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1. 发明申请

US20110278362A1 WIRELESS IC DEVICE 有权
标题翻译：无线IC器件
公开(公告)号：US20110278362A1
公开(公告)日：2011-11-17
申请号：US13099392
申请日：2011-05-03
申请人： Yuya DOKAI , Nihei KAISHITA , Hiroshi NONOGAKI , Ryohei GOTO , Takahiro YAMAGUCHI , Kazuyuki IKEDA
发明人： Yuya DOKAI , Nihei KAISHITA , Hiroshi NONOGAKI , Ryohei GOTO , Takahiro YAMAGUCHI , Kazuyuki IKEDA
IPC分类号： G06K19/077
CPC分类号： H01Q1/2283 , G06K19/07749 , H01Q1/38
摘要： A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.
摘要翻译：无线IC器件包括介电体，设置在电介质体的表面上并限定散热器的金属图案，以及耦合到金属图案的馈电部分的无线IC元件。在电介质体的至少一个表面上设置多个狭缝，以提供电介质体的柔性。

2. 发明授权

US09123996B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US09123996B2
公开(公告)日：2015-09-01
申请号：US13088480
申请日：2011-04-18
申请人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
发明人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
IPC分类号： H01Q1/38 , H01Q1/22 , H01Q7/00
CPC分类号： H01Q1/38 , H01Q1/2225 , H01Q7/00
摘要： A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.
摘要翻译：无线IC器件包括基本上为长方体的电介体，金属图案，其通过膜设置在电介质体的表面上并用作散热器，以及耦合到金属图案的馈电部分的无线IC元件。电介质体具有包括折叠的柔性介电层的叠层结构。在电介质层折叠之后彼此面对的电介质层的表面是非接合表面。

3. 发明授权

US6165393A Production method of dielectric lens 失效
标题翻译：介质透镜的制作方法
公开(公告)号：US6165393A
公开(公告)日：2000-12-26
申请号：US369171
申请日：1999-08-05
申请人： Hiroshi Nonogaki , Keizo Yamamoto , Tatsuhiro Nakamura
发明人： Hiroshi Nonogaki , Keizo Yamamoto , Tatsuhiro Nakamura
IPC分类号： G02B3/00 , B29C45/16 , B29C45/26 , B29C45/56 , B29D11/00 , B29L11/00 , G02B7/02 , H01Q15/08
CPC分类号： B29D11/00009 , B29C45/16 , B29L2011/0016 , G02B7/022
摘要： The present invention is for providing a production method of a dielectric lens with the excellent productivity, capable of achieving the shape accuracy or density homogeneity of the demanded level, and capable of injection molding of a matching layer without forming a gap with respect to a lens main body. A lens main body is formed by the injection compression molding method, using a composite dielectric material containing a thermoplastic resin as the dielectric material for the lens main body. After forming a matching layer (first surface side matching layer) on either surface of the front or rear surfaces (first surface) side of the lens main body, and injecting a matching layer material, a matching layer (second surface side matching layer) is formed on the other surface of the lens main body (that is, the matching layer is formed by the two operation injection molding method of injecting to one surface side of the lens main body, and then injection to the other surface side).
摘要翻译：本发明是为了提供具有优异生产率的电介质透镜的制造方法，其能够实现所需要的水平的形状精度或密度均一性，并且能够相对于透镜形成间隙而能够注射成型匹配层主体。通过注射压缩成型方法，使用包含热塑性树脂的复合电介质材料作为透镜主体的电介质材料来形成透镜主体。在透镜主体的前表面或后表面（第一表面）侧的任一表面上形成匹配层（第一表面侧匹配层）并注入匹配层材料之后，匹配层（第二表面侧匹配层）为形成在透镜主体的另一个表面上（即，通过注入到透镜主体的一个表面侧，然后向另一个表面侧注入的两种操作注射成型方法形成匹配层）。

4. 发明申请

US20110279326A1 WIRELESS IC DEVICE 有权
标题翻译：无线IC器件
公开(公告)号：US20110279326A1
公开(公告)日：2011-11-17
申请号：US13088480
申请日：2011-04-18
申请人： Yuya DOKAI , Nihei KAISHITA , Hiroshi NONOGAKI , Ryohei GOTO , Takahiro YAMAGUCHI , Kazuyuki IKEDA
发明人： Yuya DOKAI , Nihei KAISHITA , Hiroshi NONOGAKI , Ryohei GOTO , Takahiro YAMAGUCHI , Kazuyuki IKEDA
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/2225 , H01Q7/00
摘要： A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.
摘要翻译：无线IC器件包括基本上为长方体的电介体，金属图案，其通过膜设置在电介质体的表面上并用作散热器，以及耦合到金属图案的馈电部分的无线IC元件。电介质体具有包括折叠的柔性介电层的叠层结构。在电介质层折叠之后彼此面对的电介质层的表面是非接合表面。

5. 发明授权

US06592788B1 Method of manufacturing a dielectric lens for an antenna 失效
标题翻译：制造天线用介质透镜的方法
公开(公告)号：US06592788B1
公开(公告)日：2003-07-15
申请号：US08691791
申请日：1996-08-02
申请人： Keizo Yamamoto , Hiroshi Nonogaki , Tatsuhiro Nakamura , Yoshitaka Tanino
发明人： Keizo Yamamoto , Hiroshi Nonogaki , Tatsuhiro Nakamura , Yoshitaka Tanino
IPC分类号： B29C4406
CPC分类号： H01Q15/08
摘要： A dielectric lens which is produced by injection molding of an expandable material consisting of a synthetic resin, a foaming agent and a dielectric constant conditioner. The expandable material is injected into a cavity of a foaming mold up to at least about 80 percent by weight and at least about 100 percent by volume of the capacity of the cavity and is foamed at an expansion ratio of not more than about 1.3. During the foam molding, the surface of the foam-molded body is solidified to be a radome layer. Then, the foam-molded body is transferred from the foaming mold to a shaping mold, in which the foam-molded is cooled down naturally. Further, a fitting tab is provided integrally with the foam-molded body at the edge of the radome layer.
摘要翻译：一种介电透镜，其通过注射成型由可合成树脂，发泡剂和介电常数调节剂组成的可膨胀材料制成。可发泡材料被注入到发泡模具的空腔中，其至少占空间容量的大约80重量％和至少大约100体积％，并以不大于约1.3的发泡比发泡。在发泡成型过程中，发泡体的表面被固化为天线罩层。然后，将发泡成型体从发泡模具转移到成形模具中，其中自发地将发泡成型体冷却。此外，在雷达罩层的边缘处与发泡成型体一体地设置有配合突片。

6. 发明授权

US08905316B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US08905316B2
公开(公告)日：2014-12-09
申请号：US13099392
申请日：2011-05-03
申请人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
发明人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
IPC分类号： G06K19/06 , H01Q1/22 , G06K19/077 , H01Q1/38
CPC分类号： H01Q1/2283 , G06K19/07749 , H01Q1/38
摘要： A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.
摘要翻译：无线IC器件包括介电体，设置在电介质体的表面上并限定散热器的金属图案，以及耦合到金属图案的馈电部分的无线IC元件。在电介质体的至少一个表面上设置多个狭缝，以提供电介质体的柔性。

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