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1. 发明申请

US20100296773A1 METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CONTROL POWER LEVELS THEREOF IN A PLANAR LIGHTWAVE CIRCUIT 有权
标题翻译：用于生成和监视光信号的方法和装置，并控制其在平面照明电路中的功率水平
公开(公告)号：US20100296773A1
公开(公告)日：2010-11-25
申请号：US12847117
申请日：2010-07-30
申请人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Lin , Jesper Arentoft Jayaswal
发明人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Lin , Jesper Arentoft Jayaswal
IPC分类号： G02B6/36 , H01L31/18
CPC分类号： H01S5/141 , H01L2224/48091 , H01L2224/73265 , H01S5/02248 , H01S5/0268 , H01S5/0683 , H01S5/4062 , H01S5/4087 , H01L2924/00014
摘要： Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.
摘要翻译：公开了一种光学检测装置的实施例，其可以包括波导，在波导中形成的沟槽，反射表面和光电检测器中的一个或多个。波导可以形成在半导体衬底中，以传播在波导的第一端处接收的光信号。沟槽也可以形成在具有第一侧壁和第二侧壁的波导中，第一和第二侧壁与波导的传播方向形成第一和第二角度。第二侧壁可以包括形成在其上的反射表面。光电检测器可以被配置为接收在波导中传播的光信号，通过第一侧壁并从第二侧壁上的反射表面反射。

2. 发明授权

US07780360B2 Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit 有权
标题翻译：在平面光波电路中产生和监测光信号并控制其功率水平的方法和装置
公开(公告)号：US07780360B2
公开(公告)日：2010-08-24
申请号：US12176758
申请日：2008-07-21
申请人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Li , Jesper Arentoft Jayaswal
发明人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Li , Jesper Arentoft Jayaswal
IPC分类号： G02B6/36 , H01S3/13
CPC分类号： H01S5/141 , H01L2224/48091 , H01L2224/73265 , H01S5/02248 , H01S5/0268 , H01S5/0683 , H01S5/4062 , H01S5/4087 , H01L2924/00014
摘要： Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.
摘要翻译：公开了一种光学检测装置的实施例，其可以包括波导，在波导中形成的沟槽，反射表面和光电检测器中的一个或多个。波导可以形成在半导体衬底中，以传播在波导的第一端处接收的光信号。沟槽也可以形成在具有第一侧壁和第二侧壁的波导中，第一和第二侧壁与波导的传播方向形成第一和第二角度。第二侧壁可以包括形成在其上的反射表面。光电检测器可以被配置为接收在波导中传播的光信号，通过第一侧壁并从第二侧壁上的反射表面反射。

3. 发明授权

US06959134B2 Measuring the position of passively aligned optical components 失效
标题翻译：测量被动对准光学元件的位置
公开(公告)号：US06959134B2
公开(公告)日：2005-10-25
申请号：US10609804
申请日：2003-06-30
申请人： Ut Tran , Hamid Eslampour
发明人： Ut Tran , Hamid Eslampour
IPC分类号： G02B6/35 , G02B6/42
CPC分类号： G02B6/4232 , G02B6/422 , G02B6/4227 , G02B6/423 , H01S5/0224 , H01S5/02268 , H01S5/02272
摘要： Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
摘要翻译：光学部件可以相对于彼此精确地定位在三维空间中。可以利用具有将二次元件精确定位的能力的接合器。组件可以配备有不同高度的触点，使得当组件在第三维度中组合时，可以感测它们的相对位置。该信息可以反馈到接合器以控制第三维度中的精确对准。

4. 发明授权

US08057108B2 Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit 有权
标题翻译：在平面光波电路中产生和监测光信号并控制其功率水平的方法和装置
公开(公告)号：US08057108B2
公开(公告)日：2011-11-15
申请号：US12847117
申请日：2010-07-30
申请人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Li , Jesper Arentoft Jayaswal
发明人： Achintya K. Bhowmik , Nagesh K. Vodrahalli , Gennady Farber , Hai-Feng Liu , Hamid Eslampour , Ut Tran , William B. Wong , Ruolin Li , Jesper Arentoft Jayaswal
IPC分类号： G02B6/36
CPC分类号： H01S5/141 , H01L2224/48091 , H01L2224/73265 , H01S5/02248 , H01S5/0268 , H01S5/0683 , H01S5/4062 , H01S5/4087 , H01L2924/00014
摘要： Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.
摘要翻译：公开了一种光学检测装置的实施例，其可以包括波导，在波导中形成的沟槽，反射表面和光电检测器中的一个或多个。波导可以形成在半导体衬底中，以传播在波导的第一端处接收的光信号。沟槽也可以形成在具有第一侧壁和第二侧壁的波导中，第一和第二侧壁与波导的传播方向形成第一和第二角度。第二侧壁可以包括形成在其上的反射表面。光电检测器可以被配置为接收在波导中传播的光信号，通过第一侧壁并从第二侧壁上的反射表面反射。

5. 发明申请

US20100279504A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING 有权
标题翻译：集成电路封装系统，包括蜂窝电话模制
公开(公告)号：US20100279504A1
公开(公告)日：2010-11-04
申请号：US12834176
申请日：2010-07-12
申请人： Heap Hoe Kuan , Hamid Eslampour , DaeSik Choi , Rui Huang , Taeg Ki Lim
发明人： Heap Hoe Kuan , Hamid Eslampour , DaeSik Choi , Rui Huang , Taeg Ki Lim
IPC分类号： H01L21/768
CPC分类号： H01L21/565 , H01L21/561 , H01L23/562 , H01L24/97 , H01L25/105 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511
摘要： A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.
摘要翻译：集成电路封装系统的制造方法包括：向基板提供顶表面; 配置顶表面以包括电触头和集成电路; 在衬底上提供仅具有接触衬底的顶表面的柱的蜂窝状网状结构; 以及沉积材料以防止衬底在衬底的顶表面上以及集成电路上的翘曲，该图案化的材料具有暴露电接触的分立的中空导管。

6. 发明申请

US20070274640A1 Measuring the position of passively aligned optical components 审中-公开
公开(公告)号：US20070274640A1
公开(公告)日：2007-11-29
申请号：US11827267
申请日：2007-07-11
申请人： Ut Tran , Hamid Eslampour
发明人： Ut Tran , Hamid Eslampour
IPC分类号： G02B6/26
CPC分类号： G02B6/4232 , G02B6/422 , G02B6/4227 , G02B6/423 , H01S5/0224 , H01S5/02268 , H01S5/02272
摘要： Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

7. 发明申请

US20090226135A1 Measureing the position of passively aligned optical components 审中-公开
标题翻译：测量被动对准的光学部件的位置
公开(公告)号：US20090226135A1
公开(公告)日：2009-09-10
申请号：US12454059
申请日：2009-05-12
申请人： Ut Tran , Hamid Eslampour
发明人： Ut Tran , Hamid Eslampour
IPC分类号： G02B6/42
CPC分类号： G02B6/4232 , G02B6/422 , G02B6/4227 , G02B6/423 , H01S5/0224 , H01S5/02268 , H01S5/02272
摘要： Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
摘要翻译：光学部件可以相对于彼此精确地定位在三维空间中。可以利用具有将二次元件精确定位的能力的接合器。组件可以配备有不同高度的触点，使得当组件在第三维度中组合时，可以感测它们的相对位置。该信息可以反馈到接合器以控制第三维度中的精确对准。

8. 发明授权

US06527163B1 Methods of making bondable contacts and a tool for making such contacts 有权
标题翻译：制造可接合触点的方法和用于进行这种接触的工具
公开(公告)号：US06527163B1
公开(公告)日：2003-03-04
申请号：US09865686
申请日：2000-11-21
申请人： Hamid Eslampour
发明人： Hamid Eslampour
IPC分类号： B23K3102
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L24/742 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/1133 , H01L2224/1184 , H01L2224/13144 , H01L2224/742 , H01L2224/749 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/00012
摘要： A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.
摘要翻译：在微电子元件上制造可结合接触的方法包括提供在其第一面上具有一个或多个管芯焊盘的微电子元件，并且在每个管芯焊盘顶上淀积诸如金的导电接合材料。然后使用接触形成工具将导电接合材料成型，以形成可结合的接触。可接合触点具有基本上平坦的区域和在基本上平坦的区域上方突出的第二区域。第二区域包括适于邻接相对的导电元件的顶点。可以一次形成可结合的触点，也可以同时形成多个可结合的触点。在一个优选实施例中，触头的突出区域限定了由其基本上平坦的区域限定的楔形突起。每个楔形突起可以包括在顶点和接触的基本上平坦的区域之间延伸的顶点和侧壁。

9. 发明授权

US06495462B1 Components with releasable leads 失效
标题翻译：具有可释放引线的部件
公开(公告)号：US06495462B1
公开(公告)日：2002-12-17
申请号：US09566273
申请日：2000-05-05
申请人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
发明人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
IPC分类号： H01L21302
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , H01L2924/00
摘要： A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another. A microelectronic element assemble by includes a support structure having a dielectric layer and terminals disposed on the dielectric layer; a microelectronic element and a plurality of leads connecting contacts on the microelectronic element to terminals on the dielectric layer. The dielectric layer has a central region and a periphery region which surrounds the central region. The periphery region is disposed beneath the periphery of the microelectronic element.
摘要翻译：通过提供具有介电层的起始结构并在电介质层的表面上引出微电子部件。引线的端部连接到微电子元件上的触点，例如半导体芯片或晶片上的触点。然后蚀刻电介质层以将引线部分地从电介质层分离，留下每个引线的至少一端永久地连接到电介质层。引线的剩余部分可以与电介质层完全或部分分离。如果引线的剩余部分仅部分分离，则在将微电子元件和电介质层彼此远离的步骤期间，将引线连接到聚合物层的连接元件可以从引线断开或剥离。微电子元件组装通过包括具有电介质层的支撑结构和设置在电介质层上的端子; 微电子元件和将微电子元件上的触点连接到电介质层上的端子的多个引线。电介质层具有围绕中心区域的中心区域和周边区域。周边区域设置在微电子元件的外围的下方。

10. 发明授权

US08409921B2 Integrated circuit package system including honeycomb molding 有权
标题翻译：集成电路封装系统包括蜂窝成型
公开(公告)号：US08409921B2
公开(公告)日：2013-04-02
申请号：US12834176
申请日：2010-07-12
申请人： Heap Hoe Kuan , Hamid Eslampour , DaeSik Choi , Rui Huang , Taeg Ki Lim
发明人： Heap Hoe Kuan , Hamid Eslampour , DaeSik Choi , Rui Huang , Taeg Ki Lim
IPC分类号： H01L23/02
CPC分类号： H01L21/565 , H01L21/561 , H01L23/562 , H01L24/97 , H01L25/105 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511
摘要： A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.
摘要翻译：集成电路封装系统的制造方法包括：向基板提供顶表面; 配置顶表面以包括电触头和集成电路; 在衬底上提供仅具有接触衬底的顶表面的柱的蜂窝状网状结构; 以及沉积材料以防止衬底在衬底的顶表面上以及集成电路上的翘曲，该图案化的材料具有暴露电接触的分立的中空导管。

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