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1. 发明授权

US08216378B2 Reaction tube and heat processing apparatus for a semiconductor process 有权
标题翻译：用于半导体工艺的反应管和热处理装置
公开(公告)号：US08216378B2
公开(公告)日：2012-07-10
申请号：US12408977
申请日：2009-03-23
申请人： Hirofumi Kaneko , Hisashi Inoue , Keishi Shionaga , Shingo Hishiya , Atsushi Endoh
发明人： Hirofumi Kaneko , Hisashi Inoue , Keishi Shionaga , Shingo Hishiya , Atsushi Endoh
IPC分类号： C23C16/00
CPC分类号： H01L21/67109
摘要： A reaction tube for a semiconductor process for performing a heat process on a plurality of target objects stacked at intervals under a vacuum state is integrally made of an electrically insulating and heat-resistant material. The reaction tube includes a cylindrical sidewall that has a load port at a lower end for loading and unloading the target objects to and from the reaction tube, and a circular ceiling wall that closes an upper end of the sidewall and has a flat inner surface extending in a direction perpendicular to an axial direction of the sidewall. The ceiling wall has an annular groove formed in a peripheral region of an outer surface along the sidewall.
摘要翻译：用于对在真空状态下间隔堆叠的多个目标物体进行热处理的半导体工艺的反应管由电绝缘和耐热材料一体地形成。反应管包括圆筒形侧壁，其具有位于下端的负载端口，用于将目标物体装载到反应管和从反应管卸载目标物体，以及圆形顶壁，其关闭侧壁的上端并具有平坦的内表面延伸在垂直于侧壁的轴向的方向上。顶壁具有形成在沿侧壁的外表面的周边区域中的环形槽。

2. 发明申请

US20090250005A1 REACTION TUBE AND HEAT PROCESSING APPARATUS FOR A SEMICONDUCTOR PROCESS 有权
标题翻译：用于半导体工艺的反应管和热处理装置
公开(公告)号：US20090250005A1
公开(公告)日：2009-10-08
申请号：US12408977
申请日：2009-03-23
申请人： Hirofumi Kaneko , Hisashi Inoue , Keishi Shionaga , Shingo Hishiya , Atsushi Endoh
发明人： Hirofumi Kaneko , Hisashi Inoue , Keishi Shionaga , Shingo Hishiya , Atsushi Endoh
IPC分类号： C23C16/00
CPC分类号： H01L21/67109
摘要： A reaction tube for a semiconductor process for performing a heat process on a plurality of target objects stacked at intervals under a vacuum state is integrally made of an electrically insulating and heat-resistant material. The reaction tube includes a cylindrical sidewall that has a load port at a lower end for loading and unloading the target objects to and from the reaction tube, and a circular ceiling wall that closes an upper end of the sidewall and has a flat inner surface extending in a direction perpendicular to an axial direction of the sidewall. The ceiling wall has an annular groove formed in a peripheral region of an outer surface along the sidewall.
摘要翻译：用于对在真空状态下间隔堆叠的多个目标物体进行热处理的半导体工艺的反应管由电绝缘和耐热材料一体地形成。反应管包括圆筒形侧壁，其具有位于下端的负载端口，用于将目标物体装载到反应管和从反应管卸载目标物体，以及圆形顶壁，其关闭侧壁的上端并具有平坦的内表面延伸在垂直于侧壁的轴向的方向上。顶壁具有形成在沿侧壁的外表面的周边区域中的环形槽。

3. 发明申请

US20080153049A1 Vertical type heat processing apparatus and vertical type heating method 有权
标题翻译：立式加热装置和立式加热方式
公开(公告)号：US20080153049A1
公开(公告)日：2008-06-26
申请号：US12000678
申请日：2007-12-14
申请人： Hiromi Nitadori , Hirofumi Kaneko
发明人： Hiromi Nitadori , Hirofumi Kaneko
IPC分类号： F27D5/00 , F27D3/12
CPC分类号： F27B17/0025
摘要： The present invention provides a vertical type heat processing apparatus, which can prevent falling-down of a boat placed on a heat insulating mount due to an external force, such as an earthquake, by employing a simple structure, while taking a form of the so-called two-boat system. The vertical-type heat processing apparatus comprises a heating furnace 5 having a furnace port 5a formed at a bottom portion thereof, a cover 17 adapted to close the furnace port 5a, a pair of substrate holding tools 4, each configured to be placed on the cover 17 via a heat insulating mount 19 and adapted to hold multiple substrates W in a multistage fashion, a rotating mechanism 20 provided to the cover 17 and adapted to rotate the substrate holding tool 4, and a lifting mechanism 18 adapted to raise and lower the cover 17 so as to carry in and carry out the substrate holding tool 4 relative to the furnace 5. While one of the substrate holding tools 4 is located in the furnace 5, the other substrate holding tool 4 is paced on a table 22, for loading the substrates. Each substrate holding tool 4 is carried between the table 22 and the heat insulating mount 19 due to a carrier mechanism 23. A locking part 25 and a part 26 to be locked are provided to a bottom portion of each substrate holding tool 4 and an upper portion of the heat insulating mount 19, respectively, such that the locking part 25 and the part 26 to be locked can be engaged with each other, by rotating the heat insulating mount 19 a predetermined angle by the rotating mechanism 20, while the substrate holding tool 4 is held just above the heat insulating mount 19 due to the carrier mechanism 23.
摘要翻译：本发明提供了一种垂直式热处理装置，其可以通过采用简单的结构，防止由于诸如地震的外力而放置在隔热安装座上的船的下落，同时采取这样的形式被称为双船系统。立式热处理装置包括：加热炉5，其底部形成有炉口5a，适于关闭炉口5a的盖17，一对基板保持工具4，通过隔热安装件19在盖17上，并且适于以多级方式保持多个基板W;旋转机构20，设置在盖17上并适于旋转基板保持工具4;以及升降机构18，其适于升高和降下盖子17，以便相对于炉子5携带和执行基板保持工具4.当基板保持工具4中的一个位于炉子5中时，另一个基板保持工具4被放置在工作台22上，用于装载基板。每个基板保持工具4由于承载机构23而被承载在工作台22和隔热安装件19之间。锁定部分25和被锁定的部分26设置在每个基板保持工具4的底部，并且上部绝热安装件19的一部分，使得锁定部25和被锁定的部分26可以通过旋转机构20将隔热安装件19旋转预定角度而彼此接合，同时基板保持由于载体机构23，工具4保持在隔热安装件19的正上方。

4. 外观设计

USD724551S1 Inner tube for process tube for manufacturing semiconductor wafers 有权
标题翻译：用于制造半导体晶片的工艺管的内管
公开(公告)号：USD724551S1
公开(公告)日：2015-03-17
申请号：US29420539
申请日：2012-05-10
申请人： Hirofumi Kaneko , Atsushi Endo
设计人： Hirofumi Kaneko , Atsushi Endo

5. 外观设计

USD619630S1 Process tube for manufacturing semiconductor wafers 有权
公开(公告)号：USD619630S1
公开(公告)日：2010-07-13
申请号：US29290247
申请日：2007-11-08
申请人： Hirofumi Kaneko
设计人： Hirofumi Kaneko

6. 外观设计

USD590359S1 Process tube for manufacturing semiconductor wafers or the like 有权
标题翻译：用于制造半导体晶片等的工艺管
公开(公告)号：USD590359S1
公开(公告)日：2009-04-14
申请号：US29264779
申请日：2006-08-18
申请人： Hirofumi Kaneko
设计人： Hirofumi Kaneko

7. 发明授权

US06168154A Sheet handling device for continually fed sheets which are aligned and moved from first to second storage locations 失效
标题翻译：用于连续供纸的纸张处理装置，其从第一到第二存储位置对准和移动
公开(公告)号：US06168154A
公开(公告)日：2001-01-02
申请号：US09085266
申请日：1998-05-26
申请人： Tsuyoshi Asahara , Hirofumi Kaneko , Kazuaki Sano , Takashi Saito , Hideki Mimura
发明人： Tsuyoshi Asahara , Hirofumi Kaneko , Kazuaki Sano , Takashi Saito , Hideki Mimura
IPC分类号： B65H904
CPC分类号： B65H31/3081 , B42C1/12 , B65H31/34 , B65H2301/42266 , B65H2404/725 , B65H2404/732 , B65H2404/733
摘要： A sheet handling device for accommodating, aligning and storing sheets fed from an image forming apparatus such as a copying machine is provided with front-side and rear-side aligning members for pressing the sheets stacked on a first storage means between the aligning members to stably and exactly align the stacked sheets. The front side aligning member is movable vertically or rotatable to open a sheet transferring passage so as to enable a sheet aligning mechanism in the sheet handling device to be operated in a small space, and thus, made compact. While transferring the aligned sheets from the first storage means to a second storage means, the aligned sheets are stably held by the front-side aligning member being in soft contact with the upper surface of the sheets being transferred.
摘要翻译：用于容纳，对准和存储从诸如复印机的图像形成设备馈送的片材的片材处理装置设置有前侧和后侧对准构件，用于将堆叠在对准构件之间的第一存储装置上的片材稳定地按压并准确对齐堆叠的纸张。前侧对准构件可垂直或可旋转地移动以打开片材传送通道，使得片材处理装置中的片材对准机构能够在较小的空间中操作，从而使其紧凑。在将对准的片材从第一存储装置转移到第二存储装置的同时，由正面对准部件稳定地保持对准的片材与正被转印的片材的上表面软接触。

8. 发明授权

US5957652A Sheet handling apparatus 失效
标题翻译：纸张处理设备
公开(公告)号：US5957652A
公开(公告)日：1999-09-28
申请号：US22389
申请日：1998-02-12
申请人： Hideki Mimura , Kazuyuki Kubota , Takehiko Saito , Hirofumi Kaneko , Tsuyoshi Asahara , Kazuaki Sano
发明人： Hideki Mimura , Kazuyuki Kubota , Takehiko Saito , Hirofumi Kaneko , Tsuyoshi Asahara , Kazuaki Sano
IPC分类号： B42C1/12 , B65H31/32 , B65G57/00 , B65H29/02 , B65H33/04 , B65H39/045
CPC分类号： B42C1/12 , B65H31/32 , B65H2405/32
摘要： A sheet handling apparatus receives a plurality of sheets discharged by a discharge roller pair from an image recording apparatus on a first support member disposed below the discharge roller pair to form a stack of the sheets on the first support member and carries out handling on the stack of sheets. A second support member is supported to be movable back and forth between a projecting position where it is projected over the first support member and is able to support a rear end portion of a sheet discharged by the discharge roller pair with a front end portion of the sheet supported by the first support member and a retracted position where it is retracted from the first support member. A controller controls movement of the second support member.
摘要翻译：片材处理装置从布置在排出辊对下方的第一支撑构件上的图像记录装置接收由排出辊对排出的多个片材，以在第一支撑构件上形成片材的堆叠，并且对堆叠进行处理的床单。第二支撑构件被支撑为可在其突出在第一支撑构件上的突出位置之间来回移动，并且能够支撑由排出辊对排出的片材的后端部分，其中前端部分由第一支撑构件支撑的片材和从第一支撑构件缩回的缩回位置。控制器控制第二支撑构件的运动。

9. 外观设计

USD720309S1 Inner tube for process tube for manufacturing semiconductor wafers 有权
公开(公告)号：USD720309S1
公开(公告)日：2014-12-30
申请号：US29420537
申请日：2012-05-10
申请人： Hirofumi Kaneko , Atsushi Endo
设计人： Hirofumi Kaneko , Atsushi Endo

10. 发明授权

US07798811B2 Vertical type heat processing apparatus and vertical type heating method 有权
标题翻译：立式加热装置和立式加热方式
公开(公告)号：US07798811B2
公开(公告)日：2010-09-21
申请号：US12000678
申请日：2007-12-14
申请人： Hiromi Nitadori , Hirofumi Kaneko
发明人： Hiromi Nitadori , Hirofumi Kaneko
IPC分类号： F27D3/12
CPC分类号： F27B17/0025
摘要： A vertical type heat processing apparatus prevents falling-down of a boat placed on a heat insulating mount due to an external force, such as an earthquake. The apparatus includes a heating furnace having a furnace port, a cover, a pair of substrate holding tools, each to be placed on the cover via a heat insulating mount and to hold multiple substrates, a rotating mechanism, and a lifting mechanism to raise and lower the cover to carry in and carry out the substrate holding tool relative to the furnace. While one of the substrate holding tools is located in the furnace, the other is placed on a table, for loading the substrates. Each substrate holding tool is carried between the table and the heat insulating mount due to a carrier mechanism. Further, a locking part and a part to be locked can be engaged with each other.
摘要翻译：垂直式热处理装置防止由于诸如地震等外力而放置在隔热安装座上的船的落下。该装置包括具有炉口，加热罩，一对基板保持工具的加热炉，每个基板保持工具通过隔热安装座放置在盖上并保持多个基板，旋转机构和提升机构，降低盖子以携带并相对于炉子执行基板固定工具。当基板保持工具中的一个位于炉中时，另一个放置在工作台上，用于装载基板。每个基板保持工具由于载体机构而被承载在工作台和隔热安装座之间。此外，锁定部分和待锁定的部分可以彼此接合。

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