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1. 发明申请

US20070042183A1 Carrier for aqueous media 审中-公开
标题翻译：水介质载体
公开(公告)号：US20070042183A1
公开(公告)日：2007-02-22
申请号：US10560468
申请日：2004-06-23
申请人： Hartmut Stenzel , Erich Kessler , Quang Huang
发明人： Hartmut Stenzel , Erich Kessler , Quang Huang
IPC分类号： B32B9/00
CPC分类号： C08J3/226 , C08J9/40 , C08J2423/00 , C08J2425/00 , C08J2427/00 , Y10T428/2984
摘要： The invention relates to a carrier in the form of particles, which can be loaded with aqueous media. Said particles are formed from a porous hydrophobic polymer substrate, have an average particle size ranging between 50 ?m and 5000 ?m, and are provided with an at least partly open-pore structure having an average pore diameter ranging between 1 ?m and 200 ?m. The inventive carrier can be loaded with 10 to 95 percent by weight of water relative to the total weight of the loaded carrier, said loadability being determined by contacting the carrier with water. Also disclosed is a storage device which is based on said carrier and is loaded with an aqueous medium. The invention further relates to a method for producing such a carrier in the form of particles that are based on a hydrophobic polymer, said carrier being loadable with 10 to 95 percent by weight of water. According to said method, the polymer substrate that is provided in particles is hydrophilized on at least one portion of the entire surface thereof, which comprises the exterior surface and the surface of the pores thereof.
摘要翻译：本发明涉及颗粒形式的载体，其可以装载有水性介质。所述颗粒由多孔疏水性聚合物基材形成，平均粒径范围在50μm至5000μm之间，并且具有至少部分开孔结构，其平均孔径范围在1μm至200μm之间？本发明的载体可以相对于负载的载体的总重量加载10至95重量％的水，所述负载能力通过使载体与水接触来确定。还公开了一种基于所述载体并且装载有水性介质的存储装置。本发明还涉及一种制备这种基于疏水性聚合物的颗粒形式的载体的方法，所述载体可以以10至95重量％的水装载。根据所述方法，提供在颗粒中的聚合物基材在其整个表面的至少一部分上被亲水化，其包括外表面和其孔的表面。

2. 发明申请

US20080203598A1 METHOD FOR PRODUCING FOAMED POLYMER MOLDED BODIES AND SAID FOAMED POLYMER MOLDED BODIES 审中-公开
标题翻译：生产泡沫聚合物成型体和均匀发泡聚合物成型体的方法
公开(公告)号：US20080203598A1
公开(公告)日：2008-08-28
申请号：US12042972
申请日：2008-03-05
申请人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
发明人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
IPC分类号： C08J9/06
CPC分类号： B29C44/3446 , B29B9/065 , B29B9/12 , B29C44/348 , B29C48/04 , B29C48/37 , B29C48/40 , B29C48/9185 , B29C48/92 , B29C2948/92514 , B29C2948/92704 , B29C2948/92895 , B29C2948/92904 , Y10T428/249953 , Y10T428/249958 , Y10T428/249978 , Y10T428/249979 , Y10T428/2982
摘要： Method for producing foamed microporous polymer molded bodies by melting a thermoplastic polymer in a first zone of an extrusion device, mixing in a highly volatile blowing agent, conveying the polymer melt containing the blowing agent into a second zone in which dissolution of the blowing agent occurs to saturation of the polymer melt at the foaming temperature, and molding and foaming of the loaded polymer melt to a foamed structure, whereby, in the second zone, a pressure above 90 bar, a blowing agent concentration above the critical minimum concentration for complete foaming, and the foaming temperature, lying above the solidification temperature of the polymer melt saturated with blowing agent, are set such that the polymer molded body obtained has a porosity in the range between 40 and 90 vol. % and an open-cell pore structure with uniform cross-sectional distribution. Foamed microporous polymer molded bodies in the form of particles comprising a thermoplastic polymer with uniform open-cell pore structure, a porosity of 40 to 90 vol. %, an accessible proportion of pore volume of at least 0.75 and an average cell size between 1 and 100 μm.
摘要翻译：通过在挤出装置的第一区域中熔化热塑性聚合物来制造发泡微孔聚合物成型体的方法，在高挥发性发泡剂中混合，将含有发泡剂的聚合物熔体输送到发生发泡剂溶解的第二区域在发泡温度下使聚合物熔体饱和，并将负载的聚合物熔体成型和发泡成泡沫结构，由此在第二区域中压力高于90巴，发泡剂浓度高于完全发泡的临界最小浓度并且在发泡剂饱和的聚合物熔体的凝固温度以上的发泡温度被设定为使得得到的聚合物成型体的孔隙率在40〜90体积％的范围内。％和具有均匀横截面分布的开孔细孔结构。发泡微孔聚合物成型体，其为包含具有均匀开孔形式的热塑性聚合物的颗粒形式，孔隙率为40至90体积％。％，孔体积的可接近比例为至少0.75，平均泡孔尺寸为1至100μm。

3. 发明授权

US07429420B2 Method for producing foamed polymer molded bodies and said foamed polymer molder bodies 有权
标题翻译：生产泡沫聚合物成型体和所述发泡聚合物成型体的方法
公开(公告)号：US07429420B2
公开(公告)日：2008-09-30
申请号：US10513402
申请日：2003-04-30
申请人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
发明人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
IPC分类号： B32B3/26 , B32B5/16
CPC分类号： B29C44/3446 , B29C44/348 , B29C47/0011 , B29C47/364 , B29C47/40 , B29C47/889 , B29C47/92 , B29C2947/92514 , B29C2947/92704 , B29C2947/92895 , B29C2947/92904 , Y10T428/249953 , Y10T428/249958 , Y10T428/249978 , Y10T428/249979 , Y10T428/2982
摘要： Method for producing foamed microporous polymer molded bodies by melting a thermoplastic polymer in a first zone of an extrusion device, mixing in a highly volatile blowing agent, conveying the polymer melt containing the blowing agent into a second zone in which dissolution of the blowing agent occurs to saturation of the polymer melt at the foaming temperature, and molding and foaming of the loaded polymer melt to a foamed structure, whereby, in the second zone, a pressure above 90 bar, a blowing agent concentration above the critical minimum concentration for complete foaming, and the foaming temperature, lying above the solidification temperature of the polymer melt saturated with blowing agent, are set such that the polymer molded body obtained has a porosity in the range between 40 and 90 vol. % and an open-cell pore structure with uniform cross-sectional distribution. Foamed microporous polymer molded bodies in the form of particles comprising a thermoplastic polymer with uniform open-cell pore structure, a porosity of 40 to 90 vol. %, an accessible proportion of pore volume of at least 0.75 and an average cell size between 1 and 100 μm.
摘要翻译：通过在挤出装置的第一区域中熔化热塑性聚合物来制造发泡微孔聚合物成型体的方法，在高挥发性发泡剂中混合，将含有发泡剂的聚合物熔体输送到发生发泡剂溶解的第二区域在发泡温度下使聚合物熔体饱和，并将负载的聚合物熔体成型和发泡成泡沫结构，由此在第二区域中压力高于90巴，发泡剂浓度高于完全发泡的临界最小浓度并且在发泡剂饱和的聚合物熔体的凝固温度以上的发泡温度被设定为使得得到的聚合物成型体的孔隙率在40〜90体积％的范围内。％和具有均匀横截面分布的开孔细孔结构。发泡微孔聚合物成型体，其为包含具有均匀开孔形式的热塑性聚合物的颗粒形式，孔隙率为40至90体积％。％，孔体积的可接近比例为至少0.75，平均泡孔尺寸为1至100μm。

4. 发明申请

US20050175830A1 Method for producing foamed polymer moulded bodies and foamed polymer moulded bodies 有权
标题翻译：发泡聚合物成型体和发泡聚合物成型体的制造方法
公开(公告)号：US20050175830A1
公开(公告)日：2005-08-11
申请号：US10513402
申请日：2003-04-30
申请人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
发明人： Frank Wiese , Hartmut Stenzel , Quan Huang , Bernd Seibig , Dieter Paul
IPC分类号： C08J9/12 , B29C44/34 , B29C47/64 , B29C47/92 , B29K101/12 , B29K105/04 , D01F1/08 , D01F6/46 , B32B3/26
CPC分类号： B29C44/3446 , B29C44/348 , B29C47/0011 , B29C47/364 , B29C47/40 , B29C47/889 , B29C47/92 , B29C2947/92514 , B29C2947/92704 , B29C2947/92895 , B29C2947/92904 , Y10T428/249953 , Y10T428/249958 , Y10T428/249978 , Y10T428/249979 , Y10T428/2982
摘要： Method for producing foamed microporous polymer molded bodies by melting a thermoplastic polymer in a first zone of an extrusion device, mixing in a highly volatile blowing agent, conveying the polymer melt containing the blowing agent into a second zone in which dissolution of the blowing agent occurs to saturation of the polymer melt at the foaming temperature, and molding and foaming of the loaded polymer melt to a foamed structure, whereby, in the second zone, a pressure above 90 bar, a blowing agent concentration above the critical minimum concentration for complete foaming, and the foaming temperature, lying above the solidification temperature of the polymer melt saturated with blowing agent, are set such that the polymer molded body obtained has a porosity in the range between 40 and 90 vol. % and an open-cell pore structure with uniform cross-sectional distribution. Foamed microporous polymer molded bodies in the form of particles comprising a thermoplastic polymer with uniform open-cell pore structure, a porosity of 40 to 90 vol. %, an accessible proportion of pore volume of at least 0.75 and an average cell size between 1 and 100 μm.
摘要翻译：通过在挤出装置的第一区域中熔化热塑性聚合物来制造发泡微孔聚合物成型体的方法，在高挥发性发泡剂中混合，将含有发泡剂的聚合物熔体输送到发生发泡剂溶解的第二区域在发泡温度下使聚合物熔体饱和，并将负载的聚合物熔体成型和发泡成泡沫结构，由此在第二区域中压力高于90巴，发泡剂浓度高于完全发泡的临界最小浓度并且在发泡剂饱和的聚合物熔体的凝固温度以上的发泡温度被设定为使得得到的聚合物成型体的孔隙率在40〜90体积％的范围内。％和具有均匀横截面分布的开孔细孔结构。发泡微孔聚合物成型体，其为包含具有均匀开孔形式的热塑性聚合物的颗粒形式，孔隙率为40至90体积％。％，孔体积的可接近比例为至少0.75，平均泡孔尺寸为1至100μm。

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