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    • 2. 发明申请
    • METHOD FOR ERASING NON-VOLATILE MEMORY
    • 用于擦除非易失性存储器的方法
    • US20070206424A1
    • 2007-09-06
    • US11531690
    • 2006-09-13
    • Chao-Wei KuoChih-Ming ChaoHann-Ping Hwang
    • Chao-Wei KuoChih-Ming ChaoHann-Ping Hwang
    • G11C16/04G11C11/34
    • G11C16/14
    • A method for erasing a non-volatile memory is provided. The non-volatile memory includes a first conductive type substrate, a second conductive type well disposed in the first conductive type substrate, a first conductive type well disposed on the second conductive type well, and a memory cell disposed on the first conductive type substrate. The memory cell includes a charge trapping layer and a gate. The erasing method includes the following steps. A first voltage is applied to the gate, a second voltage is applied to the first conductive type substrate, and the second conductive type well is floating. The second voltage is large enough to induce a substrate hot hole effect. The holes are injected into the charge trapping layer by applying the first voltage.
    • 提供了一种擦除非易失性存储器的方法。 非易失性存储器包括第一导电型衬底,布置在第一导电类型衬底中的第二导电类型阱,布置在第二导电类型阱上的第一导电类型阱以及设置在第一导电类型衬底上的存储单元。 存储单元包括电荷捕获层和栅极。 擦除方法包括以下步骤。 向栅极施加第一电压,将第二电压施加到第一导电型衬底,并且第二导电类型阱浮置。 第二电压足够大以引起基板热孔效应。 通过施加第一电压将空穴注入电荷俘获层。
    • 5. 发明申请
    • MEMORY DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE
    • 存储器件及其制造方法和半导体器件
    • US20100052036A1
    • 2010-03-04
    • US12545054
    • 2009-08-20
    • Cheng-Hong LeeChih-Ming ChaoHann-Ping HwangChe-Huai Hung
    • Cheng-Hong LeeChih-Ming ChaoHann-Ping HwangChe-Huai Hung
    • H01L29/788H01L21/8239H01L29/792
    • H01L27/11573
    • A semiconductor device disposed on a substrate is provided. The semiconductor device includes two isolation structures, a first conductive layer, a charge trapping layer, a second conductive layer and a gate dielectric layer. The two isolation structures are disposed in the substrate to define an active area. The second conductive layer across the two isolation structures is disposed on the substrate. The first conductive layer is disposed between the two isolation structures and between the second conductive layer and the substrate. The second conductive layer electrically connects with the first conductive layer. The charge trapping layer is disposed on the substrate. The gate dielectric layer is disposed between the first conductive layer and the substrate. An interface between the two isolation structures and the first conductive layer is covered by the charge trapping layer to restrain the kink effect.
    • 设置在基板上的半导体器件。 半导体器件包括两个隔离结构,第一导电层,电荷俘获层,第二导电层和栅极电介质层。 两个隔离结构设置在基板中以限定有效区域。 穿过两个隔离结构的第二导电层设置在基板上。 第一导电层设置在两个隔离结构之间以及第二导电层与衬底之间。 第二导电层与第一导电层电连接。 电荷捕获层设置在基板上。 栅电介质层设置在第一导电层和衬底之间。 两个隔离结构和第一导电层之间的界面被电荷俘获层覆盖以抑制扭结效应。