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1. 发明授权

US08774958B2 Selection of polishing parameters to generate removal profile 有权
标题翻译：选择抛光参数以产生去除曲线
公开(公告)号：US08774958B2
公开(公告)日：2014-07-08
申请号：US13098257
申请日：2011-04-29
申请人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
发明人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
IPC分类号： G06F19/00 , B24B49/00
CPC分类号： B24B37/005 , B24B37/042 , G05B19/182 , G05B2219/45232 , G05D16/20
摘要： Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
摘要翻译：为化学机械抛光系统的多个可控参数选择值，其包括具有多个区域的载体头，以在基底上施加独立的可控压力。存储数据存储在基板的前表面上的去除轮廓的变化，以改变可控参数，包括在基板的前表面上的多个位置处的去除的数据，存在比腔更多的位置数量。为多个可控参数的每个参数确定一个值，以最小化目标去除曲线与根据数据相关的预期去除曲线之间的差异，该数据与基板的前表面上的去除曲线的变化相关，参数的变化。存储多个可控参数的每个参数的值。

2. 发明申请

US20120277897A1 SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE 有权
标题翻译：选择抛光参数以生成去除轮廓
公开(公告)号：US20120277897A1
公开(公告)日：2012-11-01
申请号：US13098257
申请日：2011-04-29
申请人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
发明人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
IPC分类号： G06F19/00
CPC分类号： B24B37/005 , B24B37/042 , G05B19/182 , G05B2219/45232 , G05D16/20
摘要： Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
摘要翻译：为化学机械抛光系统的多个可控参数选择值，其包括具有多个区域的载体头，以在基底上施加独立的可控压力。存储数据存储在基板的前表面上的去除轮廓的变化，以改变可控参数，包括在基板的前表面上的多个位置处的去除的数据，存在比腔更多的位置数量。为多个可控参数的每个参数确定一个值，以最小化目标去除曲线与根据数据相关的预期去除曲线之间的差异，该数据与基板的前表面上的去除曲线的变化相关，参数的变化。存储多个可控参数的每个参数的值。

3. 发明授权

US08202738B2 Endpoint method using peak location of modified spectra 有权
标题翻译：端点方法使用修改光谱的峰位置
公开(公告)号：US08202738B2
公开(公告)日：2012-06-19
申请号：US13090934
申请日：2011-04-20
申请人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整：值序列。

4. 发明申请

US20110275167A1 Endpoint Method Using Peak Location Of Modified Spectra 有权
标题翻译：端点方法使用修改光谱的峰位置
公开(公告)号：US20110275167A1
公开(公告)日：2011-11-10
申请号：US13090934
申请日：2011-04-20
申请人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整：值序列。

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