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    • 4. 发明授权
    • Process of end-capping a polyimide system
    • 封端聚酰亚胺系统的工艺
    • US4552931A
    • 1985-11-12
    • US649328
    • 1984-09-11
    • Terry L. St. ClairHarold D. Burks
    • Terry L. St. ClairHarold D. Burks
    • C08G73/10
    • C08G73/1064C08G73/1014C08G73/1017C08G73/1071
    • A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,3-bis(aminophenoxy)benzene (APB) dissolved in bis(2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the endcapping agent, and then adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250.degree. C., there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660. A greater drop in viscosity is noted at higher temperatures. Apparent viscosity as a function of molecular weight at 250.degree. C. and at 280.degree. C. is depicted in FIG. 2. Reducing the molecular weight also results in a linear decrease in the fracture resistance from 4100 J/m.sup.2 to 296 J/m.sup.2, as shown in FIG. 1.
    • 公开了一种使用封端剂封端聚酰亚胺系统以便实现分子量和熔体粘度的受控降低以及模制产品的可预测的耐断裂性的方法。 未封端的体系是通过将等摩尔比的4,4'-双(3,4-二羧基苯氧基)二苯硫醚二酐(BDSDA)和1,3-双(氨基苯氧基)苯(APB))溶于双(2-甲氧基乙基) 醚。 通过将APB溶解在双(2-甲氧基乙基)醚中,加入封端剂,然后加入BDSDA形成封端体系。 通过将封端量从0降低到4%,分子量从13,900降低到8660.在250℃的加工温度下,分子量和粘度之间存在线性关系,粘度降低了两个数量级 随着分子量从13,900降低到8660.在较高的温度下,粘度的下降更大。 在250℃和280℃下作为分子量的函数的表观粘度如图1所示。 降低分子量也导致断裂阻力从4100J / m 2到296J / m 2的线性降低,如图2所示。 1。