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1. 发明授权

US06323952B1 Flatness measuring apparatus 失效
标题翻译：平面度测量仪
公开(公告)号：US06323952B1
公开(公告)日：2001-11-27
申请号：US09452134
申请日：1999-12-01
申请人： Masahiko Yomoto , Hosei Nakahira , Eiji Matsukawa , Hironobu Sakuta
发明人： Masahiko Yomoto , Hosei Nakahira , Eiji Matsukawa , Hironobu Sakuta
IPC分类号： G01B1130
CPC分类号： G01B11/306
摘要： A flatness measuring apparatus measures flatness of a substrate on which a specific pattern is to be formed by adjusting focus to a forming reference flat plane obtained based upon height data corresponding to specific measuring points of the substrate. The flatness measuring apparatus includes: an arithmetic operation device that obtains height data at predetermined measuring points of the substrate, determines a flatness judging criterion flat plane based upon height data at measuring points located at positions at which the specific measuring points are located through an arithmetic operation, determines quantities of displacement at the predetermined measuring points relative to the flatness judging criterion flat plane through an arithmetic operation, and measures the flatness of the substrate based upon the quantities of displacement.
摘要翻译：平坦度测量装置通过将焦点调整到基于与基板的特定测量点相对应的高度数据获得的成形基准平面来测量要在其上形成特定图案的基板的平坦度。平坦度测量装置包括：算术运算装置，其在基板的预定测量点处获取高度数据，基于位于特定测量点所在位置处的测量点处的高度数据，通过算术确定平坦度判断基准平面操作，通过算术运算来确定预定测量点处的相对于平坦度判定基准平面的位移量，并且基于位移量来测量基板的平坦度。

2. 发明申请

US20120194929A1 LENS UNIT AND IMAGE CAPTURING APPARATUS 审中-公开
标题翻译：镜头单元和图像捕获设备
公开(公告)号：US20120194929A1
公开(公告)日：2012-08-02
申请号：US13308916
申请日：2011-12-01
申请人： Hosei NAKAHIRA , Toshihisa TANAKA , Yoichi YAMAMOTO
发明人： Hosei NAKAHIRA , Toshihisa TANAKA , Yoichi YAMAMOTO
IPC分类号： G02B7/04
CPC分类号： G02B7/04 , G02B7/08
摘要： Provided is a lens unit comprising an actuator that is self-supporting when at a stopped position. The lens unit comprises a holding frame that holds a lens; a movement actuator that moves the holding frame, which is connected to a moving member that moves linearly relative to a stator, when drive force is generated, and does not prevent the moving member from moving relative to the stator when the moving member is stopped; and a braking actuator that stops the moving member from moving relative to the stator, using frictional force, when the movement actuator is not generating the drive force, and decreases the frictional force when the movement actuator generates the drive force.
摘要翻译：提供了一种透镜单元，包括当处于停止位置时是自支撑的致动器。透镜单元包括保持透镜的保持框架; 移动致动器，当驱动力产生时，移动所述保持框架，所述保持框架连接到相对于定子线性移动的移动构件，并且当所述移动构件停止时不阻止所述移动构件相对于所述定子移动; 以及当运动致动器不产生驱动力时使用摩擦力使运动部件相对于定子运动的制动致动器，并且当运动致动器产生驱动力时减小摩擦力。

3. 发明申请

US20090233525A1 Method for Detecting Polishing End in CMP Polishing Device, CMP Polishing Device, and Semiconductor Device Manufacturing Method 有权
标题翻译：用于检测CMP抛光装置中的抛光端的方法，CMP抛光装置和半导体装置制造方法
公开(公告)号：US20090233525A1
公开(公告)日：2009-09-17
申请号：US11921008
申请日：2006-05-16
申请人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
发明人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
IPC分类号： B24B49/04 , B24B49/12 , H01L21/304
CPC分类号： G01N21/55 , B24B37/013 , B24B49/12 , G01N21/9501 , H01L21/3212 , H01L22/26
摘要： The spectral reflectance spectrum of an object of polishing that has reached the polishing endpoint is found ahead of time, the spectral reflectance spectrum of the object of polishing is found during polishing, and the correlation coefficient of these is seen as parameter 1. Meanwhile, the sum of the absolute values of the difference between the first order differentials of these is seen as parameter 2. Then, when parameter 1 is in a range exceeding a specific value, and parameter 2 is at its minimum, it is concluded that the polishing endpoint has been reached. Thus, it is possible to provide a method for detecting the polishing endpoint in a highly reliable CMP polishing apparatus.
摘要翻译：已经提前到达抛光终点的抛光对象的光谱反射光谱，在研磨过程中发现抛光对象的光谱反射光谱，其相关系数被视为参数1。同时，将这些的一阶微分之差的绝对值之和视为参数2.然后，当参数1在超过特定值的范围内且参数2处于最小值时，得出结论：抛光端点已经到达因此，可以提供一种用于在高可靠性CMP抛光装置中检测抛光终点的方法。

4. 发明授权

US07981309B2 Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method 有权
标题翻译：用于检测CMP抛光装置中的抛光端的方法，CMP抛光装置和半导体器件制造方法
公开(公告)号：US07981309B2
公开(公告)日：2011-07-19
申请号：US11921008
申请日：2006-05-16
申请人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
发明人： Takehiko Ueda , Hosei Nakahira , Akira Ishikawa
IPC分类号： C03C25/68 , B24B49/00
CPC分类号： G01N21/55 , B24B37/013 , B24B49/12 , G01N21/9501 , H01L21/3212 , H01L22/26
摘要： The spectral reflectance spectrum of an object of polishing that has reached the polishing endpoint is found ahead of time, the spectral reflectance spectrum of the object of polishing is found during polishing, and the correlation coefficient of these is seen as parameter 1. Meanwhile, the sum of the absolute values of the difference between the first order differentials of these is seen as parameter 2. Then, when parameter 1 is in a range exceeding a specific value, and parameter 2 is at its minimum, it is concluded that the polishing endpoint has been reached. Thus, it is possible to provide a method for detecting the polishing endpoint in a highly reliable CMP polishing apparatus.
摘要翻译：达到抛光终点的抛光对象的光谱反射光谱提前发现，抛光时发现抛光对象的光谱反射光谱，其相关系数被视为参数1。将这些的一阶微分之差的绝对值之和视为参数2.然后，当参数1在超过特定值的范围内且参数2处于最小值时，得出结论：抛光端点已经到达因此，可以提供一种用于在高可靠性CMP抛光装置中检测抛光终点的方法。

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