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    • 1. 发明公开
    • CARD SUBSTRATE WARPAGE REDUCTION
    • 卡片基板翘曲降低
    • EP3172050A1
    • 2017-05-31
    • EP14748077.6
    • 2014-07-22
    • Assa Abloy ABHoffman, Ted, M.
    • HOFFMAN, Ted, M.LIEN, Brent, D.
    • B32B37/06B32B3/16B32B38/10B42D25/45G06K19/077
    • B32B37/025B32B7/06B32B7/12B32B27/10B32B37/0015B32B37/06B32B38/0036B32B38/10B32B38/145B32B38/18B32B2307/748B32B2309/70B32B2425/00B32B2429/00
    • Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.
    • 本发明的实施例涉及减少衬底翘曲的转移层压工艺和设备。 在一些实施例中,使用转印层压装置(100)来执行转印层压过程,所述转印层压装置包括具有载体层(114)的转印单元(120),基板旋转器(164)和转印带(110) 附接到载体层的转印层(112)。 在转印层压工艺的一些实施例中,使用转印单元将转印层的转印部分(121)从载体层转印(160)到基板(104)的第一表面(122)。 在该转印步骤的一些实施例中,使用转印单元将转印部分加热并压在基板的第一表面上,并且将载体层从转印部分分离。 然后使用衬底旋转器将衬底104倒转(162)。 然后使用转印单元加热(170)与第一表面相对的基板的第二表面(168)的至少一部分,而不将转印层转印到第二表面的该部分。
    • 3. 发明申请
    • CREDENTIAL PRODUCTION PRINT RIBBON AND TRANSFER RIBBON CARTRIDGES
    • 标准生产印刷和转印罗盘
    • WO2008108905A1
    • 2008-09-12
    • PCT/US2008/000853
    • 2008-01-23
    • FARGO ELECTRONICS, INC.HOFFMAN, Ted, M.
    • HOFFMAN, Ted, M.
    • B41J32/00B42D15/10G06K19/10
    • B41J17/32B41J17/42B41J32/02
    • A ribbon cartridge (110, 114) for use in a credential production device (100) is disclosed. The ribbon cartridge (110, 114) includes a take-up spool (120, 124), a supply spool (118, 122) and a ribbon (112, 116) wound on the supply (118, 122) and take-up spools (120, 124). The supply spool (118, 122) includes a loaded condition, in which a majority of the ribbon (112, 116) is wound on the supply spool (118, 122) and a minority of the ribbon (112, 116) is wound on the take-up spool (120, 124). The take-up spool (120, 124) includes a loaded condition, in which a majority of the ribbon (112, 116) is wound on the take-up spool (120, 124) and a minority of the ribbon (112, 116) is wound on the supply spool (118, 122). The ribbon (112, 116) wound on the supply spool (118, 122) in the loaded condition extends into the space occupied by the ribbon (112, 116) wound on the take-up spool (120, 124) when the take-up spool (120, 124) is in the loaded condition.
    • 公开了一种用于凭证制作装置(100)中的色带盒(110,114)。 色带盒(110,114)包括卷绕卷轴(120,124),供给卷轴(118,122)和缠绕在供应件(118,122)上的带子(112,116)和卷取卷轴 (120,124)。 供应卷轴(118,122)包括装载状态,其中大部分的带状物(112,116)缠绕在供给卷轴(118,122)上,并且少数的带状物(112,116)被卷绕在 卷取卷轴(120,124)。 卷取卷轴(120,124)包括装载状态,其中大部分的带状物(112,116)缠绕在卷取卷轴(120,124)上,少数的带状物(112,116) )缠绕在供给卷轴(118,122)上。 卷绕在供给卷轴(118,122)上的带状物(112,116)在加载状态下延伸到缠绕在卷取卷轴(120,124)上的带状物(112,116)占据的空间中, 上升阀芯(120,124)处于加载状态。
    • 5. 发明申请
    • CARD SUBSTRATE WARPAGE REDUCTION
    • 卡底板保温减少
    • WO2016014027A1
    • 2016-01-28
    • PCT/US2014/047550
    • 2014-07-22
    • ASSA ABLOY ABHOFFMAN, Ted, M.
    • HOFFMAN, Ted, M.LIEN, Brent, D.
    • B32B37/06B32B3/16B32B38/10B42D25/45G06K19/077
    • B32B37/025B32B7/06B32B7/12B32B27/10B32B37/0015B32B37/06B32B38/0036B32B38/10B32B38/145B32B38/18B32B2307/748B32B2309/70B32B2425/00B32B2429/00
    • Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device (100), which includes a transfer unit (120), a substrate rotator (164), and a transfer ribbon (110) having a carrier layer (114) and a transfer layer (112) attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section (121) of the transfer layer is transferred (160) from the carrier layer to a first surface (122) of a substrate (104) using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate 104 is then inverted (162) using the substrate rotator. At least a portion of a second surface (168) of the substrate that is opposite the first surface is then heated (170) using the transfer unit without transferring the transfer layer to the portion of the second surface.
    • 本发明的实施例涉及一种减少基板翘曲的转印层压方法和装置。 在一些实施例中,使用包括转印单元(120),基底旋转器(164)和具有载体层(114)的转印带(110)的转印层压装置(100)进行转印层压工艺,并且 附接到载体层的转移层(112)。 在转移层压方法的一些实施方案中,使用转移单元将转移层的转移部分(121)从载体层转移(160)到基底(104)的第一表面(122)。 在该转印步骤的一些实施方案中,使用转印单元将转印部分加热并压靠在基板的第一表面上,并且将载体层从转印部分分离。 然后使用衬底旋转器将衬底104反转(162)。 然后使用转印单元将基片的与第一表面相对的第二表面(168)的至少一部分加热(170),而不将转印层转印到第二表面的部分。