有效面积的十分之一，N型耦合到正电源电压（Vdd）的专用PN二极管的区域和耦合到互补的较低电源电压（Vss）的专用PN二极管的P型区域，其中专用PN二极管被反向偏置。

6. 发明申请

US20140072807A1 RESIN COMPOSITIONS AND USES OF THE SAME 审中-公开
标题翻译：树脂组合物及其用途
公开(公告)号：US20140072807A1
公开(公告)日：2014-03-13
申请号：US13675342
申请日：2012-11-13
申请人： Te-Liang YU , Hsien-Te CHEN , Chih-Wei LIAO
发明人： Te-Liang YU , Hsien-Te CHEN , Chih-Wei LIAO
IPC分类号： C08L63/00 , C08K3/00 , C09D163/00 , C08K3/36 , C08K3/40 , C08K3/26 , C08K3/34
CPC分类号： C08L63/00 , C08J5/24 , C08J2363/00 , C08K3/105 , C08K3/26 , C08K3/34 , C08K3/346 , C08K3/36 , C08K3/40 , C08K5/0008 , C08K5/3415 , C08K5/3445 , C08K5/3492 , C08K5/41 , C08K2003/265 , Y10T428/31522
摘要： A resin composition is provided. The resin composition comprises an epoxy resin, a first filler containing calcium carbonate and hydrated magnesium silicate and a hardener, wherein the first filler has a diameter ranging from about 0.1 μm to about 100 μm; and the amount of the first filler is about 1 part by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.
摘要翻译：提供树脂组合物。树脂组合物包含环氧树脂，含有碳酸钙和水合硅酸镁的第一填料和硬化剂，其中第一填料的直径范围为约0.1μm至约100μm; 并且第一填料的量相对于100重量份环氧树脂为约1重量份至约150重量份。

7. 发明授权

US08383738B2 Epoxy resin composition, and prepreg and printed circuit board using the same 有权
标题翻译：环氧树脂组合物，以及使用其的预浸料和印刷电路板
公开(公告)号：US08383738B2
公开(公告)日：2013-02-26
申请号：US12842653
申请日：2010-07-23
申请人： Hsien-Te Chen , Tsung-Hsien Lin
发明人： Hsien-Te Chen , Tsung-Hsien Lin
IPC分类号： B32B17/04 , B32B27/04 , C08L63/00 , H05K1/03
CPC分类号： H05K1/0326 , C08K5/3155 , C08K5/41 , C08L61/28 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , Y10T428/2915 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , C08L63/00
摘要： Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
摘要翻译：公开了一种用于印刷电路板的环氧树脂组合物，其包括（A）环氧树脂; （B）一种复合固化剂，包括氨基 - 三嗪 - 酚醛清漆树脂，二氨基二苯砜和双氰胺以一定比例混合; （C）固化促进剂; 和（D）任选的无机填料。

8. 发明申请

US20120329912A1 FUSED FILLER AND ITS MANUFACTURING METHOD AND USE 审中-公开
标题翻译：熔融填料及其制造方法和用途
公开(公告)号：US20120329912A1
公开(公告)日：2012-12-27
申请号：US13227546
申请日：2011-09-08
申请人： Cheng-Ping LIU , Jiun-Jie HUANG , Hsien-Te CHEN , Chih-Wei LIAO
发明人： Cheng-Ping LIU , Jiun-Jie HUANG , Hsien-Te CHEN , Chih-Wei LIAO
IPC分类号： C08K3/38 , H05K3/46 , C04B14/30
CPC分类号： C04B14/041 , C04B26/14 , C08K3/38 , H05K1/0373 , H05K2201/0209 , C04B14/042 , C04B14/06 , C04B14/106 , C04B14/20 , C04B14/22 , C04B2103/408
摘要： A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO2, about 10 wt % to about 20 wt % Al2O3, about 20 wt % to about 30 wt % B2O3 and about 1 wt % to about 5 wt % oxides of IA/IIA metals. The fused filler can be used in a resin composition for preparing prepregs and printed circuit boards.
摘要翻译：提供熔融填料及其制造方法。熔融填料包含约50重量％至约60重量％的SiO 2，约10重量％至约20重量％的Al 2 O 3，约20重量％至约30重量％的B 2 O 3和约1重量％至约5重量％的IA / IIA金属。熔融填料可以用于制备预浸料和印刷电路板的树脂组合物中。

9. 发明申请

US20120263955A1 RESIN COMPOSITION AND USES OF THE SAME 有权
标题翻译：树脂组合物及其用途
公开(公告)号：US20120263955A1
公开(公告)日：2012-10-18
申请号：US13161311
申请日：2011-06-15
申请人： Hsien-Te Chen , Mei-Ling Chu , Tsung-Hsien Lin , Chih-Wei Liao
发明人： Hsien-Te Chen , Mei-Ling Chu , Tsung-Hsien Lin , Chih-Wei Liao
IPC分类号： C08L63/00 , C08K3/36 , B32B15/092 , C08K3/22 , B05D1/18 , C08K5/3492 , C08K3/40
CPC分类号： B32B5/26 , B32B15/14 , B32B2260/023 , B32B2260/046 , C08G59/4246 , C08J5/24 , C08J2325/08 , C08J2363/00 , C08L63/00 , Y10T428/31511 , Y10T428/31522
摘要： A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1−m2≧3.
摘要翻译：提供树脂组合物。树脂组合物包含环氧树脂和硬化剂，其中固化剂的量为每100重量份环氧树脂约10重量份至约200重量份，并且固化剂包含第一苯乙烯 - 马来酸酐共聚物（ SMA）共聚物和第二SMA共聚物，第一SMA共聚物具有苯乙烯与马来酸酐m1的摩尔比，第二SMA共聚物具有苯乙烯与马来酸酐的摩尔比m2，m1-m2≥3。

10. 发明授权

US08174126B2 Stacked multi-chip 有权
标题翻译：堆叠多芯片
公开(公告)号：US08174126B2
公开(公告)日：2012-05-08
申请号：US12882805
申请日：2010-09-15
申请人： Ting-Ting Hwang , Hsien-Te Chen
发明人： Ting-Ting Hwang , Hsien-Te Chen
IPC分类号： H01L23/12 , H01L23/52 , H01L23/48
CPC分类号： H01L23/5286 , H01L23/481 , H01L25/0657 , H01L2223/6616 , H01L2223/6666 , H01L2225/06513 , H01L2225/06544 , H01L2924/0002 , H01L2924/00
摘要： A stacked multi-chip comprises a base layer, a first chip, a first stacked chip and at least one second stacked chip. The base layer comprises a mounting panel and a redistributed layer. The redistributed layer is mounted on the mounting panel. The first chip comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer abuts the redistributed layer. The first stacked chip is mounted on the first chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel that is connected to the TSV channel of the first chip. The second stacked chip is mounted on the first stacked chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer is connected to the connective layer of the first stacked chip.
摘要翻译：堆叠式多芯片包括基底层，第一芯片，第一堆叠芯片和至少一个第二堆叠芯片。基层包括安装面板和再分布层。再分布层安装在安装面板上。第一芯片包括非导电层和连接层。非导电层包括TSV通道。连接层邻接重新分布的层。第一堆叠芯片安装在第一芯片上并且包括非导电层和连接层。非导电层包括连接到第一芯片的TSV通道的TSV通道。第二堆叠芯片安装在第一堆叠芯片上，并且包括非导电层和连接层。非导电层包括TSV通道。连接层连接到第一堆叠芯片的连接层。

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