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    • 1. 发明专利
    • Plasma spraying device
    • 等离子体喷涂装置
    • JP2012193431A
    • 2012-10-11
    • JP2011059407
    • 2011-03-17
    • Hiroyuki ShimadaMasakatsu Umagome普行 島田正勝 馬込
    • SHIMADA HIROYUKIUMAGOME MASAKATSU
    • C23C4/12
    • PROBLEM TO BE SOLVED: To provide a plasma spraying device in which conductive wire of metal or the like and the powder of ceramic or the like can be used as a thermal spraying material.SOLUTION: In the plasma spraying device, a plurality of jackets 11, 15, 19 having release ports 11a, 15a, 19a are continuously connected to the surface of the shaft in a cathode nozzle 3 having a cathode 2 in series via insulating materials 4, 12, 16; the jacket 19 at the top is used as a conductive wire spraying jacket to be fed with conductive wire of metal or the like; the other jackets are used as jackets for powder spraying; and the jackets for powder spraying and the jacket for conductive wire spraying are connected detachably, and further, while a powder feeding means 28 of feeding the powder of ceramics or the like is provided.
    • 要解决的问题:提供一种等离子喷涂装置,其中可以使用金属等的导线和陶瓷等的粉末作为热喷涂材料。 解决方案:在等离子体喷涂装置中,具有释放口11a,15a,19a的多个夹套11,15,19在阴极喷嘴3中连续地连接到轴的表面,阴极喷嘴3通过绝缘体串联连接阴极2 材料4,12,16; 顶部的护套19用作导电金属线喷涂护套,以供给金属等的导线; 其他夹克用作粉末喷涂夹套; 并且用于粉末喷涂的夹套和用于导电丝喷涂的护套可拆卸地连接,并且还提供了馈送陶瓷粉末等的粉末供给装置28。 版权所有(C)2013,JPO&INPIT