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1. 发明授权

US07648610B2 Baffle plate, apparatus for producing the same, method of producing the same, and gas processing apparatus containing baffle plate 失效
标题翻译：挡板，其制造方法，制造方法以及包含挡板的气体处理装置
公开(公告)号：US07648610B2
公开(公告)日：2010-01-19
申请号：US10168451
申请日：2000-12-21
申请人： Taro Komiya , Hatsuo Osada , Shigetoshi Hosaka , Tomihiro Yonenaga , Masayuki Tomoyasu
发明人： Taro Komiya , Hatsuo Osada , Shigetoshi Hosaka , Tomihiro Yonenaga , Masayuki Tomoyasu
IPC分类号： H01L21/3065 , H01L21/306 , C23C16/00 , C23C16/455
CPC分类号： H01J37/32449 , B01J2219/00777 , C23C16/4412 , C23C16/45591 , H01J37/3244 , H01J37/32834
摘要： The present invention provides a gas process apparatus that realizes uniform exhaust without depending on process conditions, a gas process chamber that constitutes the gas process apparatus, a baffle plate mounted on the gas process chamber, a method of producing the baffle plate, and an apparatus for producing the baffle plate. The baffle plate of the present invention serves as a partition between a process space in which a chemical process is carried out with a supplied gas, and a duct that is adjacent to the process space and functions to discharge exhaust gas generated as a result of the chemical process. In accordance with the difference between the pressures on both sides of the baffle plate, which difference varies depending on the location on the baffle plate, the baffle holes are disposed on a plurality of locations on the baffle plate.
摘要翻译：本发明提供了一种不依赖于工艺条件实现均匀排气的气体处理装置，构成气体处理装置的气体处理室，安装在气体处理室上的挡板，制造挡板的方法，以及装置用于制造挡板。本发明的挡板用作在其中进行化学处理的处理空间与供给的气体之间的隔板以及与处理空间相邻的管道，并且其功能是排出由于化学过程。根据挡板两侧的压力差，该差异根据挡板上的位置而变化，挡板孔设置在挡板上的多个位置上。

2. 发明授权

US5951772A Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US5951772A
公开(公告)日：1999-09-14
申请号：US803008
申请日：1997-02-21
申请人： Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
发明人： Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
IPC分类号： C23C8/06 , C23C16/44 , C23C16/455 , H01L21/00 , C23C16/00
CPC分类号： C23C16/4557 , C23C16/4405 , C23C16/4411 , C23C16/4412 , C23C16/45561 , C23C16/45565 , C23C16/45572 , C23C8/06 , H01L21/67017 , H01L21/67103 , Y10S156/916 , Y10S438/905 , Y10S438/935
摘要： A vacuum processing apparatus includes: a vacuum processing chamber for processing a target object; a processing gas supply source for supplying a processing gas by which a process is performed to the target object in the vacuum processing chamber; a processing gas supply pipe for supplying the processing gas from the processing gas supply source into the vacuum processing chamber; and a pressure reducing valve for keeping the gas supply pipe at a lower pressure than the atmospheric pressure when the processing gas is to be supplied to the vacuum processing chamber.
摘要翻译：真空处理装置包括：用于处理目标物体的真空处理室; 处理气体供给源，用于向真空处理室中的目标物体供给进行处理的处理气体; 处理气体供给管，用于将来自处理气体供给源的处理气体供给到真空处理室中; 以及当将处理气体供给到真空处理室时，用于将气体供给管保持在比大气压力更低的压力下的减压阀。

3. 发明授权

US5647945A Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US5647945A
公开(公告)日：1997-07-15
申请号：US255924
申请日：1994-06-07
申请人： Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
发明人： Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
IPC分类号： C23C8/06 , C23C16/44 , C23C16/455 , H01L21/00 , H01L21/3065
CPC分类号： C23C16/4557 , C23C16/4405 , C23C16/4411 , C23C16/4412 , C23C16/45561 , C23C16/45565 , C23C16/45572 , C23C8/06 , H01L21/67017 , H01L21/67103 , Y10S156/916 , Y10S438/905 , Y10S438/935
摘要： A vacuum processing apparatus includes: a vacuum processing chamber for processing a target object; a processing gas supply source for supplying a processing gas by which a process is performed to the target object in the vacuum processing chamber; a processing gas supply pipe for supplying the processing gas from the processing gas supply source into the vacuum processing chamber; and a pressure reducing valve for keeping the gas supply pipe at a lower pressure than the atmospheric pressure when the processing gas is to be supplied to the vacuum processing chamber.
摘要翻译：真空处理装置包括：用于处理目标物体的真空处理室; 处理气体供给源，用于向真空处理室中的目标物体供给进行处理的处理气体; 处理气体供给管，用于将来自处理气体供给源的处理气体供给到真空处理室中; 以及当将处理气体供给到真空处理室时，用于将气体供给管保持在比大气压力更低的压力下的减压阀。

4. 发明授权

US5445675A Semiconductor processing apparatus 失效
标题翻译：半导体处理装置
公开(公告)号：US5445675A
公开(公告)日：1995-08-29
申请号：US87873
申请日：1993-07-09
申请人： Masao Kubodera , Shigeru Kasai , Hatsuo Osada
发明人： Masao Kubodera , Shigeru Kasai , Hatsuo Osada
IPC分类号： C23C16/48 , C23C16/52 , C23C16/00
CPC分类号： C23C16/52 , C23C16/48 , C23C16/481
摘要： A semiconductor processing apparatus comprises a vacuum processing chamber and a lamp house provided thereunder. A susceptor is provided in the processing chamber, and a semiconductor wafer is mounted thereon. The processing chamber and the lamp house are partitioned by a widow plate made of quartz glass in an airtight state. Eight light sources for heating are arranged in a circumferential form on a rotatable table at the portion which is in the lamp house and under the window plate. A sensor comprising a thermocouple for detecting energy of transmitted light is provided between the susceptor and the window plate. The sensor is connected to a measuring section comprising an A/D converter, and thereby detected data is converted from a digital signal to an observed value. The observed value is sent to a comparator to be compared with a predetermined reference model. A comparative result obtained by the comparator is transmitted to a controlling section. The control section induces the state of the window plate from the comparative result, and stops the power supply to the light source when the detected energy of the transmitted light is lower than a predetermined limit.
摘要翻译：半导体处理装置包括设在其下方的真空处理室和灯室。在处理室中设置感受体，并且在其上安装半导体晶片。处理室和灯室由密封状态的石英玻璃制成的寡妇隔板。八个用于加热的光源以圆周形式布置在位于灯室中的部分和窗板下方的可旋转台上。包括用于检测透射光能量的热电偶的传感器设置在基座和窗板之间。传感器连接到包括A / D转换器的测量部分，从而将数据从数字信号转换成观测值。观察值被发送到比较器以与预定的参考模型进行比较。由比较器获得的比较结果被传送到控制部分。控制部从比较结果引导窗板的状态，当检测到的透射光的能量低于预定极限时，停止对光源的供电。

5. 发明授权

US5333986A Transfer apparatus 失效
标题翻译：转运设备
公开(公告)号：US5333986A
公开(公告)日：1994-08-02
申请号：US921258
申请日：1992-07-29
申请人： Masami Mizukami , Hatsuo Osada
发明人： Masami Mizukami , Hatsuo Osada
IPC分类号： B25J9/06 , B25J9/10 , B25J17/00 , B25J17/02 , H01L21/677 , H01L21/687 , B25J21/00
CPC分类号： B25J9/1065 , B25J17/0241 , H01L21/68707 , Y10S414/13 , Y10S414/135 , Y10S414/139 , Y10T74/18856 , Y10T74/20323 , Y10T74/20329
摘要： A transfer apparatus for transferring a semiconductor wafer has a base provided with a rotary driving source, and four arms having the same length. A first inner arm has an end fixed to the rotary driving shaft, and the other end fixed to a first coupling shaft. A second inner arm has an end supported by the base such that it can rotate about a pivotal point, and the other end is rotatably connected to a second coupling shaft. A transmission mechanism is provided between the first and second coupling shafts. A first outer arm has an end rotatably connected to the first coupling shaft, and a second outer arm has an end fixed to the second coupling shaft. The other ends of the first and second outer arms are rotatably connected to a supporting plate having a wafer-holding portion. The four arms are arranged so as to have a link structure in the form of a parallelogram, which enables linear transfer of a wafer.
摘要翻译：用于传送半导体晶片的转印装置具有设置有旋转驱动源的基座和具有相同长度的四个臂。第一内臂具有固定到旋转驱动轴的端部，另一端固定到第一联接轴。第二内臂具有由基座支撑的端部，使得其能够围绕枢转点旋转，另一端可旋转地连接到第二联接轴。在第一和第二联接轴之间设置传动机构。第一外臂具有可旋转地连接到第一联接轴的端部，并且第二外臂具有固定到第二联接轴的端部。第一外臂和第二外臂的另一端可旋转地连接到具有晶片保持部分的支撑板。四个臂布置成具有平行四边形形式的连接结构，其能够线性传输晶片。

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