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    • 1. 发明申请
    • HIGH-MOLECULAR-WEIGHT COPOLYMER
    • 高分子量共聚物
    • US20120123076A1
    • 2012-05-17
    • US13384929
    • 2010-08-04
    • Eiji TakahashiShinji MarumoGou Mishima
    • Eiji TakahashiShinji MarumoGou Mishima
    • C08F220/10
    • C08F297/02C08F2/06C08F4/48C08F12/22C08F12/24C08F220/18
    • It is an object of the present invention to provide (1) a copolymer for a cured product that is satisfactory in properties, such as adhesion properties, as a chip stacking adhesive or the like. The present invention is a copolymer comprising repeating units represented by formula (I), formula (II), and formula (III), (wherein R1, R2, and R3 each independently represent a hydrogen atom or a methyl group, R4 represents an alkyl group or a cycloalkyl group, R5 represents a hydrogen atom or a C1 to C6 alkyl group, m, n, and k represent a molar ratio of the respective repeating units, m represents a positive number of 0 or more and less than 1, n and k each independently represent a positive number, and satisfy a relation of m+n+k=1), and having a weight-average molecular weight in the range of 50,000 to 200,000.
    • 本发明的目的是提供(1)作为芯片堆叠粘合剂等具有令人满意的固化产物等粘合性能的共聚物。 本发明是包含由式(I),式(II)和式(III)表示的重复单元的共聚物,其中R 1,R 2和R 3各自独立地表示氢原子或甲基,R 4表示烷基 基团或环烷基,R5表示氢原子或C1〜C6烷基,m,n和k表示各重复单元的摩尔比,m表示0以上且小于1的正数,n k分别独立地表示正数,满足m + n + k = 1的关系),重均分子量在50,000〜200,000的范围内。
    • 4. 发明授权
    • High-molecular-weight copolymer
    • 高分子量共聚物
    • US08729187B2
    • 2014-05-20
    • US13384929
    • 2010-08-04
    • Eiji TakahashiShinji MarumoGou Mishima
    • Eiji TakahashiShinji MarumoGou Mishima
    • C08F257/02
    • C08F297/02C08F2/06C08F4/48C08F12/22C08F12/24C08F220/18
    • It is an object of the present invention to provide (1) a copolymer for a cured product that is satisfactory in properties, such as adhesion properties, as a chip stacking adhesive or the like. The present invention is a copolymer comprising repeating units represented by formula (I), formula (II), and formula (III), (wherein R1, R2, and R3 each independently represent a hydrogen atom or a methyl group, R4 represents an alkyl group or a cycloalkyl group, R5 represents a hydrogen atom or a C1 to C6 alkyl group, m, n, and k represent a molar ratio of the respective repeating units, m represents a positive number of 0 or more and less than 1, n and k each independently represent a positive number, and satisfy a relation of m+n+k=1), and having a weight-average molecular weight in the range of 50,000 to 200,000.
    • 本发明的目的是提供(1)作为芯片堆叠粘合剂等具有令人满意的固化产物等粘合性能的共聚物。 本发明是包含由式(I),式(II)和式(III)表示的重复单元的共聚物,其中R 1,R 2和R 3各自独立地表示氢原子或甲基,R 4表示烷基 基团或环烷基,R5表示氢原子或C1〜C6烷基,m,n和k表示各重复单元的摩尔比,m表示0以上且小于1的正数,n k分别独立地表示正数,满足m + n + k = 1的关系),重均分子量在50,000〜200,000的范围内。