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1. 发明公开

EP1910800A4 METHOD AND APPARATUS FOR SORTING PARTICLES WITH A MEMS DEVICE 有权
标题翻译：方法和装置用于分拣粒子与微机电器件
公开(公告)号：EP1910800A4
公开(公告)日：2013-03-06
申请号：EP06800528
申请日：2006-07-31
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER JOHN S , HARLEY JOHN C , HOVEY STEVEN H , MARTIN RICHARD T , NGUYEN HUNG D , RUBEL PAUL JOHN
发明人： FOSTER JOHN S , HARLEY JOHN C , HOVEY STEVEN H , MARTIN RICHARD T , NGUYEN HUNG , RUBEL PAUL J
IPC分类号： G01N1/10 , A61M1/36 , B01L3/00 , C12M1/34 , C12Q1/00 , G01N15/02 , G01N21/05 , G01N21/64 , H01L21/00
CPC分类号： C12M47/04 , A61M1/36 , A61M1/3633 , A61M1/3678 , A61M2202/0437 , B01L3/5027 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575

2. 发明公开

EP1910800A2 METHOD AND APPARATUS FOR SORTING PARTICLES WITH A MEMS DEVICE 有权
标题翻译：方法和装置用于分拣粒子与微机电器件
公开(公告)号：EP1910800A2
公开(公告)日：2008-04-16
申请号：EP06800528.9
申请日：2006-07-31
申请人： Innovative Micro Technology , Foster, John S. , Harley, John C. , Hovey, Steven H. , Martin, Richard T. , Nguyen, Hung D. , Rubel, Paul John
发明人： FOSTER, John S. , HARLEY, John C. , HOVEY, Steven H. , MARTIN, Richard T. , NGUYEN, Hung , RUBEL, Paul J.
IPC分类号： G01N1/10 , G01N21/64
CPC分类号： C12M47/04 , A61M1/36 , A61M1/3633 , A61M1/3678 , A61M2202/0437 , B01L3/5027 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575
摘要： A micromechanical particle sorting chip (300) uses laser light (305) directed through at least one of a reflective (360) and refractive (310) surface to come to a focus (320) in an optically transparent layer. The laser light (305) impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromechanical actuator (400) is activated, which directs the particle of interest into one of a plurality of possible exit paths.

3. 发明申请

WO2006127256A2 MICROFABRICATED CROSS FLOW FILTER AND METHOD OF MANUFACTURE 审中-公开
标题翻译：微波交错流过滤器及其制造方法
公开(公告)号：WO2006127256A2
公开(公告)日：2006-11-30
申请号：PCT/US2006/017743
申请日：2006-05-05
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER, John, S. , HOVEY, Steven, H. , MARTIN, Richard, T. , RUBEL, Paul, J. , NGUYEN, Hung, D. , HARLEY, John, C.
发明人： FOSTER, John, S. , HOVEY, Steven, H. , MARTIN, Richard, T. , RUBEL, Paul, J. , NGUYEN, Hung, D. , HARLEY, John, C.
IPC分类号： B01D63/00
CPC分类号： B01D61/14 , B01D63/00 , B01D65/08 , B01D67/0062 , B01D69/02 , B01D2321/2058 , G01N1/4077
摘要： A microfabricated cross flow filter may have multiple filtration stages. The filtration stages may include microfabricated filter barriers and gaps created in a substrate, thereby allowing very tight tolerances in the filter barrier and gap dimensions to be maintained. Using the microfabrication techniques, the filter barriers can be made having arbitrary shapes, and arranged at an angle or curved with respect to the flow direction, making the pressure drop across the filtration stage more uniform in the cross flow direction.
摘要翻译：微制造的交叉流过滤器可以具有多个过滤阶段。过滤阶段可以包括微制造的过滤器屏障和在衬底中产生的间隙，从而允许保持过滤器屏障和间隙尺寸的非常严格的公差。使用微细加工技术，过滤器屏障可以制成具有任意形状，并且以相对于流动方向成一定角度或弯曲的方式布置，使得横跨过滤台的压降在横向方向上更均匀。

4. 发明申请

WO2008136930A1 LID STRUCTURE FOR MICRODEVICE AND METHOD OF MANUFACTURE 审中-公开
标题翻译： MICRODEVICE的LID结构及其制造方法
公开(公告)号：WO2008136930A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005268
申请日：2008-04-24
申请人： INNOVATIVE MICRO TECHNOLOGY , HOVEY, Steven, H. , NGUYEN, Hug, D.
发明人： HOVEY, Steven, H. , NGUYEN, Hug, D.
IPC分类号： H01L23/02
CPC分类号： G02B1/118 , B81B2201/047 , B81C1/00317 , B81C2201/019 , B81C2203/0109 , H01L23/04 , H01L33/483 , H01L2924/0002 , H01L2924/00
摘要： A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid.
摘要翻译：描述了用于在衬底中的空腔底部形成特征的系统和方法。该系统和方法的实施例提供了用于微型装置的红外透射密封盖。可以通过首先在红外线透射基板的表面上形成小的亚波长特征并用蚀刻停止材料涂覆亚波长特征来制造盖子。然后将间隔晶片接合到红外线传输基板，并且将器件空腔蚀刻到间隔晶片中直到蚀刻停止材料，暴露亚波长特征。然后可以通过将器件晶片结合到盖子上来去除蚀刻停止材料，并且将微器件封装在器件空腔中。

5. 发明申请

WO2007019103A2 METHOD AND APPARATUS FOR SORTING PARTICLES WITH A MEMS DEVICE 审中-公开
标题翻译：用于与MEMS器件分离颗粒的方法和装置
公开(公告)号：WO2007019103A2
公开(公告)日：2007-02-15
申请号：PCT/US2006/029661
申请日：2006-07-31
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER, John, S. , HARLEY, John, C. , HOVEY, Steven, H. , MARTIN, Richard, T. , NGUYEN, Hung , RUBEL, Paul, J.
发明人： FOSTER, John, S. , HARLEY, John, C. , HOVEY, Steven, H. , MARTIN, Richard, T. , NGUYEN, Hung , RUBEL, Paul, J.
IPC分类号： C12Q1/00 , C12M1/34 , H01L21/00
CPC分类号： C12M47/04 , A61M1/36 , A61M1/3633 , A61M1/3678 , A61M2202/0437 , B01L3/5027 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575
摘要： A micromechanical particle sorting chip uses laser light directed through at least one of a reflective and refractive surface to come to a focus in an optically transparent layer. The laser light impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromemchanical actuator is activated, which directs the particle of interest into one of a plurality of possible exit paths.
摘要翻译：微机械粒子分选芯片使用通过反射和折射表面中的至少一个引导的激光在光学透明层中进行聚焦。激光照射在感兴趣的颗粒上，使其发出荧光。在检测到荧光时，微机械致动器被激活，其将感兴趣的颗粒引导到多个可能的出口路径中的一个。

6. 发明申请

WO2006127256A3 MICROFABRICATED CROSS FLOW FILTER AND METHOD OF MANUFACTURE 审中-公开
标题翻译：微波交错流过滤器及其制造方法
公开(公告)号：WO2006127256A3
公开(公告)日：2009-04-16
申请号：PCT/US2006017743
申请日：2006-05-05
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER JOHN S , HOVEY STEVEN H , MARTIN RICHARD T , RUBEL PAUL J , NGUYEN HUNG D , HARLEY JOHN C
发明人： FOSTER JOHN S , HOVEY STEVEN H , MARTIN RICHARD T , RUBEL PAUL J , NGUYEN HUNG D , HARLEY JOHN C
IPC分类号： B01D63/00
CPC分类号： B01D61/14 , B01D63/00 , B01D65/08 , B01D67/0062 , B01D69/02 , B01D2321/2058 , G01N1/4077
摘要： A microfabricated cross flow filter may have multiple filtration stages. The filtration stages may include microfabricated filter barriers and gaps created in a substrate, thereby allowing very tight tolerances in the filter barrier and gap dimensions to be maintained. Using the microfabrication techniques, the filter barriers can be made having arbitrary shapes, and arranged at an angle or curved with respect to the flow direction, making the pressure drop across the filtration stage more uniform in the cross flow direction.
摘要翻译：微制造的交叉流过滤器可以具有多个过滤阶段。过滤阶段可以包括微制造的过滤器屏障和在衬底中产生的间隙，从而允许保持过滤器屏障和间隙尺寸的非常严格的公差。使用微细加工技术，过滤器屏障可以制成具有任意形状，并且以相对于流动方向成一定角度或弯曲的方式布置，使跨越过滤台的压降在横向方向上更均匀。

7. 发明申请

WO2007019103A3 METHOD AND APPARATUS FOR SORTING PARTICLES WITH A MEMS DEVICE 审中-公开
标题翻译：用于与MEMS器件分离颗粒的方法和装置
公开(公告)号：WO2007019103A3
公开(公告)日：2007-07-05
申请号：PCT/US2006029661
申请日：2006-07-31
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER JOHN S , HARLEY JOHN C , HOVEY STEVEN H , MARTIN RICHARD T , NGUYEN HUNG , RUBEL PAUL J
发明人： FOSTER JOHN S , HARLEY JOHN C , HOVEY STEVEN H , MARTIN RICHARD T , NGUYEN HUNG , RUBEL PAUL J
IPC分类号： G01N1/10 , A61M1/36 , B01L3/00 , C12M1/34 , C12Q1/00 , G01N15/02 , G01N21/05 , G01N21/64 , H01L21/00
CPC分类号： C12M47/04 , A61M1/36 , A61M1/3633 , A61M1/3678 , A61M2202/0437 , B01L3/5027 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575
摘要： A micromechanical particle sorting chip (300) uses laser light (305) directed through at least one of a reflective (360) and refractive (310) surface to come to a focus (320) in an optically transparent layer. The laser light (305) impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromechanical actuator (400) is activated, which directs the particle of interest into one of a plurality of possible exit paths.
摘要翻译：微机械粒子分选芯片（300）使用穿过反射（360）和折射（310）表面中的至少一个的激光（305）到达光学透明层中的聚焦（320）。激光（305）撞击感兴趣的颗粒，使其发荧光。在检测到荧光时，微机械致动器（400）被激活，其将感兴趣的颗粒引导到多个可能的出口路径中的一个。

8. 发明申请

WO2008042304A3 INTERCONNECT STRUCTURE USING THROUGH WAFER VIAS AND METHOD OF FABRICATION 审中-公开
公开(公告)号：WO2008042304A3
公开(公告)日：2008-04-10
申请号：PCT/US2007/021014
申请日：2007-10-01
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER, John, S. , HOVEY, Steven, H. , RUBEL, Paul, J. , RYBNICEK, Kimon
发明人： FOSTER, John, S. , HOVEY, Steven, H. , RUBEL, Paul, J. , RYBNICEK, Kimon
IPC分类号： H01L21/44 , H01L23/52
摘要： A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.

9. 发明申请

WO2008042304A2 INTERCONNECT STRUCTURE USING THROUGH WAFER VIAS AND METHOD OF FABRICATION 审中-公开
标题翻译：采用晶圆VIAS的互连结构及制造方法
公开(公告)号：WO2008042304A2
公开(公告)日：2008-04-10
申请号：PCT/US2007021014
申请日：2007-10-01
申请人： INNOVATIVE MICRO TECHNOLOGY , FOSTER JOHN S , HOVEY STEVEN H , RUBEL PAUL J , RYBNICEK KIMON
发明人： FOSTER JOHN S , HOVEY STEVEN H , RUBEL PAUL J , RYBNICEK KIMON
IPC分类号： H01L29/06 , H01L21/30
CPC分类号： B81B7/007 , B81B2201/014 , B81B2207/092
摘要： A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
摘要翻译：描述了一种装置和方法，其密封腔体内的至少一个微结构。至少一个微结构的电通路由穿过通孔衬底形成的穿透晶片通孔提供，该通孔衬底在其前侧支撑至少一个微结构。通孔基板和盖晶片可以形成封闭至少一个微结构的气密空腔。贯通晶片通孔通过形成在通孔衬底的背侧上的互连结构连接到位于空腔外部的接合焊盘。因为它们在空腔外部，所以可以将键合焊盘放置在形成空腔的键合线的周边内，由此大大减小了器件占用的面积。晶圆通孔还缩短了微结构和互连之间的电路长度，从而改善了器件中的传热和信号损耗。

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