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1. 发明申请

WO2012122186A3 CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER 审中-公开
公开(公告)号：WO2012122186A3
公开(公告)日：2012-09-13
申请号：PCT/US2012/027916
申请日：2012-03-06
申请人： ENTEGRIS, INC. , SMITH, Joseph , GALPIN, Andrew , WARGO, Christopher
发明人： SMITH, Joseph , GALPIN, Andrew , WARGO, Christopher
IPC分类号： H01L21/304
摘要： A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface, the first set of protrusions and the second set of protrusions have a layer of poly crystalline diamond on at least their top surfaces. The protrusion sets can be identified, for example, by their heights, or alternatively by their predetermined locations or their base dimensions. Various ways to measure the height of the protrusions are presented, including an average height as measured from the back face of the pad conditioner, a peak-to-valley height, or a prominence height.

2. 发明申请

WO2012122186A4 CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER 审中-公开
标题翻译：化学机械平面板调节器
公开(公告)号：WO2012122186A4
公开(公告)日：2013-01-10
申请号：PCT/US2012027916
申请日：2012-03-06
申请人： ENTEGRIS INC , SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
发明人： SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface, the first set of protrusions and the second set of protrusions have a layer of poly crystalline diamond on at least their top surfaces. The protrusion sets can be identified, for example, by their heights, or alternatively by their predetermined locations or their base dimensions. Various ways to measure the height of the protrusions are presented, including an average height as measured from the back face of the pad conditioner, a peak-to-valley height, or a prominence height.
摘要翻译：公开了一种用于CMP抛光垫的垫调节器，其包括具有第一组突起和第二组突起的基底，第一组突起具有第一平均高度，第二组突起具有第二平均高度，与第二平均高度不同的第一平均高度，第一组突起中的每个突起的顶部具有非平坦表面，并且第二组突起中的每个突起的顶部具有非平坦表面，第一组并且第二组突起在至少其顶表面上具有多晶金刚石层。突起组可以例如通过它们的高度来标识，或者通过它们的预定位置或它们的基本尺寸来识别。提供了各种测量突起高度的方法，包括从垫调节器的背面测量的平均高度，峰谷高度或突出高度。

3. 发明申请

WO2012122186A2 CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER 审中-公开
标题翻译：化学机械平面板调节器
公开(公告)号：WO2012122186A2
公开(公告)日：2012-09-13
申请号：PCT/US2012027916
申请日：2012-03-06
申请人： ENTEGRIS INC , SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
发明人： SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface, the first set of protrusions and the second set of protrusions have a layer of poly crystalline diamond on at least their top surfaces. The protrusion sets can be identified, for example, by their heights, or alternatively by their predetermined locations or their base dimensions. Various ways to measure the height of the protrusions are presented, including an average height as measured from the back face of the pad conditioner, a peak-to-valley height, or a prominence height.
摘要翻译：公开了一种用于CMP抛光垫的垫调节器，其包括具有第一组突起和第二组突起的基底，第一组突起具有第一平均高度，第二组突起具有第二平均高度，与第二平均高度不同的第一平均高度，第一组突起中的每个突起的顶部具有非平坦表面，并且第二组突起中的每个突起的顶部具有非平坦表面，第一组并且第二组突起在至少其顶表面上具有多晶金刚石层。突出组可以例如通过它们的高度来标识，或者通过它们的预定位置或它们的基本尺寸来识别。提供了各种测量突起高度的方法，包括从垫调节器的背面测量的平均高度，峰谷高度或突出高度。

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