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    • 2. 发明申请
    • RAPID THERMAL PROCESSING CHAMBER
    • 快速热处理室
    • WO2013066652A1
    • 2013-05-10
    • PCT/US2012/061290
    • 2012-10-22
    • APPLIED MATERIALS, INC.MORITZ, KirkHUNTER, Aaron, Muir
    • MORITZ, KirkHUNTER, Aaron, Muir
    • H01L21/324H01L21/02
    • H01L21/67109H01L21/6719H01L21/67248
    • Embodiments of the invention generally relate to RTP chambers. The chambers generally include a chamber body and chamber lid. The chamber body includes a substrate support having multiple zones of resistive heaters to heat substrates positioned on the substrate support. The chamber body also optionally includes a cooling channel to mitigate thermal stress and a thermally insulating liner disposed therein for containing heat generated during thermal processing. The chamber lid includes a lid body having an opening therethrough, and a reflective plate disposed within the opening. A plurality of pyrometers are positioned within the reflective plate to measure the temperature of a substrate at a plurality of locations across the substrate corresponding to the zones of the substrate support. The temperature of each zone is adjusted in response to the signals from the plurality of pyrometers.
    • 本发明的实施例一般涉及RTP室。 这些室通常包括室主体和室盖。 室主体包括具有多个电阻加热器区域的基板支撑件,用于加热位于基板支撑件上的基板。 室主体还可选地包括用于减轻热应力的冷却通道和设置在其中的用于包含热处理期间产生的热量的隔热衬套。 室盖包括具有穿过其的开口的盖体和设置在开口内的反射板。 多个高温计定位在反射板内,以测量穿过衬底对应于衬底支撑的区域的多个位置处的衬底的温度。 响应于来自多个高温计的信号来调节每个区域的温度。
    • 7. 发明申请
    • AMBIENT LAMINAR GAS FLOW DISTRIBUTION IN LASER PROCESSING SYSTEMS
    • 激光加工系统中的环境层流气体分布
    • WO2012115681A1
    • 2012-08-30
    • PCT/US2011/045968
    • 2011-07-29
    • APPLIED MATERIALS, INC.MOFFATT, StephenHUNTER, Aaron Muir
    • MOFFATT, StephenHUNTER, Aaron Muir
    • H01L21/324H01L21/02
    • F27D21/00F27D5/0037F27D2021/0078H01L21/67115
    • A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has an annealing energy source and a substrate support, with a shield member disposed between the annealing energy source and the substrate support. The shield member is a substantially flat member having a dimension larger than a substrate processed on the substrate support, with a window covering a central opening in the substantially flat member. The central opening has a gas inlet portal and a gas outlet portal, each in fluid communication with a gas inlet plenum and gas outlet plenum, respectively. A connection member is disposed around the central opening and holds the window over the central opening. Connection openings in the connection member are in fluid communication with the gas inlet plenum and gas outlet plenum, respectively, through a gas inlet conduit and a gas outlet conduit formed through the connection member.
    • 公开了半导体衬底退火的方法和装置。 该装置具有退火能量源和衬底支撑件,其中屏蔽构件设置在退火能量源和衬底支撑件之间。 屏蔽构件是具有大于在基板支撑件上处理的基板的尺寸的基本上平坦的构件,窗口覆盖基本平坦的构件中的中心开口。 中心开口具有气体入口入口和气体出口入口,每个入口入口和气体出口通道分别与气体入口气室和气体出口增压室流体连通。 连接构件设置在中心开口周围并将窗口保持在中心开口的上方。 连接构件中的连接开口分别通过气体入口导管和通过连接构件形成的气体出口导管与气体入口气室和气体出口增压室流体连通。