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    • 4. 发明授权
    • Aluminum electroplating solution and method for forming aluminum plating film
    • 铝电镀液及镀铝方法
    • US09068270B2
    • 2015-06-30
    • US13123760
    • 2009-07-31
    • Hiroyuki HoshiAtsushi Okamoto
    • Hiroyuki HoshiAtsushi Okamoto
    • C25D3/66C25D3/56C25D3/00C25D3/44
    • C25D3/665C25D3/44C25D3/66
    • An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.
    • 本发明的目的在于提供一种使铝电镀工艺长时间稳定地实施的延长寿命的电镀液,以及使用其的形成铝电镀膜的方法。 根据本发明的铝电镀溶液的特征在于,相对于铝卤化物,摩尔比为1/15至1/4的氯化铵为1.5至4.0摩尔的铝卤化物,相对于10.0摩尔二甲基砜, 摩尔比为1/15至1/2的四烷基氯化铵。 电镀液具有提高的导电性,因此具有的另外的优点在于,即使通过桶法进行电镀处理,也能够在待镀的基板上形成均匀的铝电镀膜。