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1. 发明授权

US09118331B2 Contact state detection apparatus 有权
标题翻译：接触状态检测装置
公开(公告)号：US09118331B2
公开(公告)日：2015-08-25
申请号：US13744587
申请日：2013-01-18
申请人： Futoshi Iwata , Toshio Shiomi , Koji Suzuki
发明人： Futoshi Iwata , Toshio Shiomi , Koji Suzuki
IPC分类号： H01L27/00 , G06M7/00 , G01N21/86 , H03K17/968 , H01L21/02 , G01B21/16 , G01R1/067
CPC分类号： H03K17/968 , G01B21/16 , G01R1/06794 , H01L21/02
摘要： A contact state detection apparatus which can accurately detect the pressed state of a contact body such as a probe against an object without damaging the contact body or the object includes a contact body approach section, a probe light source, an imaging device, and a computer unit. The contact body approach section holds a contact body in an inclined attitude with respect to a target contact surface of an object, and displaces the contact body toward the object. The probe light source irradiates light toward the contact body which is being displaced toward the object. The imaging device captures an image of the illuminated contact body and outputs contact body captured image information to the computer unit. The computer unit detects the state of the contact body being pressed against the object based on a change in the contact body captured image information.
摘要翻译：可以在不损坏接触体或物体的情况下精确地检测针对物体的探针等接触体的按压状态的接触状态检测装置包括接触体接近部，探针光源，成像装置和计算机单元。接触体接近部分相对于物体的目标接触表面以倾斜的姿态保持接触体，并使接触体朝向物体移动。探针光源向被朝向物体移动的接触体照射光。成像装置捕获照明接触体的图像，并将接触体捕获的图像信息输出到计算机单元。计算机单元基于接触体拍摄图像信息的变化来检测被按压在物体上的接触体的状态。

2. 发明申请

US20140203168A1 Contact State Detection Apparatus 有权
标题翻译：接触状态检测装置
公开(公告)号：US20140203168A1
公开(公告)日：2014-07-24
申请号：US13744587
申请日：2013-01-18
申请人： Futoshi Iwata , Toshio Shiomi , Koji Suzuki
发明人： Futoshi Iwata , Toshio Shiomi , Koji Suzuki
IPC分类号： G01B11/02
CPC分类号： H03K17/968 , G01B21/16 , G01R1/06794 , H01L21/02
摘要： A contact state detection apparatus which can accurately detect the pressed state of a contact body such as a probe against an object without damaging the contact body or the object includes a contact body approach section, a probe light source, an imaging device, and a computer unit. The contact body approach section holds a contact body in an inclined attitude with respect to a target contact surface of an object, and displaces the contact body toward the object. The probe light source irradiates light toward the contact body which is being displaced toward the object. The imaging device captures an image of the illuminated contact body and outputs contact body captured image information to the computer unit. The computer unit detects the state of the contact body being pressed against the object based on a change in the contact body captured image information.
摘要翻译：可以在不损坏接触体或物体的情况下精确地检测针对物体的探针等接触体的按压状态的接触状态检测装置包括接触体接近部，探针光源，成像装置和计算机单元。接触体接近部分相对于物体的目标接触表面以倾斜的姿态保持接触体，并使接触体朝向物体移动。探针光源向被朝向物体移动的接触体照射光。成像装置捕获照明接触体的图像，并将接触体捕获的图像信息输出到计算机单元。计算机单元基于接触体拍摄图像信息的变化来检测被按压在物体上的接触体的状态。

3. 发明授权

US08062494B2 Micro-machining dust removing device, micro-machining apparatus, and micro-machining dust removing method 失效
标题翻译：微加工除尘装置，微加工装置和微加工除尘方法
公开(公告)号：US08062494B2
公开(公告)日：2011-11-22
申请号：US11810230
申请日：2007-06-04
申请人： Futoshi Iwata , Masatoshi Yasutake , Takuya Nakaue , Syuichi Kikuchi , Osamu Takaoka
发明人： Futoshi Iwata , Masatoshi Yasutake , Takuya Nakaue , Syuichi Kikuchi , Osamu Takaoka
IPC分类号： B23H7/00
CPC分类号： G03F1/82 , G03F7/0002
摘要： There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.
摘要翻译：有一个微加工设备，用于去除在加工时产生的微加工粉尘，同时使用探头将工件M加工在液体W内。该装置包括：工件待放置的台阶; 具有探针尖端的探针，具有移动装置的加工装置，所述移动装置使所述载物台和所述探针相对于彼此移动，以通过所述探针末端加工所述工件;以及微加工除尘装置，其具有第一电极和第二电极其布置在液体中以夹住探针尖端;以及电压施加装置，其在两个电极之间施加电压以移动液体中的微加工灰尘。

4. 发明申请

US20080132151A1 Micro-machining dust removing device, micro-machining apparatus, and micro-machining dust removing method 失效
标题翻译：微加工除尘装置，微加工装置和微加工除尘方法
公开(公告)号：US20080132151A1
公开(公告)日：2008-06-05
申请号：US11810230
申请日：2007-06-04
申请人： Futoshi Iwata , Masatoshi Yasutake , Takuya Nakaue , Syuichi Kikuchi , Osamu Takaoka
发明人： Futoshi Iwata , Masatoshi Yasutake , Takuya Nakaue , Syuichi Kikuchi , Osamu Takaoka
IPC分类号： B24B1/00 , B24C3/00
CPC分类号： G03F1/82 , G03F7/0002
摘要： There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.
摘要翻译：有一个微加工设备，用于去除在加工时产生的微加工粉尘，同时使用探头将工件M加工在液体W内。该装置包括：工件待放置的台阶; 具有探针尖端的探针，具有移动装置的加工装置，所述移动装置使所述载物台和所述探针相对于彼此移动，以通过所述探针末端加工所述工件;以及微加工除尘装置，其具有第一电极和第二电极其布置在液体中以夹住探针尖端;以及电压施加装置，其在两个电极之间施加电压以移动液体中的微加工灰尘。

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