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1. 发明申请

WO2005022626A1 METHODS FOR PACKAGING INTEGRATED CIRCUITS, AND INTEGRATED CIRCUIT PACKAGES PRODUCED BY THE METHOD 审中-公开
标题翻译：包装集成电路的方法和由该方法生成的集成电路组件
公开(公告)号：WO2005022626A1
公开(公告)日：2005-03-10
申请号：PCT/SG2003/000208
申请日：2003-09-03
申请人： INFINEON TECHNOLOGIES AG , MARY, Teo , TAN, Ai Min , GERALD, Ofner
发明人： MARY, Teo , TAN, Ai Min , GERALD, Ofner
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/07811 , H01L2924/00
摘要： An integrated circuit 1 is packaged using a polymeric body 9 which contains micropores 13, which permit moisture generated during the packaging process to escape as water vapour. The micropores 13 are too small, however, to allow liquid water to pass through. The micropores are formed by forming at least part of polymeric body 9 from a liquid polymeric material containing globules 11 of a sacrificial polymer which can be degraded and removed by a heat treatment. A particular application of the invention is in the case of integrated circuits of the "flip-chip" type, in which case the polymeric material may be used as the underfill layer 9.
摘要翻译：使用包含微孔13的聚合体9包装集成电路1，其允许在包装过程中产生的水分作为水蒸汽逸出。然而，微孔13太小，以允许液态水通过。微孔是通过从含有可通过热处理降解和去除的牺牲聚合物的小球11的液体聚合材料形成聚合物体9的至少一部分而形成的。本发明的具体应用在“倒装芯片”类型的集成电路的情况下，在这种情况下，聚合材料可以用作底部填充层9。

2. 发明授权

US08878360B2 Stacked fan-out semiconductor chip 有权
标题翻译：堆叠扇出半导体芯片
公开(公告)号：US08878360B2
公开(公告)日：2014-11-04
申请号：US13548705
申请日：2012-07-13
申请人： Thorsten Meyer , Gerald Ofner , Sven Albers
发明人： Thorsten Meyer , Gerald Ofner , Sven Albers
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L21/561 , H01L23/5389 , H01L24/05 , H01L24/16 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/24011 , H01L2224/24105 , H01L2224/24145 , H01L2224/24146 , H01L2224/24195 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73209 , H01L2224/73217 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/81191 , H01L2224/82031 , H01L2224/82039 , H01L2224/821 , H01L2224/83191 , H01L2224/83385 , H01L2224/92124 , H01L2224/92224 , H01L2224/92244 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19105 , H01L2224/16225 , H01L2924/00 , H01L2924/0665 , H01L2224/83 , H01L2924/01014 , H01L2924/01006 , H01L2224/82 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor device and method of manufacturing a stacked semiconductor device are described. The semiconductor device may include a reconstituted base layer having a plurality of embedded semiconductor chips. A first redistribution layer may contact the electrically conductive contacts of the embedded chips and extend beyond the boundary of one or more of the embedded chips, forming a fan-out area. Another chip may be stacked above the chips embedded in the base layer and be electrically connected to the embedded chips by a second redistribution layer. Additional layers of chips may be included in the semiconductor device.
摘要翻译：对叠层半导体器件及其制造方法进行说明。半导体器件可以包括具有多个嵌入式半导体芯片的复原基底层。第一再分配层可以接触嵌入式芯片的导电触点并且延伸超过一个或多个嵌入式芯片的边界，形成扇出区域。另外的芯片可以堆叠在嵌入在基底层中的芯片之上，并通过第二再分布层与嵌入式芯片电连接。芯片的附加层可以包括在半导体器件中。

3. 发明授权

US07994608B2 Magnetically alignable integrated circuit device 有权
标题翻译：磁性校准集成电路器件
公开(公告)号：US07994608B2
公开(公告)日：2011-08-09
申请号：US11996604
申请日：2005-08-24
申请人： Ai Min Tan , Gerald Ofner , Swain Hong Yeo , Mary Teo , Pei Siang Lim
发明人： Ai Min Tan , Gerald Ofner , Swain Hong Yeo , Mary Teo , Pei Siang Lim
IPC分类号： H01L21/00 , H01L23/58
CPC分类号： H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/81122 , H01L2224/8113 , H01L2224/81132 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19042 , H01L2924/00 , H01L2224/05599
摘要： An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
摘要翻译：集成电路器件包括具有多个芯片接触焊盘的有源表面的半导体芯片，重新布线基板和用于将半导体芯片与重新布线基板磁性对准的导电电感线圈。

4. 发明授权

US07566968B2 Biosensor with smart card configuration 有权
标题翻译：具有智能卡配置的生物传感器
公开(公告)号：US07566968B2
公开(公告)日：2009-07-28
申请号：US11196497
申请日：2005-08-04
申请人： Michael Bauer , Bernd Goller , Robert-Christian Hagen , Gerald Ofner , Christian Stuempfl , Holger Woerner
发明人： Michael Bauer , Bernd Goller , Robert-Christian Hagen , Gerald Ofner , Christian Stuempfl , Holger Woerner
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01N33/48785 , B01L3/502715 , B01L9/52 , B01L2200/027 , B01L2300/0819 , B01L2300/0877 , H01L2924/0002 , H01L2924/00
摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
摘要翻译：具有智能卡结构的生物传感器包括：半导体芯片，包括生物活性结构和布置在半导体芯片的第一面上的接触区域;以及重新布线基板，包括接触焊盘，外部接触区域和将接触焊盘电连接到外部接触区域。再配线基板覆盖半导体芯片的第一侧的一部分而不覆盖生物活性结构，使得重新布线基板与半导体芯片和接触焊盘的接触区域重叠，并且接触区域彼此对准并电连接。此外，测量装置被配置为接收生物传感器并进行传送到测量装置中的流体介质的测量。

5. 发明申请

US20080006900A1 Semiconductor Package and Method for Producing the Same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20080006900A1
公开(公告)日：2008-01-10
申请号：US11738641
申请日：2007-04-23
申请人： Kai Chong Chan , Charles Wee Ming Lee , Gerald Ofner
发明人： Kai Chong Chan , Charles Wee Ming Lee , Gerald Ofner
IPC分类号： H01L31/036 , H01L21/00 , H01L23/48
CPC分类号： H01L23/3121 , H01L21/563 , H01L29/0657 , H01L2221/6834 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10157 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
摘要翻译：半导体封装包括重新布线基板和半导体芯片。半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。

6. 发明授权

US07286287B1 Visual aid in the form of telescopic spectacles with an automated focusing device 失效
标题翻译：具有自动对焦装置的伸缩眼镜形式的视觉辅助
公开(公告)号：US07286287B1
公开(公告)日：2007-10-23
申请号：US09889895
申请日：2000-11-23
申请人： Anton Gerald Ofner
发明人： Anton Gerald Ofner
IPC分类号： G02B23/00
CPC分类号： G02B7/002 , G02B5/30 , G02B25/004 , G02B27/017 , G02B27/0172 , G02B27/0176 , G02B2027/0132 , G02C7/088
摘要： A vision aid in the form of telescopic spectacles has two lens systems, which each comprise at least one objective lens (70) and one eyepiece (71). An autofocussing element which changes the focal length of the lens systems for sharp focussing thereof according to the distance of the telescopic spectacle from the object is assigned to the lens systems. Furthermore, an element for changing the magnification factor by changing the focal length of the lens systems (“zoom”) and finally an element for matching the parallax between the lens systems of the vision aid to the focal length which has been set according to the distance of the telescopic spectacles from the object are assigned to the lens systems. The parallax is adapted using adjustable optical elements (11) which are located in the beam path of the lens systems, with which elements the angle (13) between the beam paths (14) running from the lens systems (1) to the object can be changed.
摘要翻译：伸缩眼镜形式的视力援助具有两个透镜系统，每个透镜系统包括至少一个物镜（70）和一个目镜（71）。将透镜系统的焦距改变为根据伸缩眼镜与物体的距离进行锐利聚焦的自动聚焦元件被分配给透镜系统。此外，通过改变透镜系统的焦距（“缩放”）以及最后将视觉辅助的透镜系统之间的视差匹配的元件与根据将伸缩眼镜与物体的距离分配给透镜系统。使用位于透镜系统的光束路径中的可调节光学元件（11）来适应视差，利用该元件，从透镜系统（1）延伸到物体的光束路径（14）之间的角度（13）可以改变。

7. 发明申请

US20070037319A1 Semiconductor package with contact support layer and method to produce the package 有权
标题翻译：具有接触支撑层的半导体封装和生产封装的方法
公开(公告)号：US20070037319A1
公开(公告)日：2007-02-15
申请号：US11501913
申请日：2006-08-10
申请人： Kai Chan , Charles Lee , Gerald Ofner
发明人： Kai Chan , Charles Lee , Gerald Ofner
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/563 , H01L21/6836 , H01L23/3157 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L2221/68327 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
摘要翻译：半导体封装包括：衬底，其包括多个导电迹线和其上表面上的上接触区域，以及在其底表面上的第二多个下导电迹线和外部接触区域以及附接到外部接触区域的外部导电构件。半导体封装还包括半导体管芯，其包括具有多个管芯接触焊盘的有源表面，其通过导电构件电连接到衬底的接触区域。半导体管芯的有源表面上的导电构件之间的支撑层至少覆盖导电构件的基部。一种方法涉及半导体封装的制造。

8. 发明授权

US5971540A Magnifying spectacles with variable focus, variable magnification factor and automatic parallax compensation 失效
标题翻译：放大眼镜具有可变焦距，可变放大倍率和自动视差补偿
公开(公告)号：US5971540A
公开(公告)日：1999-10-26
申请号：US36335
申请日：1998-03-06
申请人： Anton Gerald Ofner
发明人： Anton Gerald Ofner
IPC分类号： A61B19/00 , G02C7/08 , G02C1/00
CPC分类号： G02C7/088 , A61B90/20
摘要： Magnifying spectacles for surgical use have an automatic focusing device, a device for automatically altering the magnification factor and a device for automatic parallax compensation corresponding to the current focal length. During surgical operations, alteration of the working distance is commonly necessary due to the positions of different operating sites. Automatic adaptation of the focal length and the parallax angle allows optimum optical configuration to be reached without the need for the surgeon to use his hands. Focusing can be adjusted using a foot switch.
摘要翻译：用于外科手术的放大镜具有自动对焦装置，用于自动改变放大倍数的装置和与当前焦距相对应的用于自动视差补偿的装置。在外科手术中，由于不同操作部位的位置，通常需要改变工作距离。自动调整焦距和视差角度可以实现最佳的光学配置，无需外科医生使用他的手。可以使用脚踏开关调节对焦。

9. 发明授权

US09056763B2 Stress buffer layer for integrated microelectromechanical systems (MEMS) 有权
标题翻译：用于集成微机电系统（MEMS）的应力缓冲层
公开(公告)号：US09056763B2
公开(公告)日：2015-06-16
申请号：US14039157
申请日：2013-09-27
申请人： Christian Geissler , Thorsten Meyer , Gerald Ofner , Reinhard Mahnkopf , Andreas Augustin , Christian Mueller
发明人： Christian Geissler , Thorsten Meyer , Gerald Ofner , Reinhard Mahnkopf , Andreas Augustin , Christian Mueller
IPC分类号： H01L23/02 , B81C1/00 , B81B7/00
CPC分类号： B81C1/00666 , B81B7/0054 , B81C1/00261 , B81C1/00349 , B81C2203/0136 , B81C2203/0154 , H01L21/568 , H01L23/3135 , H01L24/19 , H01L24/96 , H01L2224/12105 , H01L2224/16145 , H01L2224/24137 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/73207 , H01L2224/73259 , H01L2224/73265 , H01L2224/73277 , H01L2924/1461 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.
摘要翻译：描述了用于集成微机电系统（MEMS）的应力缓冲层。例如，半导体封装包括具有第一和第二表面的衬底，第二表面具有外部导电触点阵列。微机电系统（MEMS）部件设置在基板的第一表面上方。缓冲层设置在MEMS部件上方，缓冲层具有第一杨氏模量。模具化合物设置在缓冲层上方，模塑料具有高于第一杨氏模量的第二杨氏模量。

10. 发明申请

US20140138827A1 ENHANCED FLIP CHIP PACKAGE 有权
标题翻译：增强片剂包装
公开(公告)号：US20140138827A1
公开(公告)日：2014-05-22
申请号：US14164289
申请日：2014-01-27
申请人： Thorsten Meyer , Gerald Ofner , Bernd Waidhas
发明人： Thorsten Meyer , Gerald Ofner , Bernd Waidhas
IPC分类号： H01L23/00 , H01L25/065 , H01L23/498
CPC分类号： H01L24/81 , H01L21/568 , H01L23/3135 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L23/5389 , H01L24/14 , H01L24/17 , H01L24/19 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L2224/0231 , H01L2224/02371 , H01L2224/02373 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/16145 , H01L2224/16225 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/3511 , H01L2924/00
摘要： According to various embodiments, a flip chip package structure is provided in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.
摘要翻译：根据各种实施例，提供了一种倒装芯片封装结构，其中再分配层（RDL）设置在半导体芯片和半导体芯片表面的一个或多个侧向延伸部分的表面上。横向延伸部可以使用例如重构的晶片来实现半导体芯片的一个或多个侧面的横向扇出区域。可以将一个或多个电连接器（例如焊料凸块或铜圆筒）施加到RDL，并且诸如PCB插入器的插入件可以连接到电连接器。以这种方式，可以容纳相对紧凑的半导体衬垫间距并将其转换成适当的电路板间距，而不需要硅或玻璃插入件。

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