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1. 发明授权

US08597459B2 Conductive paste and method for manufacturing multilayer printed wiring board using the same 有权
标题翻译：导电浆料和使用其制造多层印刷线路板的方法
公开(公告)号：US08597459B2
公开(公告)日：2013-12-03
申请号：US11664393
申请日：2005-09-26
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： B29C65/00 , B32B37/00
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394
摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.
摘要翻译：提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。此外，提供了一种使用导电浆料制造多层印刷线路板的方法。含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。另外，使用该导电性糊料的多层印刷电路板的制造方法。

2. 发明授权

US08617688B2 Conductive paste and multilayer printed wiring board using the same 失效
公开(公告)号：US08617688B2
公开(公告)日：2013-12-31
申请号：US11663450
申请日：2006-05-18
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： B32B3/24 , H05K3/40 , H01B1/24
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394 , Y10T428/24322 , Y10T428/24339
摘要： The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 μm or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

3. 发明申请

US20090220738A1 Conductive paste and multilayer printed wiring board using the same 失效
标题翻译：导电膏和使用其的多层印刷线路板
公开(公告)号：US20090220738A1
公开(公告)日：2009-09-03
申请号：US11663450
申请日：2006-05-18
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： H05K3/00 , H01B1/22
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394 , Y10T428/24322 , Y10T428/24339
摘要： The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 μm or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.
摘要翻译：本发明提供一种包含99％累积粒径为25μm以下的片状导电性填料和作为必需成分的粘合剂树脂的导电性糊剂。片状导电填料是具有银 - 铜合金表面层的金属颗粒。根据本发明的导电膏在通过加热和加压的连接期间与要连接的导电浆的铜箔电路的一部分熔合，并且在通孔中具有高导电性和高填充率。因此，根据本发明的导电膏提供了具有高连接可靠性和优异的层间连接的多层印刷线路板。

4. 发明申请

US20080099121A1 Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same 有权
标题翻译：导电糊和使用该多层印刷线路板的制造方法
公开(公告)号：US20080099121A1
公开(公告)日：2008-05-01
申请号：US11664393
申请日：2005-09-26
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： H01B1/00 , H01B13/00 , H05K3/22
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394
摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.
摘要翻译：提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。此外，提供了一种使用导电浆料制造多层印刷线路板的方法。含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。另外，使用该导电性糊料的多层印刷电路板的制造方法。

5. 发明授权

US07012111B2 High-specific-gravity EPDM composition, dynamic damper made from the composition, tennis racket with the dynamic damper, and radiation-shielding material comprising the composition 有权
标题翻译：高比重EPDM组合物，由组合物制成的动态阻尼器，具有动态阻尼器的网球拍和包含组合物的辐射屏蔽材料
公开(公告)号：US07012111B2
公开(公告)日：2006-03-14
申请号：US10250305
申请日：2002-06-17
申请人： Yumi Kanemitsu , Toshiaki Sakaki , Tetsuo Mizoguchi , Toshihiko Takiguchi , Hitoshi Takii , Toshinori Sakamaki , Noboru Uenishi , Shinji Kikuhara
发明人： Yumi Kanemitsu , Toshiaki Sakaki , Tetsuo Mizoguchi , Toshihiko Takiguchi , Hitoshi Takii , Toshinori Sakamaki , Noboru Uenishi , Shinji Kikuhara
IPC分类号： C08K3/08 , C08K3/10 , C08K3/22 , A63B49/02
CPC分类号： C08K3/08 , A63B49/02 , A63B49/10 , A63B60/42 , A63B60/54 , A63B2049/0203 , A63B2049/0204 , A63B2049/0207 , A63B2049/0217 , A63B2060/002 , C08K5/005 , C08K2003/0887 , C08L23/16 , C08L23/00 , C08L2666/02
摘要： A high specific-gravity EPDM composition consisting of a mixture of EPDM containing diene at less than 4.5 wt % and ethylene at not less than 58 wt % nor more than 80 wt % and having a Mooney viscosity ML1+4 not less than 50 nor more than 170 at 125° C. and a powdery material, containing powder whose specific gravity is not less than 12 as a main component thereof, added to the EPDM at not less than 80 wt % nor more than 97.5 wt % of a whole amount of the high specific-gravity EPDM composition.
摘要翻译：由比例小于4.5重量％的含EPDM的二烯烃和不少于58重量％但不大于80重量％的乙烯和门尼粘度ML 1 + 4的混合物组成的高比重EPDM组合物，在125℃下不低于50，不超过170，并且以不小于80重量％或更多的比例将以比重不小于12的粉末作为主要成分的粉末材料加入到EPDM中 97.5重量％的高比重EPDM组合物。

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