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1. 发明授权

US09240364B2 Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device 有权
标题翻译：用于散热的粘合膜，包括其的半导体器件以及半导体器件的制造方法
公开(公告)号：US09240364B2
公开(公告)日：2016-01-19
申请号：US14202006
申请日：2014-03-10
申请人： Baek Soung Park , Jae Won Choi , In Hwan Kim , Gyu Seok Song , Su Mi Lim
发明人： Baek Soung Park , Jae Won Choi , In Hwan Kim , Gyu Seok Song , Su Mi Lim
IPC分类号： H01L23/48 , H01L23/373 , H01L23/36 , H01L21/48 , H01L25/065 , H01L23/31
CPC分类号： H01L23/3737 , H01L21/4882 , H01L23/3121 , H01L23/36 , H01L25/0657 , H01L2224/16145 , H01L2224/45139 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2924/181 , Y10T428/2848 , H01L2924/00 , H01L2224/45099 , H01L2924/01049 , H01L2924/01004 , H01L2924/00012
摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.
摘要翻译：散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大。

2. 发明授权

US07010412B1 Method for calculating parameters in road design of S-type clothoid, complex clothoid and egg type clothoid 失效
标题翻译：用于计算S型回旋曲线，复合回旋曲线和卵型回旋曲线道路设计参数的方法
公开(公告)号：US07010412B1
公开(公告)日：2006-03-07
申请号：US11015932
申请日：2004-12-17
申请人： Gyu-Seok Song
发明人： Gyu-Seok Song
IPC分类号： G09B25/06 , G06T17/00
CPC分类号： E01C1/00 , G09B25/06
摘要： The present invention relates to a method for calculating parameters in a road design of a S type, a complex type and an egg type clothoid, and in particular to a method for calculating a parameter value capable of determining the size of a clothoid that is inserted when designing a S-shaped and interchange, a connection road, etc. in an egg shape. In the present invention, it is possible to easily calculate the clothoid parameter A in a S shape, complex type and egg type road design, and a road design can be fast finished. In addition, in the present invention, it is possible to achieve an easier design of a S shape and egg type clothoid by determining a design specification without using CAD. The design can be achieved based on a simulation using a center coordinate of two circles for achieving an optimum design.
摘要翻译：本发明涉及一种用于计算S型，复合型和蛋型回旋曲线的道路设计中的参数的方法，特别涉及一种用于计算能够确定插入的回旋曲线的大小的参数值的方法当设计一个S形和交换，一个连接道路等蛋形。在本发明中，可以容易地计算S形，复合型和蛋式道路设计中的回旋参数A，并且可以快速完成道路设计。此外，在本发明中，通过在不使用CAD的情况下确定设计规格，可以实现S形和卵型回旋曲的更容易的设计。可以基于使用两个圆的中心坐标的模拟来实现设计以实现最佳设计。

3. 发明申请

US20140353848A1 ADHESIVE FILM FOR HEAT DISSIPATION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE 有权
标题翻译：用于散热的粘合膜，包括其的半导体器件以及制造半导体器件的方法
公开(公告)号：US20140353848A1
公开(公告)日：2014-12-04
申请号：US14202006
申请日：2014-03-10
申请人： Baek Soung PARK , Jae Won CHOI , In Hwan KIM , Gyu Seok SONG , Su Mi LIM
发明人： Baek Soung PARK , Jae Won CHOI , In Hwan KIM , Gyu Seok SONG , Su Mi LIM
IPC分类号： H01L23/373 , H01L21/48
CPC分类号： H01L23/3737 , H01L21/4882 , H01L23/3121 , H01L23/36 , H01L25/0657 , H01L2224/16145 , H01L2224/45139 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2924/181 , Y10T428/2848 , H01L2924/00 , H01L2224/45099 , H01L2924/01049 , H01L2924/01004 , H01L2924/00012
摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.
摘要翻译：散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大。

4. 发明申请

US20130154125A1 ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
标题翻译：粘合膜和包括其的电子设备
公开(公告)号：US20130154125A1
公开(公告)日：2013-06-20
申请号：US13713679
申请日：2012-12-13
申请人： Hye Jin KIM , Jae Won CHOI , Ji Ho KIM , Jin Man KIM , Gyu Seok SONG
发明人： Hye Jin KIM , Jae Won CHOI , Ji Ho KIM , Jin Man KIM , Gyu Seok SONG
IPC分类号： C09J163/00 , H01L23/00
CPC分类号： C09J163/00 , C08G59/504 , C08G59/56 , C08G59/621 , H01L24/29 , H01L24/32 , H01L24/50 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/32225 , H01L2224/83101 , H01L2924/12043 , H01L2924/181 , H01L2924/00
摘要： An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.
摘要翻译：粘合剂膜包括胺固化剂和酚类固化剂，并且在固化后在170℃下在80℃以上固化后的储能模量与在40℃下的储能模量之比在约1.5的范围内至约3.0。

5. 发明授权

US08309219B2 Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same 有权
标题翻译：用于半导体封装的多功能带和使用其的半导体器件的制造方法
公开(公告)号：US08309219B2
公开(公告)日：2012-11-13
申请号：US12881577
申请日：2010-09-14
申请人： Yong Ha Hwang , Jae Hyun Cho , Gyu Seok Song , Chang Beom Chung
发明人： Yong Ha Hwang , Jae Hyun Cho , Gyu Seok Song , Chang Beom Chung
IPC分类号： H01L21/48 , H01L21/78 , B32B7/12
CPC分类号： H01L21/6835 , C09J7/20 , C09J7/35 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L21/568 , H01L21/6836 , H01L23/3114 , H01L24/27 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2224/16 , H01L2224/274 , H01L2224/29082 , H01L2224/73104 , H01L2224/83191 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , Y10T428/2848 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer.
摘要翻译：一种用于半导体封装的多功能带，并且被配置为在其上具有多个器件的半导体衬底的器件形成侧上结合，同时进行研磨与器件形成侧相对的半导体衬底的侧面的工艺，以及使用具有与半导体衬底的接地侧结合的可UV固化粘合剂层的切割带将半导体衬底切割成单个芯片，多功能带被粘合到各个芯片，而各个芯片通过切割工艺彼此分离，并且使用其制造使用该半导体器件的半导体器件的方法，所述多功能带包括基膜; 在基膜的一侧上的UV固化粘合剂层; 以及粘合剂层上的第一和第二粘结层。

6. 发明申请

US20110159294A1 ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME 审中-公开
标题翻译：用于半导体组件的连接薄膜组合物及其连接膜
公开(公告)号：US20110159294A1
公开(公告)日：2011-06-30
申请号：US12981110
申请日：2010-12-29
申请人： Gyu Seok Song , Jong Pil Ho , Jae Won Choi , Su Mi Im , Ki Tae Song
发明人： Gyu Seok Song , Jong Pil Ho , Jae Won Choi , Su Mi Im , Ki Tae Song
IPC分类号： C08L63/02 , C08K3/36 , B32B27/38
CPC分类号： C09J163/00 , C08L33/04 , C08L61/06 , C08L2205/03 , Y10T428/31515
摘要： An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 150° C. for 1 hour and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 175° C. for 2 hours.
摘要翻译：用于半导体组件的附着膜组合物包括聚合物粘合剂，环氧树脂，酚醛环氧固化剂，固化促进剂，硅烷偶联剂和无机填料。附着膜组合物在固化时可以具有约300℃以上的放热峰开始温度，并且在150℃下固化后在175℃下的熔体粘度为约1.0×10 5至约5.0×10 6泊。对于 1小时，熔体粘度为约1.0×10 5至约5.0×10 6泊，175℃固化2小时。

7. 发明申请

US20100330780A1 MULTI-FUNCTION TAPE FOR A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：用于半导体封装的多功能带和使用其制造半导体器件的方法
公开(公告)号：US20100330780A1
公开(公告)日：2010-12-30
申请号：US12881577
申请日：2010-09-14
申请人： Yong Ha HWANG , Jae Hyun Cho , Gyu Seok Song , Chang Beom Chung
发明人： Yong Ha HWANG , Jae Hyun Cho , Gyu Seok Song , Chang Beom Chung
IPC分类号： H01L21/78 , B32B7/12
CPC分类号： H01L21/6835 , C09J7/20 , C09J7/35 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L21/568 , H01L21/6836 , H01L23/3114 , H01L24/27 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2224/16 , H01L2224/274 , H01L2224/29082 , H01L2224/73104 , H01L2224/83191 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , Y10T428/2848 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer.
摘要翻译：一种用于半导体封装的多功能带，并且被配置为在其上具有多个器件的半导体衬底的器件形成侧上结合，同时进行研磨与器件形成侧相对的半导体衬底的侧面的工艺，使用具有与半导体衬底的接地侧结合的可UV固化粘合剂层的切割带将半导体衬底切割成单个芯片，多功能带被粘合到各个芯片，而各个芯片通过切割工艺彼此分离，并且使用其制造使用该半导体器件的半导体器件的方法，所述多功能带包括基膜; 在基膜的一侧上的UV固化粘合剂层; 以及粘合剂层上的第一和第二粘结层。

8. 发明申请

US20080160300A1 Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same 审中-公开
标题翻译：用于压敏粘合剂膜，压敏粘合剂膜和包含该粘合剂膜的切割模片接合膜的组合物
公开(公告)号：US20080160300A1
公开(公告)日：2008-07-03
申请号：US12005403
申请日：2007-12-27
申请人： Yong Ha Hwang , Gyu Seok Song , Hee Yeon Ki , Kyoung Jin Ha , Jae Hyun Cho , Jun Suk Kim , Chang Beom Chung
发明人： Yong Ha Hwang , Gyu Seok Song , Hee Yeon Ki , Kyoung Jin Ha , Jae Hyun Cho , Jun Suk Kim , Chang Beom Chung
IPC分类号： B32B7/12 , C08J3/28
CPC分类号： B32B7/12 , C08L33/14 , C08L75/04 , C08L2666/04 , C08L2666/18 , C09J7/20 , C09J133/08 , C09J2201/36 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/1461 , Y10T428/2809 , H01L2924/00 , H01L2924/3512
摘要： A composition, including a polymer binder resin A, a UV-curing acrylate B, a heat curing agent C, and a photopolymerization initiator D. The composition includes about 20 to about 150 parts by weight of the UV-curing acrylate B per 100 parts by weight of the polymer binder resin A, and the UV-curing acrylate B is a solid or near-solid at room temperature and has a viscosity of about 10,000 cps or more at 40° C.
摘要翻译：包含聚合物粘合剂树脂A，UV固化丙烯酸酯B，热固化剂C和光聚合引发剂D的组合物。该组合物包含每100份约20至约150重量份的UV固化丙烯酸酯B 的聚合物粘合剂树脂A，并且UV固化丙烯酸酯B在室温下为固体或近固体，并且在40℃具有约10,000cps或更高的粘度

9. 发明授权

US09169425B2 Adhesive film and electronic device including the same 有权
标题翻译：粘合膜和包括其的电子装置
公开(公告)号：US09169425B2
公开(公告)日：2015-10-27
申请号：US13713679
申请日：2012-12-13
申请人： Hye Jin Kim , Jae Won Choi , Ji Ho Kim , Jin Man Kim , Gyu Seok Song
发明人： Hye Jin Kim , Jae Won Choi , Ji Ho Kim , Jin Man Kim , Gyu Seok Song
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , C09J163/00 , H01L23/00 , C08G59/50 , C08G59/56 , C08G59/62
CPC分类号： C09J163/00 , C08G59/504 , C08G59/56 , C08G59/621 , H01L24/29 , H01L24/32 , H01L24/50 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/32225 , H01L2224/83101 , H01L2924/12043 , H01L2924/181 , H01L2924/00
摘要： An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.
摘要翻译：粘合剂膜包括胺固化剂和酚类固化剂，并且在固化后在170℃下在80℃以上固化后的储能模量与在40℃下的储能模量之比在约1.5的范围内至约3.0。

10. 发明申请

US20120141786A1 ADHESIVE FILM FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体器件的粘合膜
公开(公告)号：US20120141786A1
公开(公告)日：2012-06-07
申请号：US13272550
申请日：2011-10-13
申请人： Dong Seon UH , Gyu Seok SONG , Min Kyu HWANG , Ki Tae SONG , Dae Ho SEO
发明人： Dong Seon UH , Gyu Seok SONG , Min Kyu HWANG , Ki Tae SONG , Dae Ho SEO
IPC分类号： B32B27/38 , C08G69/00 , C08G18/00 , B32B7/12 , C08F210/00
CPC分类号： B32B7/06 , B32B27/08 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/30 , B32B2405/00 , C08G18/6254 , C08G59/08 , C08G2170/40 , C08L2312/08 , C09J7/22 , C09J7/385 , C09J163/00 , C09J175/04 , C09J2201/606 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/29084 , H01L2224/2919 , H01L2224/2929 , H01L2224/29388 , H01L2224/32145 , H01L2224/83191 , H01L2224/94 , H01L2924/00013 , H01L2924/061 , H01L2924/0615 , H01L2924/0635 , H01L2924/0665 , H01L2924/0675 , H01L2924/068 , H01L2924/07025 , H01L2924/0705 , Y10T428/28 , Y10T428/31515 , H01L2224/27 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
摘要： An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C.
摘要翻译：一种用于半导体器件的粘合膜，该粘合膜包括在0至5℃下具有约50至约150μm/ m·℃的线性膨胀系数的基膜。

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