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    • 2. 发明授权
    • Photodiode and method of manufacturing the same
    • 光电二极管及其制造方法
    • US07190012B2
    • 2007-03-13
    • US11002832
    • 2004-12-02
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • H01L31/062H01L31/113
    • H01L31/105H01L31/02168Y02E10/50
    • A photodiode and a method of manufacturing the photodiode are provided. The method includes forming a diode junction structure including a light receiving unit and an electrode unit on a semiconductor substrate, forming a buffer oxide layer and an etching blocking layer on the junction structure, forming an interlayer insulating layer and an intermetal insulating layer and an interconnecting structure, exposing the etching blocking layer by etching the intermetal insulating layer and the interlayer insulating layer, removing a portion of the etching blocking layer and the buffer oxide layer of the light-receiving unit by dry etching, and exposing a semiconductor surface of the light-receiving unit by wet etching.
    • 提供光电二极管和制造光电二极管的方法。 该方法包括在半导体衬底上形成包括光接收单元和电极单元的二极管结结构,在接合结构上形成缓冲氧化物层和蚀刻阻挡层,形成层间绝缘层和金属间绝缘层和互连 通过蚀刻金属间绝缘层和层间绝缘层来暴露蚀刻阻挡层,通过干法蚀刻去除蚀刻阻挡层的一部分和光接收单元的缓冲氧化物层,并且暴露光的半导体表面 接收单元通过湿蚀刻。
    • 5. 发明申请
    • PHOTODIODE AND METHOD OF MANUFACTURING THE SAME
    • 光电及其制造方法
    • US20070243656A1
    • 2007-10-18
    • US11670457
    • 2007-02-02
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • H01L31/18
    • H01L31/105H01L31/02168Y02E10/50
    • A photodiode and a method of manufacturing the photodiode are provided. The method includes forming a diode junction structure including a light receiving unit and an electrode unit on a semiconductor substrate, forming a buffer oxide layer and an etching blocking layer on the junction structure, forming an interlayer insulating layer and an intermetal insulating layer and an interconnecting structure, exposing the etching blocking layer by etching the intermetal insulating layer and the interlayer insulating layer, removing a portion of the etching blocking layer and the buffer oxide layer of the light-receiving unit by dry etching, and exposing a semiconductor surface of the light-receiving unit by wet etching.
    • 提供光电二极管和制造光电二极管的方法。 该方法包括在半导体衬底上形成包括光接收单元和电极单元的二极管结结构,在接合结构上形成缓冲氧化物层和蚀刻阻挡层,形成层间绝缘层和金属间绝缘层和互连 通过蚀刻金属间绝缘层和层间绝缘层来暴露蚀刻阻挡层,通过干法蚀刻去除蚀刻阻挡层的一部分和光接收单元的缓冲氧化物层,并且暴露光的半导体表面 接收单元通过湿蚀刻。
    • 6. 发明申请
    • Method for synchronizing use information of mobile communication terminal and system implementing the same
    • 用于同步移动通信终端的使用信息的方法及其实现的系统
    • US20060172751A1
    • 2006-08-03
    • US11232865
    • 2005-09-23
    • Ho-Sung SonKi-Cheon Han
    • Ho-Sung SonKi-Cheon Han
    • H04B7/005
    • H04M1/7253H04M2250/02
    • A method for synchronizing use Information of a mobile communication terminal and a system are provided. In system and method, for synchronizing use information between a first mobile communication terminal and a second mobile communication terminal including short-range wireless communication units includes requesting connection for use information synchronization to the second mobile communication terminal by the first mobile communication terminal, if a response signal to the connection request is received from the second mobile communication terminal, transmitting use information of the first mobile communication terminal to the second mobile communication terminal, and updating by the second mobile communication terminal use information of the second mobile communication terminal using the transmitted use information of the first mobile communication terminal.
    • 提供一种用于同步使用移动通信终端和系统的方法。 在系统和方法中,为了在包括短距离无线通信单元的第一移动通信终端和第二移动通信终端之间同步使用信息,包括由第一移动通信终端请求与第二移动通信终端的使用信息同步的连接,如果 从第二移动通信终端接收到对连接请求的响应信号,向第二移动通信终端发送第一移动通信终端的使用信息,并且由第二移动通信终端更新使用所发送的第二移动通信终端的第二移动通信终端的使用信息 使用第一移动通信终端的信息。
    • 8. 发明授权
    • Photodiode and method of manufacturing the same
    • 光电二极管及其制造方法
    • US07476598B2
    • 2009-01-13
    • US11670457
    • 2007-02-02
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • Ho-Sung SonSung-Ryoul BaeDong-Kyun Nam
    • H01L21/20
    • H01L31/105H01L31/02168Y02E10/50
    • A photodiode and a method of manufacturing the photodiode are provided. The method includes forming a diode junction structure including a light receiving unit and an electrode unit on a semiconductor substrate, forming a buffer oxide layer and an etching blocking layer on the junction structure, forming an interlayer insulating layer and an intermetal insulating layer and an interconnecting structure, exposing the etching blocking layer by etching the intermetal insulating layer and the interlayer insulating layer, removing a portion of the etching blocking layer and the buffer oxide layer of the light-receiving unit by dry etching, and exposing a semiconductor surface of the light-receiving unit by wet etching.
    • 提供光电二极管和制造光电二极管的方法。 该方法包括在半导体衬底上形成包括光接收单元和电极单元的二极管结结构,在接合结构上形成缓冲氧化物层和蚀刻阻挡层,形成层间绝缘层和金属间绝缘层和互连 通过蚀刻金属间绝缘层和层间绝缘层来暴露蚀刻阻挡层,通过干法蚀刻去除蚀刻阻挡层的一部分和光接收单元的缓冲氧化物层,并且暴露光的半导体表面 接收单元通过湿蚀刻。