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    • 1. 发明申请
    • HEAT DISSIPATION DEVICE
    • 散热装置
    • US20090266513A1
    • 2009-10-29
    • US12239832
    • 2008-09-29
    • HAI-GANG XIONGZHI-YONG ZHOU
    • HAI-GANG XIONGZHI-YONG ZHOU
    • F28F7/00F28D15/00
    • H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.
    • 一种适用于从发热电子装置中除去热量的散热装置,包括底座,布置在基座顶面上的第一翅片单元。 基座包括夹在基板和吊具之间的基板,吊具和热管组。 基板在其中限定开口。 热管组具有与插入突起相对的插入突起和接收凹部。 插入突起从热管组的顶表面向上突出并嵌入基板的开口中。 接收凹部从热管组的底表面向上凹陷并在其中容纳扩展器。