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    • 1. 发明授权
    • Surface mount clip
    • 表面安装夹
    • US09167698B2
    • 2015-10-20
    • US13807480
    • 2011-06-30
    • Kenji KondaTomohisa KuritaHiroki KitanoTatsuya NakamuraHideo Yumi
    • Kenji KondaTomohisa KuritaHiroki KitanoTatsuya NakamuraHideo Yumi
    • H05K1/18H05K9/00F16B5/06F16B21/07
    • H05K1/181F16B5/0635F16B21/073H05K9/0035
    • A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
    • 一种表面安装夹具,包括:焊接部,其下表面为要焊接并焊接在印刷电路板上的导体图案的焊点表面。 一对支撑部分连接到焊接部分,并且当焊接部分被焊接并连接到印刷电路板时,以一对支撑部分之间的间隔被支撑在印刷电路板上方的位置。 间隔允许除了印刷电路板之外的导电构件插入其中。 当导电构件插入在该对支撑部分之间时,弹性接触部分至少连接到一对支撑部件中的一个支撑部件之间弹性变形并被导电部件按压,并将导体图案和 导电构件。
    • 6. 发明授权
    • Sewn material and method for shielding against electromagnetic waves
    • 屏蔽材料和屏蔽电磁波的方法
    • US5569877A
    • 1996-10-29
    • US418493
    • 1995-04-07
    • Hideo Yumi
    • Hideo Yumi
    • D05B1/20H05K9/00
    • H05K9/0015Y10T428/1362
    • A sewn material for shielding against electromagnetic waves is provided without increasing the number of stitch perforations created when sewing electrically conductive threads to a base material. Two electrically conductive threads are sewn on at least one edge of a strip of elastomeric base material in an over-edge chain stitch that extends across the edge surface of the base material. Portions of the threads are partly exposed on the edge surface and other portions of the threads are sewn through the base material, thereby providing dual shield layers for shielding against electromagnetic waves entering from the side of the base material.
    • 提供用于屏蔽电磁波的缝合材料,而不增加在将导电线缝合到基底材料时产生的缝合穿孔的数量。 在穿过基材的边缘表面延伸的超边缘链式线迹中,两根导电线缝合在弹性体基材条上的至少一个边缘上。 螺纹的一部分部分地露出在边缘表面上,并且螺纹的其他部分通过基材缝合,从而提供用于屏蔽从基材侧面进入的电磁波的双重屏蔽层。
    • 8. 发明授权
    • Grounding terminal and mounting structure of the same on a printed circuit board
    • 接地端子及其安装结构在印刷电路板上
    • US06465738B2
    • 2002-10-15
    • US09951785
    • 2001-09-13
    • Hideo Yumi
    • Hideo Yumi
    • H01R400
    • H05K3/341H01R4/64H01R12/57H01R13/24H01R43/0256H05K1/0215H05K2201/09663H05K2201/1031Y02P70/611Y02P70/613Y10T29/49149
    • The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
    • 本发明通过将通过回流焊接将接地端子焊接到印刷电路板的问题与印刷电路板上的接地端子的安装结构相关联,从而实现印刷电路板与接地导体的接地 到印刷电路板的接地端子。 在接地端子的接合部分内形成具有不同表面积的两个接合表面,并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上 的每个接合面。 而且,作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的较小的接合面的规定的距离。
    • 9. 发明授权
    • Grounding terminal and mounting structure of the same on a printed circuit board
    • 接地端子及其安装结构在印刷电路板上
    • US06300579B1
    • 2001-10-09
    • US09301807
    • 1999-04-28
    • Hideo Yumi
    • Hideo Yumi
    • H01R1204
    • H05K3/341H01R4/64H01R12/57H01R13/24H01R43/0256H05K1/0215H05K2201/09663H05K2201/1031Y02P70/611Y02P70/613Y10T29/49149
    • The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
    • 本发明通过将通过回流焊接将接地端子焊接到印刷电路板的问题与印刷电路板上的接地端子的安装结构相关联,从而实现印刷电路板与接地导体的接地 到印刷电路板的接地端子。 在接地端子的接合部分内形成具有不同表面积的两个接合表面,并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上 的每个接合面。 而且,作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的较小的接合面的规定的距离。