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1. 发明授权

US07528788B2 High impedance electromagnetic surface and method 失效
标题翻译：高阻抗电磁表面和方法
公开(公告)号：US07528788B2
公开(公告)日：2009-05-05
申请号：US12174960
申请日：2008-07-17
申请人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
发明人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
IPC分类号： H01Q3/40
CPC分类号： H01Q15/006 , H05K1/116 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/0715 , H05K2201/09509 , H05K2201/09609
摘要： A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).
摘要翻译：高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319）电路板（302）。多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器在印刷电路板（302）内。

2. 发明申请

US20080272982A1 HIGH IMPEDANCE ELECTROMAGNETIC SURFACE AND METHOD 失效
标题翻译：高阻抗电磁表面和方法
公开(公告)号：US20080272982A1
公开(公告)日：2008-11-06
申请号：US12174960
申请日：2008-07-17
申请人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
发明人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
IPC分类号： H01Q15/24
CPC分类号： H01Q15/006 , H05K1/116 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/0715 , H05K2201/09509 , H05K2201/09609
摘要： A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).
摘要翻译：高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319）电路板（302）。多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器在印刷电路板（302）内。

3. 发明授权

US07423608B2 High impedance electromagnetic surface and method 失效
标题翻译：高阻抗电磁表面和方法
公开(公告)号：US07423608B2
公开(公告)日：2008-09-09
申请号：US11312286
申请日：2005-12-20
申请人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
发明人： Gregory J. Dunn , Robert T. Croswell , George H. Kumpf , John A. Svigelj
IPC分类号： H01Q15/24
CPC分类号： H01Q15/006 , H05K1/116 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/0715 , H05K2201/09509 , H05K2201/09609
摘要： A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).
摘要翻译：高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319）电路板（302）。多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器在印刷电路板（302）内。

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