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1. 发明专利

JPH10198572A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH10198572A
公开(公告)日：1998-07-31
申请号：JP344697
申请日：1997-01-13
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： UMETSU MASAMI
IPC分类号： G06F9/34 , G06F9/46 , G06F9/48
摘要： PROBLEM TO BE SOLVED: To sharply improve real time performance without any necessity of the setting or reference processing of the control state of an OS(operating system) by a system call or an interrupting handler or the like. SOLUTION: A CPU is provided with an OS status register 15d for storing management information for managing the OS state, and a control unit operates the setting and reference of the management information in this OS status register 15d for operating the status management of the OS. Bits 0-3 are allocated as kernel nest count bits, bits 4-7 are allocated as kernel mask level bits, bits 8-29 are allocated as status information bit, and bits 30 and 31 are allocated as bits in which system control information is stored in the 32 bit constitution OS status register 15d.

2. 发明专利

JPH10109330A MOLD DEVICE, GATE CUTTING, AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH10109330A
公开(公告)日：1998-04-28
申请号：JP26450696
申请日：1996-10-04
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： SHIMANUKI YOSHIHIKO
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29C45/38 , B29K105/20 , B29L31/34 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To improve the efficiency of cutting of a residual resin formed in a resin passage such as a gate. SOLUTION: A residual resin 16b to be formed in the gate, flow cavity and resin reservior of a mold is formed in such a manner that the cross section shape of the resin in a mold-mating direction is rhombic, when resin moldings are made. After that, the residual resin 16b is cut with the help of a punch 20 by applying a load to the residual resin 16b formed by the flow cavity in the twisting direction and twisting the part near the base of the residual resin 16b.

3. 发明专利

JPH109830A METHOD AND EQUIPMENT FOR MEASUREMENT AND METHOD AND EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR 失效
公开(公告)号：JPH109830A
公开(公告)日：1998-01-16
申请号：JP16036496
申请日：1996-06-21
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： SUZUKI TAKESHI , TANAKA YUICHI , SOGA SATOSHI
IPC分类号： G01B11/08 , H01L21/60 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve the measuring accuracy in a measured value of the size of a material to be measured, such as an Au (gold) ball, and also to improve the operating efficiency of a measuring operation. SOLUTION: This equipment for measurement comprises a stage 4 for measurement which supports and moves an Au ball 3b formed in the wire end part of an Au wire being used in wire bonding, a CCD camera 5 which picks up an image of the Au ball 3b supported by the stage 4, an image processing part 6 which determines the size of the Au ball 3b by conducting an image processing on the basis of the information on the image of the Au ball 3b picked up by the CCD camera 5, a monitor 7 which displays the result 5a of the image processing and a printer 8 which outputs the information 8a on the size of the Au ball 3b determined by the image processing part 6, and measurement of the size of the Au ball 3b is conducted automatically by the image processing part 6.

4. 发明专利

JPH09309085A CONVEYING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE USING THE CONVEYING DEVICE 失效
公开(公告)号：JPH09309085A
公开(公告)日：1997-12-02
申请号：JP12797396
申请日：1996-05-23
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAKAHASHI NORIYUKI , NAKANISHI MASAKI
IPC分类号： B25J15/06 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To eliminate a need for a complicated mechanism, such as an reversing mechanism and to reliably convey a semiconductor device, the mounting surface of which is up, through a simple mechanism. SOLUTION: An elastic soft material 5 formed of a sponge, such as polyester, having a given thickness and a flat surface and excellent air permeability is arranged at the tip part of a chuck head 4 securely sucking a semiconductor S1 arranged at a conveyance mechanism. By effecting vacuum suction as the elastic soft material 5 is pressed against the semiconductor device S1 with a given pressure, the elastic soft material 5 is deformed along the shape of the bump B of the semiconductor device S1, and the elastic soft material 15 is reliably adhered to and securely sucked to even the semiconductor device S1 the mounting surface of which is up at an inspection process.

5. 发明专利

JPH09283655A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09283655A
公开(公告)日：1997-10-31
申请号：JP9789296
申请日：1996-04-19
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAKAHASHI NORIYUKI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To improve the adhesion of a semiconductor pellet to a substrate and the adhesive strength of the pellet to the substrate. SOLUTION: This is a semiconductor device, wherein a semiconductor pellet 3 is mounted on the center part on the surface side of a substrate 2, wherein connection pads 2a and 2b are respectively formed on both surfaces of the surface and rear of the substrate 2 and both of the pads 2a and 2b are connected with each other via a multilayer wiring structure 2c formed in the interior of the substrate 2, via a bonding material 5 and at the same time, a gold plating or the like is applied to the center part, whereby an island 1 formed at a high flatness is formed and with the pellet 3 connected electrically with the pads 2a via wires 4, it is hermetically sealed with a molding resin 6 and a ball grid array consisting of a plurality of metal balls 7 is arranged on the pads 2b on the rear of the substrate 2.

6. 发明专利

JPH09275180A LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING IT AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH09275180A
公开(公告)日：1997-10-21
申请号：JP8024296
申请日：1996-04-02
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： SATO YOSHIAKI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To avoid cracking semiconductor elements. SOLUTION: The lead frame comprises a tab 3 which mounts a semiconductor chip and has many small holes 3b at an element mounting face 3a, tab hanging leads 4 for supporting the tab 3, leads 5 electrically connected to the chip 2, dams 6 for blocking a resin from flowing out during the resin sealing, and frame 7 for supporting the leads with its outer top ends. The tab 3 has the many holes 3b approximately and uniformly dispersed over the entire element mounting face 3a like a net mesh.

7. 发明专利

JPH09160775A BRANCH INSTRUCTION ISSUING METHOD, MICROCOMPUTER AND REAL-TIME SYSTEM USING THE MICROCOMPUTER 失效
公开(公告)号：JPH09160775A
公开(公告)日：1997-06-20
申请号：JP32335995
申请日：1995-12-12
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAIRA TSUYAKO
IPC分类号： G06F9/32
摘要： PROBLEM TO BE SOLVED: To make it possible to judge 'equal', 'less than' and 'more than', i.e., the fundamentals of data comparison results by a single instruction and then to shorten the time to judge for processing and branching in an assembly language program. SOLUTION: A single chip microcomputer consists of a CPU, a ROM, a RAM, an interruption controller, a bus state controller, a serial communication interface, an A/D converter and an input/output port. When the CPU performs the control based on the system and the application program which are stored in the ROM, a data comparison instruction is issued (201) and then a 3-direction conditional branch instruction is issued (202). Thus, the processing is branched into 'less than', 'equal' or 'more than', and the next processing is carried out (203 to 205).

8. 发明专利

JPH09115935A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09115935A
公开(公告)日：1997-05-02
申请号：JP27381195
申请日：1995-10-23
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： SHIMANUKI YOSHIHIKO
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To suppress the move of a tab at the time of molding by covering the outer surface of a semiconductor chip and an electrical connection part, forming an inner fixing part for fixing these, and forming a resin package using a molding device with the inner fixing part outside. SOLUTION: An inner fixing part 15 is formed by silicone, the outer surface of a semiconductor chip 12 and a wire 14 are covered, at the same time the wire 14 and the tip portion of a lead 13 and then the tip of the lead 13 and a tab are mutually fixed. While a lower mold 31 and an upper mold 32 of a molding device 30 are subjected to mold registration, a molten resin is filled into a mold cavity 33, thus forming a package made of resin corresponding to the shape of the mold cavity 33. The wire 14 is fixed, thus preventing the wire 14 and a tab 11 from being deformed owing to the flow of resin filled into the mold cavity 33, thus manufacturing a reliable semiconductor device with improved yield.

9. 发明专利

JPH0991426A IMAGE PROCESSING METHOD 失效
公开(公告)号：JPH0991426A
公开(公告)日：1997-04-04
申请号：JP24277695
申请日：1995-09-21
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： YAMADA SHIGECHIKA
IPC分类号： G06K9/38 , G06T7/00 , G06T7/60
摘要： PROBLEM TO BE SOLVED: To attain high speed image processing by labelling a noticeable picture element based on comparison with plural adjacent picture elements, generating virtually a background picture element when no adjacent picture element is in existence and labelling all picture elements under the same condition to reduce the labelling processing time. SOLUTION: In the case of conducting labelling processing by comparing a noticeable picture element W with two picture elements P, Q, since the compared picture elements P, Q are in existence in a part within an area D, the noticeable picture element W is labelled. However, both the picture elements P, Q are not in existence in an area A, the picture element P is not in existence in an area B, the picture element Q is not in existence in an area C, and no image is in existence at the outside of the areas A to C, then a background image is virtually generated at the outside of the areas in order to make label discrimination with the same condition as the area D. Thus, it is not required to make area division and label discrimination for each area and then the processing time is reduced.

10. 发明专利

JPH0945442A HANDLING METHOD FOR IC SOCKET AND SEMICONDUCTOR DEVICE USING IT 失效
公开(公告)号：JPH0945442A
公开(公告)日：1997-02-14
申请号：JP19134595
申请日：1995-07-27
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAKAHASHI MOTOMU
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide an IC socket by which leads of a semiconductor device and contact pins are brought into contact with each other soon after the conveying thereof. SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor device 2 at a predetermined position, a contact pin 4 which is fitted to the socket main body 1 and connects the semiconductor device 2 and a predetermined test circuit 3, a suction pad 6 which is set on the bottom face portion 1b of the socket main body 1 so as to open on the device mounting portion 1a, and negative pressure-sucks one side face of the semiconductor device 2 on the device mounting portion 1a so that leads 2a provided thereto are pushed to contact pins 4. The suction pad 6 protrudes from the bottom face portion 1b by such a length as the leads 2a are brought into the most suitable contact state with the contact pins 4 when the same sucks the semiconductor device 2.

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