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    • 10. 发明授权
    • Process for forming through holes in substrate of printed circuit board
    • 用于在印刷电路板的基板中形成通孔的工艺
    • US06458514B1
    • 2002-10-01
    • US09588593
    • 2000-06-07
    • Chong-Ren MaaHong-Ming LinToshikazu OdaMakoto NakamuraSunao Meguro
    • Chong-Ren MaaHong-Ming LinToshikazu OdaMakoto NakamuraSunao Meguro
    • G03F700
    • H05K3/0052H05K3/0035H05K3/064H05K2201/0394H05K2201/09363Y10S430/146
    • One or more through holes are formed by a process in a printed circuit board substrate formed of a resinous dielectric sheet and a conductive layer covering one surface of the dielectric sheet. The process involves the forming by laser one or more cavities on other surface of the dielectric sheet such that the cavities penetrate only the dielectric sheet, without penetrating the conductive layer. Both surfaces of the dielectric sheet are coated with a liquid photoresist layer such that the cavities are filled with the photoresist. A plurality of small areas are formed by photolithography on the surface which is covered with the conductive layer. The small areas are corresponding in location and shape to the cavities which may be of any shape. The small areas are stripped of the conductive, layer by etching before the cavities are stripped of the photoresist. The through holes are thus formed in the small areas defined by the cavities.
    • 通过由树脂电介质片形成的印刷电路板基板和覆盖电介质片的一个表面的导电层的工艺形成一个或多个通孔。 该方法涉及通过激光在电介质片的另一表面上形成一个或多个空腔,使得腔不穿透导电层而仅穿透电介质片。 电介质片的两个表面涂覆有液态光致抗蚀剂层,使得空​​腔被光致抗蚀剂填充。 在被导电层覆盖的表面上通过光刻法形成多个小区域。 这些小区域对应于可以是任何形状的空腔的位置和形状。 在空穴被光致抗蚀剂剥离之前,通过蚀刻将小区域剥离为导电层。 因此,通孔形成在由空腔限定的小区域中。