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1. 发明授权

US5609959A Carbon substrate and production thereof 失效
标题翻译：碳基板及其制造
公开(公告)号：US5609959A
公开(公告)日：1997-03-11
申请号：US453887
申请日：1995-05-30
申请人： Maki Hamaguchi , Tetsuya Yamamoto , Tetsuo Suzuki , Hideki Yamamuro , Hiroshi Chosokabe
发明人： Maki Hamaguchi , Tetsuya Yamamoto , Tetsuo Suzuki , Hideki Yamamuro , Hiroshi Chosokabe
IPC分类号： C04B35/524 , C01B31/02
CPC分类号： C04B35/524 , Y10T428/30
摘要： A carbon substrate is prepared from a molded article of thermosetting resin by heat-treating in an inert atmosphere. The resin is characterized in that the content of Fe, Al, Ni, Co, Cr, and Mg insoluble in the resin is less than 1 ppm each and the content of Ca and Si insoluble in the resin is less than 2 ppm each. The thermosetting resin is further characterized in that the water content is less than 3 wt % and the ratio of the methylene carbon (CH.sub.2) connected to the hydroxyl group (OH) is less than 3% (based on the total carbon number). The carbon substrate prepared in this manner is almost free of defects and voids. It is suitable for use as the substrate of magnetic recording medium. The thermosetting resin may be a powdery or granular one which fluidizes and then cures on heating. A molded article of thermosetting resin is prepared by introducing the resin melt into a mold and curing it with heating under pressure. It is subsequently heat-treated in an inert atmosphere to give a molded article of glass-like carbon.
摘要翻译：通过在惰性气氛中热处理由热固性树脂的模制品制备碳基底。该树脂的特征在于，不溶于树脂的Fe，Al，Ni，Co，Cr和Mg的含量分别小于1ppm，并且不溶于树脂的Ca和Si的含量分别小于2ppm。热固性树脂的特征还在于，水含量小于3重量％，与羟基（OH）连接的亚甲基碳（CH 2）的比例小于3％（基于总碳数）。以这种方式制备的碳衬底几乎没有缺陷和空隙。适用于磁记录介质的基板。热固性树脂可以是粉末状或颗粒状的，其流化，然后在加热下固化。通过将树脂熔体引入模具中并通过加压加压固化来制备热固性树脂的模制品。随后在惰性气氛中进行热处理，得到玻璃状碳的成型品。

2. 发明授权

US5580500A Method of manufacturing carbon substrate 失效
标题翻译：制造碳基板的方法
公开(公告)号：US5580500A
公开(公告)日：1996-12-03
申请号：US297811
申请日：1994-08-30
申请人： Kazuo Muramatsu , Manabu Hisada , Hideki Yamamuro , Hideo Ashida , Satoru Takada , Masami Takao , Yoshihiro Hara , Nobuhiro Ota
发明人： Kazuo Muramatsu , Manabu Hisada , Hideki Yamamuro , Hideo Ashida , Satoru Takada , Masami Takao , Yoshihiro Hara , Nobuhiro Ota
IPC分类号： C04B35/524 , C01B31/00
CPC分类号： C04B35/524
摘要： A carbon substrate manufacturing method includes a hot molding step, a burn-carbonizing step, a hot isostatical pressure treatment step, and a mirror polishing step. In the hot molding step, molding is performed while heating thermosetting resin powders to be a hard carbon substrate after burn-carbonizing, where the thermosetting resin powders are of a particle size 150 .mu.m or more, HPF 80-150 mm, a moisture content 1.0-3.0 weight %, Fe, Ni, Si and Ca respectively 5 ppm or less. In the burn-carbonizing process, a disk shaped resin molded body is filled into a graphite cylinder and burn-carbonized by heating from the external while the condition therefor is maintained in that the disk shaped resin molded body is stacked holding therein a graphite spacer at every one sheet basis or at every plurality of sheet basis and is loaded on its top with a tungsten carbide weight, where the graphite spacer has a heat conductivity 100 kcal/m.hr..degree. C. or less, a bulk density 1.70-1.85, and a flatness degree 10 .mu.m or less.
摘要翻译：碳基板制造方法包括热成型步骤，燃烧碳化步骤，热等压压力处理步骤和镜面抛光步骤。在热成型工序中，在将热固化性树脂粉末在烧成碳化后作为硬质碳基板加热的同时进行成型，其中热固性树脂粉末的粒径为150μm以上，HPF为80-150mm，水分含量 1.0-3.0重量％，Fe，Ni，Si和Ca分别为5ppm以下。在烧成碳化工序中，将圆盘状树脂成形体填充到石墨圆筒中，通过加热从外部进行燃烧碳化，同时保持其状态，将盘状树脂成型体层叠在一起，将石墨间隔件每一片或多个片材基础，并以碳化钨重量装载在其顶部，其中石墨间隔物具有100kcal / m·hr的热导率。 ℃以下，体积密度1.70-1.85，平坦度10μm以下。

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