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    • 3. 发明授权
    • Method of manufacturing an ink jet print head
    • 制造喷墨打印头的方法
    • US08272130B2
    • 2012-09-25
    • US12472889
    • 2009-05-27
    • Hirotaka Miyazaki
    • Hirotaka Miyazaki
    • B21D53/76H05B3/03
    • B41J2/1623B29C65/1406B29C65/1412B29C65/4835B29C65/5057B29C66/53461B29C66/9672B29C2035/0827B29K2083/00B29L2031/767B41J2002/14362B41J2202/22Y10T29/49083Y10T29/49133Y10T29/49401Y10T156/10
    • A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.
    • 提供一种能够在缩短的时间内以高精度将打印元件基板粘合到支撑面上的喷墨打印头的制造方法。 为此,在支撑构件的支撑表面中形成凸起的平坦部分,以在印刷元件基板和支撑构件之间的粘合剂层中提供比其它粘合剂更薄的一部分热固性粘合剂。 在调整印刷元件基板和支撑部件的相对位置之后,粘合剂层的薄部分变硬。 这使得印刷元件基板能够在相当短的时间内粘合到支撑构件上。 结果,如果在支撑面上存在起伏,则印刷元件基板能够以高精度粘合到支撑构件上,从而提高了打印头的批量生产率。
    • 6. 发明申请
    • PRINTING ELEMENT SUBSTRATE SUPPORTING MEMBER, MANUFACTURE METHOD OF PRINTING ELEMENT SUBSTRATE SUPPORTING MEMBER, AND INK JET PRINTING HEAD
    • 印刷元件基板支撑构件,打印元件底板支撑构件的制造方法和喷墨打印头
    • US20080136870A1
    • 2008-06-12
    • US11951450
    • 2007-12-06
    • Hirotaka Miyazaki
    • Hirotaka Miyazaki
    • B23P17/00
    • B41J2/15B41J2002/14362
    • It is an objective of the present invention to provide a printing element substrate supporting member made of resin material by which, without changing the inclusion rate of filler in the resin material, the linear expansion coefficient can be reduced, the deformation under a heating environment can be suppressed, and the printing element substrate can be suppressed from being peeled or broken. Thus, the printing element substrate supporting member of the present invention is formed by resin material including fibrous filler and has a supporting section for supporting a printing element substrate in which ejecting orifices capable of ejecting ink are arranged. This supporting section is structured so that the filler is oriented along the direction along which the plurality of ejecting orifices are arranged.
    • 本发明的目的是提供一种由树脂材料制成的印刷元件基板支撑部件,通过该印刷元件基板支撑部件不改变树脂材料中的填料的包合率,可以减小线膨胀系数,加热环境下的变形可以 可以抑制印刷基板的剥离或破损。 因此,本发明的印刷元件基板支撑部件由包括纤维填料的树脂材料形成,并且具有用于支撑印刷元件基板的支撑部分,其中布置有能够喷射墨水的喷射口。 该支撑部构造成使得填料沿着多个喷射孔排列的方向定向。
    • 10. 发明授权
    • Liquid ejection head
    • 液体喷头
    • US08562109B2
    • 2013-10-22
    • US13398225
    • 2012-02-16
    • Hirotaka MiyazakiToshiaki Kaneko
    • Hirotaka MiyazakiToshiaki Kaneko
    • B41J2/21
    • B41J2/14024B41J2/14072
    • A liquid ejection head includes a recording element substrate having a member with a liquid ejection orifice, and a substrate having an energy-generating element for ejecting the liquid; a wiring substrate including wirings connected to terminals that are formed along an end portion side of a surface of the substrate where the element is formed and are electrically connected to the element; and a support member including a support supporting the recording element substrate through adhesive, a groove formed along the support and a wiring support supporting the wiring substrate. A sealing material is applied to a connection portion between the terminals and wirings and is applied to a bottom surface of the groove formed on an end portion side of the surface where no terminal is formed. A part of a side of the substrate corresponding to the end portion side is exposed without being covered with the sealing material.
    • 液体喷射头包括具有液体喷射孔的构件的记录元件基板和具有用于喷射液体的能量产生元件的基板; 布线基板,包括连接到端子的布线,端子沿着形成有元件的基板的表面的端部侧形成并且与元件电连接; 以及支撑构件,其包括通过粘合剂支撑记录元件基板的支撑件,沿着支撑件形成的凹槽和支撑布线基板的布线支撑件。 将密封材料施加到端子和布线之间的连接部分,并施加到形成在不形成端子的表面的端部侧的槽的底表面上。 对应于端部侧的基板的一部分被暴露而不被密封材料覆盖。