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1. 发明授权

US08673105B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus 有权
标题翻译：半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
公开(公告)号：US08673105B2
公开(公告)日：2014-03-18
申请号：US13554747
申请日：2012-07-20
申请人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
发明人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
IPC分类号： B32B37/02 , B32B38/10 , B32B41/00
CPC分类号： G02F1/1303 , G02F1/1333 , G02F2001/133302 , G02F2001/133354
摘要： Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.
摘要翻译：提供一种制造半透明刚性基板层叠体的方法，以提高定位精度，同时提高生产效率。此外，提供了有助于提高定位精度同时提高板状产品的生产效率的半透明刚性基板粘合装置。在制造本发明的半透明刚性基板层叠体和半透明刚性基板接合装置的方法中，当通过在其间插入光固化固定剂将半透明刚性基板以预定位置关系结合时，仅存在固定剂两个半透明刚性基板的外边界部分被固化以用于临时紧固。

2. 发明申请

US20130081752A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE 有权
标题翻译：制造透明刚性基板层压板的方法
公开(公告)号：US20130081752A1
公开(公告)日：2013-04-04
申请号：US13703858
申请日：2011-06-01
申请人： Hiroyuki Kurimura , Tomoyuki Kanai , Isamu Ichikawa , Gosuke Nakajima , Hayato Miyazaki , Yasunori Hayashi , Kenji Tanaka
发明人： Hiroyuki Kurimura , Tomoyuki Kanai , Isamu Ichikawa , Gosuke Nakajima , Hayato Miyazaki , Yasunori Hayashi , Kenji Tanaka
IPC分类号： B32B37/02
CPC分类号： B32B37/02 , B32B17/10036 , B32B17/10706 , B32B17/10816 , Y10T156/1044
摘要： Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.
摘要翻译：提供一种半导体刚性基板层叠体的制造方法，能够提高厚度精度，同时降低断裂的风险。在根据本发明的半导体刚性基板层压体的制造方法中，半透明刚性基板彼此相对设置，使得其接合表面彼此平行，两个刚性基板彼此保持平行，使用光固化固定剂预先粘合两个刚性基材，将粘合的半透明刚性基材进行辊压，然后固化固化剂。

3. 发明申请

US20120298285A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE AND TRANSLUCENT RIGID SUBSTRATE BONDING APPARATUS 有权
标题翻译：制造透明刚性基板层压板和透明刚性基板结合装置的方法
公开(公告)号：US20120298285A1
公开(公告)日：2012-11-29
申请号：US13554747
申请日：2012-07-20
申请人： Hiroyuki KURIMURU , Hayato MIYAZAKI , Gosuke NAKAJIMA
发明人： Hiroyuki KURIMURU , Hayato MIYAZAKI , Gosuke NAKAJIMA
IPC分类号： B32B37/02 , B32B38/10 , B32B41/00
CPC分类号： G02F1/1303 , G02F1/1333 , G02F2001/133302 , G02F2001/133354
摘要： Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.
摘要翻译：提供一种制造半透明刚性基板层叠体的方法，以提高定位精度，同时提高生产效率。此外，提供了有助于提高定位精度同时提高板状产品的生产效率的半透明刚性基板粘合装置。在制造本发明的半透明刚性基板层叠体和半透明刚性基板接合装置的方法中，当通过在其间插入光固化固定剂将半透明刚性基板以预定位置关系结合时，仅存在固定剂两个半透明刚性基板的外边界部分被固化以用于临时紧固。

4. 发明授权

US09242442B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus 有权
标题翻译：半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
公开(公告)号：US09242442B2
公开(公告)日：2016-01-26
申请号：US13574510
申请日：2011-01-13
申请人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
发明人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
IPC分类号： B32B37/02 , B32B37/12 , B32B38/18 , B32B43/00 , B32B17/10 , B32B38/00 , B32B37/24 , G02F1/13 , G02F1/1333
CPC分类号： B32B37/12 , B32B17/10045 , B32B17/10706 , B32B17/10908 , B32B37/1284 , B32B38/0004 , B32B38/1858 , B32B43/006 , B32B2037/1253 , B32B2037/243 , B32B2038/1891 , B32B2307/414 , B32B2309/04 , B32B2309/08 , B32B2309/105 , B32B2309/12 , B32B2310/0831 , B32B2457/20 , C03C27/10 , G02F1/1303 , G02F2001/133331 , G02F2201/50 , Y10T156/1043
摘要： Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.
摘要翻译：提供一种制造半透明刚性基板层叠体以提高位置精度的方法。此外，提供了有助于提高定位精度同时提高板状产品的生产效率的半透明刚性基板粘合装置。在制造本发明的半透明刚性基板层叠体和半透明刚性基板接合装置的方法中，当通过在其间插入光固化固定剂将半透明刚性基板以预定的位置关系粘合时，每半透明刚性基板粘合时，两个半透明刚性基板之间的铺展都会被固化。

5. 发明授权

US09061485B2 Method of manufacturing translucent rigid substrate laminate 有权
标题翻译：半导体刚性基板层压板的制造方法
公开(公告)号：US09061485B2
公开(公告)日：2015-06-23
申请号：US13703858
申请日：2011-06-01
申请人： Hiroyuki Kurimura , Tomoyuki Kanai , Isamu Ichikawa , Gosuke Nakajima , Hayato Miyazaki , Yasunori Hayashi , Kenji Tanaka
发明人： Hiroyuki Kurimura , Tomoyuki Kanai , Isamu Ichikawa , Gosuke Nakajima , Hayato Miyazaki , Yasunori Hayashi , Kenji Tanaka
IPC分类号： B32B37/02 , B32B17/10
CPC分类号： B32B37/02 , B32B17/10036 , B32B17/10706 , B32B17/10816 , Y10T156/1044
摘要： Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.
摘要翻译：提供一种半导体刚性基板层叠体的制造方法，能够提高厚度精度，同时降低断裂的风险。在根据本发明的半导体刚性基板层压体的制造方法中，半透明刚性基板彼此相对设置，使得其接合表面彼此平行，两个刚性基板彼此保持平行，使用光固化固定剂预先粘合两个刚性基材，将粘合的半透明刚性基材进行辊压，然后固化固化剂。

6. 发明申请

US20130037204A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE AND TRANSLUCENT RIGID SUBSTRATE BONDING APPARATUS 有权
标题翻译：制造透明刚性基板层压板和透明刚性基板结合装置的方法
公开(公告)号：US20130037204A1
公开(公告)日：2013-02-14
申请号：US13574510
申请日：2011-01-13
申请人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
发明人： Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
IPC分类号： B32B37/12 , B32B38/10
CPC分类号： B32B37/12 , B32B17/10045 , B32B17/10706 , B32B17/10908 , B32B37/1284 , B32B38/0004 , B32B38/1858 , B32B43/006 , B32B2037/1253 , B32B2037/243 , B32B2038/1891 , B32B2307/414 , B32B2309/04 , B32B2309/08 , B32B2309/105 , B32B2309/12 , B32B2310/0831 , B32B2457/20 , C03C27/10 , G02F1/1303 , G02F2001/133331 , G02F2201/50 , Y10T156/1043
摘要： Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.
摘要翻译：提供一种制造半透明刚性基板层叠体以提高位置精度的方法。此外，提供了有助于提高定位精度同时提高板状产品的生产效率的半透明刚性基板粘合装置。在制造本发明的半透明刚性基板层叠体和半透明刚性基板接合装置的方法中，当通过在其间插入光固化固定剂将半透明刚性基板以预定的位置关系粘合时，每半透明刚性基板粘合时，两个半透明刚性基板之间的铺展都会被固化。

7. 发明授权

US08723537B2 Probe inspecting method and curable resin composition 失效
标题翻译：探头检查方法和固化树脂组合物
公开(公告)号：US08723537B2
公开(公告)日：2014-05-13
申请号：US12919314
申请日：2009-02-20
申请人： Gosuke Nakajima , Yoshitsugu Goto , Kazuhiro Oshima , Jun Watanabe
发明人： Gosuke Nakajima , Yoshitsugu Goto , Kazuhiro Oshima , Jun Watanabe
IPC分类号： G01R31/00
CPC分类号： G01R3/00 , Y02P20/582
摘要： Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe.
摘要翻译：公开了一种用于确认用于检查被检查物体的电特性的探针的状态的探针检查方法，和用于该方法的可固化树脂组合物。该方法用于重复检查，包括使固化树脂组合物的固化树脂与用于检查被检查物体的电特性的探针接触的步骤，将探针的探针标记转印到固化树脂上，确认基于所转移的探针标记的探针的状态，并且在传感探针的探针标记之后，将固化树脂加热至等于或高于固化树脂的玻璃化转变温度的温度，以擦除探测。

8. 发明申请

US20110128023A1 PROBE INSPECTING METHOD AND CURABLE RESIN COMPOSITION 失效
标题翻译：探针检测方法和可固化树脂组合物
公开(公告)号：US20110128023A1
公开(公告)日：2011-06-02
申请号：US12919314
申请日：2009-02-20
申请人： Gosuke Nakajima , Yoshitsugu Goto , Kazuhiro Oshima , Jun Watanabe
发明人： Gosuke Nakajima , Yoshitsugu Goto , Kazuhiro Oshima , Jun Watanabe
IPC分类号： G01R31/00 , C08F20/56 , C08F20/10 , C08F220/56
CPC分类号： G01R3/00 , Y02P20/582
摘要： Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe.
摘要翻译：公开了一种用于确认用于检查被检查物体的电特性的探针的状态的探针检查方法，和用于该方法的可固化树脂组合物。该方法用于重复检查，包括使固化树脂组合物的固化树脂与用于检查被检查物体的电特性的探针接触的步骤，将探针的探针标记转印到固化树脂上，确认基于所转移的探针标记的探针的状态，并且在传感探针的探针标记之后，将固化树脂加热至等于或高于固化树脂的玻璃化转变温度的温度，以擦除探测。

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