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    • 3. 发明授权
    • Integrated optics chip with reduced thermal errors due to pyroelectric
effects
    • 集成光学芯片,由于热电效应而具有减少的热误差
    • US6044184A
    • 2000-03-28
    • US123955
    • 1998-07-28
    • Kenneth W. ShaferHenry C. AbbinkJohn P. RahnChristine E. GeoslingGregory A. Zimmerman
    • Kenneth W. ShaferHenry C. AbbinkJohn P. RahnChristine E. GeoslingGregory A. Zimmerman
    • H01L33/00G02B6/12G02B6/30G02F1/035H01L31/0232
    • G02F1/035G02F2203/21
    • An integrated optics chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optics chip or MIOC has a top surface, a +Z face and -Z face. The integrated optics chip is formed from a crystal substrate having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.
    • 公开了当暴露于变化的温度时具有改进的性能的集成光学芯片。 光学芯片或集成光学芯片或MIOC具有顶面,+ Z面和-Z面。 集成光学芯片由具有高电光系数的晶体衬底形成,例如铌酸锂。 为了将元件定向到要描述的光学芯片,+ Z晶体轴从+ Z面向外延伸,Z轴是表示热电效应的轴。 顶面与Z轴正交。 顶表面上的输入波导接收来自输入端口的光信号,将信号经由波导网络传递到将波导网络耦合到输出端口的输出波导。 至少部分地用导电涂层涂覆一部分+ Z和-Z面。 导电路径耦合+ Z和-Z面,以防止由于光学芯片的温度变化和热电效应而在+ Z和-Z面之间产生电荷差异。
    • 5. 发明授权
    • Dual purpose input electrode structure for MIOCs (multi-function
integrated optics chips)
    • 用于MIOC的双用途输入电极结构(多功能集成光学芯片)
    • US6128424A
    • 2000-10-03
    • US124457
    • 1998-07-28
    • Lorrie L. GamppGregory A. ZimmermanChristine E. GeoslingJohn P. Rahn
    • Lorrie L. GamppGregory A. ZimmermanChristine E. GeoslingJohn P. Rahn
    • G02B6/12G02F1/035G02F1/313
    • G02F1/3137G02F1/035G02F2203/21
    • An Integrated Optics Chip with improved performance when exposed to rapidly changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face. An input waveguide formed in the top surface of the chip and orthogonal to the +Z axis receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. Metalization is applied to the top face of the optic chip to form at least a first and a second rail. The first and second rails are positioned to very closely straddle a portion of the input waveguide. A conductive bridge connects the first and second rails to prevent a charge differential from developing between the first and second rails.
    • 公开了当暴露于快速变化的温度时具有改进的性能的集成光学芯片。 光学芯片或集成光学芯片或MIOC具有顶面,+ Z面和-Z面。 芯片由具有高电光系数的晶体形成,例如铌酸锂。 为了将组件定向到要描述的光学芯片,+ Z晶体轴从+ Z面向外延伸。 形成在芯片的顶表面并与+ Z轴正交的输入波导接收来自输入端口的光信号,将信号经由波导网络传递到将波导网络耦合到输出端口的输出波导。 将金属化施加到光学芯片的顶面以形成至少第一和第二导轨。 第一和第二轨道定位成非常紧密地跨越输入波导的一部分。 导电桥连接第一和第二导轨,以防止电荷差异在第一和第二导轨之间形成。