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    • 1. 发明申请
    • LIGHTING DEVICE PACKAGE
    • 照明设备包
    • WO2008003167A1
    • 2008-01-10
    • PCT/CA2007/001184
    • 2007-07-05
    • TIR TECHNOLOGY LPHARRAH, ShaneSPEIER, IngoSCHICK, Philippe
    • HARRAH, ShaneSPEIER, IngoSCHICK, Philippe
    • H01L33/00H01L21/00H01L23/28
    • H01L33/56H01L33/64H01L2224/48465H01L2224/73265
    • The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around the one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein this cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame defines one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity.
    • 本发明提供了一种照明装置封装,其具有可操作地耦合到基板的一个或多个发光元件和至少部分地围绕所述一个或多个发光元件设置的框架。 框架和基底限定了一个或多个发光元件定位在其中的空腔,其中该空腔可以被光学透射系统基本上包围。 空腔的至少一部分可以用封装材料填充。 框架限定一个或多个通道,其中每个通道通过外部端口将空腔与外部相互连接。 例如,当照明装置封装处于组装状态时,外部端口可以从环境接近,从而使得封装材料能够流体地移动到和/或离开空腔。
    • 4. 发明申请
    • BENDABLE HIGH FLUX LED ARRAY
    • 可弯曲的高频LED阵列
    • WO2007000037A1
    • 2007-01-04
    • PCT/CA2005/001010
    • 2005-06-29
    • MITCHELL, Richard, J.HARRAH, Shane
    • HARRAH, Shane
    • H01L27/15H01L23/34H01L23/48H01L25/13
    • F21V29/89F21K9/00F21V29/70F21Y2115/10H01L25/0753H01L33/62H01L2224/48465H01L2224/73265H01L2924/19107H05K1/0203H05K1/182H05K1/189H05K3/202Y10S362/80H01L2224/48091H01L2924/00014
    • A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.
    • 根据本发明的可弯曲发光二极管(LED)阵列包括散热器,设置在每个散热器上方的电介质材料,以及设置在这些散热器上方的可弯曲电互连层,并且通过电介质材料与这些散热器电绝缘。 至少一个通孔穿过每个散热器上方的电介质材料,并且至少一个LED管芯设置在每个通孔上方。 可弯曲的电互连层可以是包括金属通路的引线框架,该金属通路将一些或所有LED骰子串联,并联,反并联或以这些配置的某种组合串联连接。 每个通孔都包含与其下方相应的散热器热接触的导热材料,并与其上方的相应的LED管芯热接触。 在一些实施例中,LED骰子可以热和电耦合到设置在相应的散热器上方的底座。
    • 5. 发明申请
    • LIGHTING DEVICE PACKAGE
    • 照明设备包
    • WO2008052327A1
    • 2008-05-08
    • PCT/CA2007/001934
    • 2007-10-31
    • TIR TECHNOLOGY LPHARRAH, Shane
    • HARRAH, Shane
    • H01L23/02H01L33/00
    • H01L33/54H01L25/0753H01L33/483H01L33/58H01L2224/48091H01L2924/00H01L2924/00014
    • The present invention provides a lighting device package that is configured to enable degassing of the lighting device package. The lighting device package comprises a substrate upon which is operatively mounted one or more light-emitting elements and a retaining structure which is coupled to the substrate and configured to circumscribe the one or more light-emitting elements. In addition, the lighting device package includes an optically transmissive element, wherein two or more supports are configured to provide a separation between the optically transmissive element and the substrate or retaining structure. The volume defined by the substrate, retaining structure and the optically transmissive element, is partially or completely filled with an encapsulation material, thereby forming the lighting device package. In particular, the supports create a series of openings for the volume defined by the substrate, retaining structure and the optically transmissive element, wherein these openings provide for movement of fluid therethrough.
    • 本发明提供了一种被配置为能够使照明装置包装脱气的照明装置包装。 照明器件封装包括其上可操作地安装有一个或多个发光元件的衬底和耦合到衬底并被配置为围绕一个或多个发光元件的保持结构。 此外,照明器件封装包括光学透射元件,其中两个或更多个支撑件被配置为提供光学透射元件与衬底或保持结构之间的间隔。 由衬底,保持结构和光学透射元件限定的体积部分地或完全地被封装材料填充,由此形成照明器件封装。 特别地,支撑件为由基板,保持结构和光学透射元件限定的体积产生一系列开口,其中这些开口提供流体通过其移动。
    • 8. 发明申请
    • LIGHTING DEVICE PACKAGE
    • 照明设备包
    • WO2008003176A1
    • 2008-01-10
    • PCT/CA2007/001196
    • 2007-07-06
    • TIR TECHNOLOGY LPASHDOWN, IanHARRAH, Shane
    • ASHDOWN, IanHARRAH, Shane
    • H01L33/00H01L23/28
    • H01L33/54H01L25/0753H01L33/56H01L2224/48091H01L2224/48465H01L2924/00H01L2924/00014
    • The invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate; a compound lens disposed to interact with light emitted by the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light-emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
    • 本发明提供了一种照明装置封装,其具有可操作地耦合到衬底的一个或多个发光元件; 复合透镜,设置成与由一个或多个发光元件发射的光相互作用,所述复合透镜至少包括内透镜元件和外透镜元件,所述内透镜元件具有第一折射率和所述外透镜元件 具有第二折射率,所述第一折射率大于所述第二折射率; 所述复合透镜,所述一个或多个发光元件和所述基板在其间限定封闭空间; 以及填充所述空间的至少一部分的封装材料,所述封装材料具有等于或大于所述第一折射率的第三折射率。