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1. 发明申请

US20130213801A1 SINTERED BODY, SPUTTERING TARGET AND MOLDING DIE, AND PROCESS FOR PRODUCING SINTERED BODY EMPLOYING THE SAME 审中-公开
公开(公告)号：US20130213801A1
公开(公告)日：2013-08-22
申请号：US13846094
申请日：2013-03-18
申请人： Kenichi ITOH , Masami MESUDA , Hitoshi NAGAYAMA , Tetsuo SHIBUTAMI , Shunsuke YATSUNAMI
发明人： Kenichi ITOH , Masami MESUDA , Hitoshi NAGAYAMA , Tetsuo SHIBUTAMI , Shunsuke YATSUNAMI
IPC分类号： C23C14/34
CPC分类号： C23C14/3414 , B22F2998/00 , B22F2998/10 , B28B3/003 , B28B7/0097 , B30B15/024 , C04B35/453 , C04B35/457 , C04B35/4682 , C04B35/47 , C04B2235/3213 , C04B2235/3217 , C04B2235/3284 , C04B2235/3286 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/721 , C04B2235/77 , C23C14/086 , H01J37/3426 , Y10T428/266 , B22F5/007 , B22F3/04 , B22F3/10
摘要： Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.

2. 发明授权

US07147541B2 Thickness control method and double side polisher 失效
标题翻译：厚度控制方法和双面抛光机
公开(公告)号：US07147541B2
公开(公告)日：2006-12-12
申请号：US11359397
申请日：2006-02-23
申请人： Hitoshi Nagayama , Yusuke Inoue
发明人： Hitoshi Nagayama , Yusuke Inoue
IPC分类号： B24B49/00
CPC分类号： B24B37/08 , B24B41/067 , B24B49/02 , B24B49/10
摘要： The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.
摘要翻译：本发明的目的是提供一种能够在不受抛光垫的厚度的逐渐变化的影响的情况下长时间地保持厚度控制精度的双面抛光机和厚度控制方法。基于研磨持续时间完成第一研磨操作，并且基于测量的距离传感器的距离值完成第二次和随后的抛光操作，并且在包括第一抛光的每次抛光操作之后，距离传感器的测量值基于工件的精加工厚度的测量值和目标值进行校准。由于对每次研磨操作进行校准，因此能够长时间保持厚度控制精度。

3. 发明申请

US20060194511A1 Thickness control method and double side polisher 失效
公开(公告)号：US20060194511A1
公开(公告)日：2006-08-31
申请号：US11359397
申请日：2006-02-23
申请人： Hitoshi Nagayama , Yusuke Inoue
发明人： Hitoshi Nagayama , Yusuke Inoue
IPC分类号： B24B51/00
CPC分类号： B24B37/08 , B24B41/067 , B24B49/02 , B24B49/10
摘要： The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.

4. 发明授权

US6116997A Single side work polishing apparatus 失效
标题翻译：单面抛光装置
公开(公告)号：US6116997A
公开(公告)日：2000-09-12
申请号：US285342
申请日：1999-04-02
申请人： Shunji Hakomori , Hitoshi Nagayama
发明人： Shunji Hakomori , Hitoshi Nagayama
IPC分类号： B24B49/16 , B24B53/007 , B24B53/017 , B24D5/02 , B24B21/18
CPC分类号： B24B53/017 , B24B49/16 , B24D5/02
摘要： A single side work polishing apparatus rectifies the surface geometry of a polishing pad during the polishing of a work. A correction roller is mounted to a pressure member that pushes a work against a polishing pad held by a rotating surface plate. The correction roller has a length substantially equivalent to the width of the working area of the polishing pad and is arranged along the radial direction of the surface plate. During polishing, the work and the correction roller are pressed against the polishing pad by the pressure member. The correction roller rotates about its longitudinal axis to rectify the polishing pad while the work is being polished.
摘要翻译：单面抛光装置在抛光工件期间对抛光垫的表面几何形状进行整流。校正辊被安装到压力构件上，该压力构件将工件抵靠由旋转平板固定的抛光垫。校正辊的长度基本上等于抛光垫的工作区域的宽度，并且沿着表面板的径向布置。在抛光期间，工件和校正辊被压力构件压在抛光垫上。校正辊围绕其纵向轴线旋转以在抛光工件时对抛光垫进行矫正。

5. 发明授权

US6039638A Work planarizing method and apparatus 失效
标题翻译：工作平面化方法和装置
公开(公告)号：US6039638A
公开(公告)日：2000-03-21
申请号：US17010
申请日：1998-02-02
申请人： Hitoshi Nagayama , Motoi Nezu
发明人： Hitoshi Nagayama , Motoi Nezu
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B5/00
CPC分类号： B24B37/102 , B24B37/30 , B24B41/06
摘要： A method and apparatus for planarizing works can adjust an urging force or pressure applied to a work with ease in a short period of time, but also avoid wasteful use of rings. Wafers 100 adhered to a block 110 is made into contact with a lower surface plate 1. An annular ring 5 which encloses the wafers 100 is disposed in the peripheral portion of the block 110. The peripheral portion of the block 110 is pressed by a head 4 through an annular ring 5. Simultaneous with this, by rotating the lower surface plate 1 while pressing the central portion of the block 110 at a desired pressure by means of a center-pressing member 6 provided on the head 4, the wafers 100 are planarized. Preferably, the center-pressing member 6 includes a pressure chamber 7 formed in the central portion of the head 4, a pressing plate 8 mounted in an opening of the pressure chamber 7 for movement relative thereto so that it can project from the opening to thereby press the central portion of the block 110, and an air pump 9 for controlling the air pressure in the pressure chamber 7.
摘要翻译：用于平坦化工作的方法和装置可以在短时间内容易地调节施加到工件上的推动力或压力，而且还避免浪费使用环。与块体110粘附的晶片100与下表面板1接触。封闭晶片100的环形环5设置在块110的周边部分中。块110的周边部分被头部与此同时，通过旋转下表面板1，同时通过设置在头部4上的中心按压构件6，在期望的压力下按压块110的中心部分，晶片100是平面化优选地，中心按压部件6包括形成在头部4的中心部分的压力室7，安装在压力室7的开口中以相对于其移动的压板8，使得其能够从开口突出按压块110的中心部分，以及用于控制压力室7中的空气压力的空气泵9。

6. 发明申请

US20090111067A1 High toughness translucent alumina sintered body, method for producing the same, and its uses 有权
标题翻译：高韧性半透明氧化铝烧结体及其制造方法及其用途
公开(公告)号：US20090111067A1
公开(公告)日：2009-04-30
申请号：US12289425
申请日：2008-10-28
申请人： Koji Tsukuma , Isao Yamashita , Hitoshi Nagayama
发明人： Koji Tsukuma , Isao Yamashita , Hitoshi Nagayama
IPC分类号： A61C7/14 , C01F7/02 , C04B35/03 , C04B35/14 , C04B35/18 , B28B1/00
CPC分类号： C04B35/115 , A61C13/0003 , C04B35/6455 , C04B2235/32 , C04B2235/3201 , C04B2235/3205 , C04B2235/3206 , C04B2235/3208 , C04B2235/3287 , C04B2235/3409 , C04B2235/3418 , C04B2235/3427 , C04B2235/447 , C04B2235/5409 , C04B2235/5436 , C04B2235/6021 , C04B2235/656 , C04B2235/661 , C04B2235/72 , C04B2235/77 , C04B2235/786 , C04B2235/787 , C04B2235/788 , C04B2235/95 , C04B2235/96
摘要： In the conventional alumina sintered bodies, a sintered body having high flexural strength, high toughness and high translucency in combination is not obtained, and a translucent alumina sintered body suitable for a dental material requiring both strength and sensuousness was not obtained. A translucent alumina sintered body having fracture toughness of 4.5 MPa·m0.5 or more, flexural strength of 350 MPa or more, and all light transmittance (sample thickness: 1 mm) to a visible light having a wavelength of 600 nm, of 60% or more is provided. The sintered body wherein sintered crystal grains are slender plate-like and/or columnar shape having an average aspect ratio of 1.5 or more and an average long axis length of 15 μm or less is preferred.
摘要翻译：在常规氧化铝烧结体中，不能获得具有高弯曲强度，高韧性和高半透明度的组合的烧结体，并且不能获得适合于要求强度和感觉性的牙科材料的半透明氧化铝烧结体。断裂韧性为4.5MPa.m0.5以上，弯曲强度为350MPa以上，透光率（样品厚度：1mm）与透过率为600nm的可见光的透光性的氧化铝烧结体为60 提供％以上。烧结体的平均长宽比为1.5以上，平均长轴长度为15μm以下的烧结晶粒是细长的板状和/或柱状。

7. 发明授权

US08419400B2 Sintered body, sputtering target and molding die, and process for producing sintered body employing the same 有权
标题翻译：烧结体，溅射靶和成型模，以及使用该烧结体的烧结体的制造方法
公开(公告)号：US08419400B2
公开(公告)日：2013-04-16
申请号：US11815163
申请日：2006-01-27
申请人： Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
发明人： Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
IPC分类号： B29C43/32
CPC分类号： C23C14/3414 , B22F2998/00 , B22F2998/10 , B28B3/003 , B28B7/0097 , B30B15/024 , C04B35/453 , C04B35/457 , C04B35/4682 , C04B35/47 , C04B2235/3213 , C04B2235/3217 , C04B2235/3284 , C04B2235/3286 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/721 , C04B2235/77 , C23C14/086 , H01J37/3426 , Y10T428/266 , B22F5/007 , B22F3/04 , B22F3/10
摘要： Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
摘要翻译：提供一种包括用于制造烧结体的成型模具的装置。成形模具构造成用于冷等静压，并且包括由多个框架构件构成的击倒模架，以及设置成与击倒模架相接触的底板。上冲头设置成能够沿着击倒模架的内表面移动。所述框架构件被构造成相对于彼此可移动以适应在压制完成之后在降低压力时发生的生坯的膨胀。

8. 发明授权

US07888279B2 High toughness translucent alumina sintered body, method for producing the same, and its uses 有权
标题翻译：高韧性半透明氧化铝烧结体及其制造方法及其用途
公开(公告)号：US07888279B2
公开(公告)日：2011-02-15
申请号：US12289425
申请日：2008-10-28
申请人： Koji Tsukuma , Isao Yamashita , Hitoshi Nagayama
发明人： Koji Tsukuma , Isao Yamashita , Hitoshi Nagayama
IPC分类号： C04B35/115
CPC分类号： C04B35/115 , A61C13/0003 , C04B35/6455 , C04B2235/32 , C04B2235/3201 , C04B2235/3205 , C04B2235/3206 , C04B2235/3208 , C04B2235/3287 , C04B2235/3409 , C04B2235/3418 , C04B2235/3427 , C04B2235/447 , C04B2235/5409 , C04B2235/5436 , C04B2235/6021 , C04B2235/656 , C04B2235/661 , C04B2235/72 , C04B2235/77 , C04B2235/786 , C04B2235/787 , C04B2235/788 , C04B2235/95 , C04B2235/96
摘要： In the conventional alumina sintered bodies, a sintered body having high flexural strength, high toughness and high translucency in combination is not obtained, and a translucent alumina sintered body suitable for a dental material requiring both strength and sensuousness was not obtained. A translucent alumina sintered body having fracture toughness of 4.5 MPa·m0.5 or more, flexural strength of 350 MPa or more, and all light transmittance (sample thickness: 1 mm) to a visible light having a wavelength of 600 nm, of 60% or more is provided. The sintered body wherein sintered crystal grains are slender plate-like and/or columnar shape having an average aspect ratio of 1.5 or more and an average long axis length of 15 μm or less is preferred.
摘要翻译：在常规氧化铝烧结体中，不能获得具有高弯曲强度，高韧性和高半透明度的组合的烧结体，并且不能获得适合于要求强度和感觉性的牙科材料的半透明氧化铝烧结体。断裂韧性为4.5MPa·m0.5以上，弯曲强度为350MPa以上，透光率（样品厚度：1mm）与透过率为600nm的可见光的透光性的氧化铝烧结体为60 提供％以上。烧结体的平均长宽比为1.5以上，平均长轴长度为15μm以下的烧结晶粒是细长的板状和/或柱状。

9. 发明申请

US20150368791A1 SINTERED BODY, SPUTTERING TARGET AND MOLDING DIE, AND PROCESS FOR PRODUCING SINTERED BODY EMPLOYING THE SAME 审中-公开
标题翻译：烧结体，溅射目标和成型模具，以及生产使用其的烧结体的方法
公开(公告)号：US20150368791A1
公开(公告)日：2015-12-24
申请号：US14805107
申请日：2015-07-21
申请人： Kenichi ITOH , Masami MESUDA , Hitoshi NAGAYAMA , Tetsuo SHIBUTAMI , Shunsuke YATSUNAMI
发明人： Kenichi ITOH , Masami MESUDA , Hitoshi NAGAYAMA , Tetsuo SHIBUTAMI , Shunsuke YATSUNAMI
IPC分类号： C23C14/34 , C04B35/457 , B28B7/00 , H01J37/34
CPC分类号： C23C14/3414 , B22F2998/00 , B22F2998/10 , B28B3/003 , B28B7/0097 , B30B15/024 , C04B35/453 , C04B35/457 , C04B35/4682 , C04B35/47 , C04B2235/3213 , C04B2235/3217 , C04B2235/3284 , C04B2235/3286 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/721 , C04B2235/77 , C23C14/086 , H01J37/3426 , Y10T428/266 , B22F5/007 , B22F3/04 , B22F3/10
摘要： Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
摘要翻译：提供一种包括用于制造烧结体的成型模具的装置。成形模具构造成用于冷等静压，并且包括由多个框架构件构成的击倒模架，以及设置成与击倒模架相接触的底板。上冲头设置成能够沿着击倒模架的内表面移动。所述框架构件被构造成相对于彼此可移动以适应在压制完成之后在降低压力时发生的生坯的膨胀。

10. 发明申请

US20080274351A1 Sintered Body, Sputtering Target and Molding Die, and Process for Producing Sintered Body Employing the Same 有权
标题翻译：烧结体，溅射靶和成型模，以及使用该烧结体的烧结体的制造方法
公开(公告)号：US20080274351A1
公开(公告)日：2008-11-06
申请号：US11815163
申请日：2006-01-27
申请人： Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
发明人： Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
IPC分类号： C04B38/06
CPC分类号： C23C14/3414 , B22F2998/00 , B22F2998/10 , B28B3/003 , B28B7/0097 , B30B15/024 , C04B35/453 , C04B35/457 , C04B35/4682 , C04B35/47 , C04B2235/3213 , C04B2235/3217 , C04B2235/3284 , C04B2235/3286 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/721 , C04B2235/77 , C23C14/086 , H01J37/3426 , Y10T428/266 , B22F5/007 , B22F3/04 , B22F3/10
摘要： To provide a large sputtering target excellent in discharge characteristics during sputtering and in characteristics of a thin film thereby obtainable. Further, a process for producing a sintered body is provided, whereby a large green body excellent in shape accuracy can be obtained by means of cold isostatic pressing directly without preforming, and a sintered body capable of providing the above-mentioned excellent sputtering target, can be produced efficiently at a low cost.The sputtering target is produced by using a sintered body having the content of carbon contained as an impurity reduced to less than 0.005 wt %. Such a sintered body is obtainable by molding a raw material powder by cold isostatic pressing directly without adding a binder containing an organic substance or a molding aid, followed by firing. Further, it becomes possible to produce such a sintered body by using a molding die having such a construction that at the time of pressure compression, pressing is applied to a filled raw material powder only in a substantially uniaxial direction, and at the time of reducing the pressure after the completion of pressing, the pressure can be released substantially isotropically with respect to the green body. Further, a large target having the thickness of an erosion region made thick, can be easily produced in good yield, and efficiency in the use of the target can be improved.
摘要翻译：提供溅射时放电特性优异的溅射靶和由此得到的薄膜特性。此外，提供一种制造烧结体的方法，由此通过直接进行预均匀的冷等静压，可以获得形状精度优异的大型生坯，并且能够提供上述优异的溅射靶的烧结体以低成本高效生产。通过使用具有作为杂质的含有量的碳含量降低至小于0.005重量％的烧结体来制造溅射靶。这样的烧结体可以通过直接通过冷等静压成型原料粉末而不添加含有有机物的粘合剂或成型助剂，然后进行烧成而获得。此外，通过使用具有这样的结构的成型模具，可以制造这样的烧结体，该成型模具在压缩压缩时仅在基本上单轴方向上对填充的原料粉末施加压力，并且在还原时压制完成后的压力，可以相对于生坯基本上各向同性地释放压力。此外，可以容易地以良好的产率制造具有厚的侵蚀区域的厚度的大的靶，并且可以提高靶的使用效率。

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