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1. 发明授权

US06722953B2 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus 失效
标题翻译：研磨液供给装置，向磨料供给装置供给添加剂的方法以及研磨装置
公开(公告)号：US06722953B2
公开(公告)日：2004-04-20
申请号：US10013670
申请日：2001-12-13
申请人： Takashi Tanaka , Takashi Tsuzuki , Fujihiko Toyomasu
发明人： Takashi Tanaka , Takashi Tsuzuki , Fujihiko Toyomasu
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B49/00 , B24B57/02 , H01L21/30625
摘要： An abrasive liquid feed apparatus comprises a supply tank for storing an abrasive liquid having a predetermined concentration, an abrasive liquid pipe for transferring the abrasive liquid from the tank to a polishing means and an additive feed means which feeds an additive having a predetermined concentration to the tank. It further comprises an additive concentration measurement means which measures a concentration of the additive in the abrasive liquid in the supply tank, a measurement means which measures an amount of the abrasive liquid in the tank and a control which calculates an amount of the additive to be supplemented to the tank, based on the concentration of the additive measured by the additive concentration measurement means and the amount of the abrasive liquid measured by the metering means. To maintain the concentration of aqueous hydrogen peroxide in the abrasive liquid.
摘要翻译：研磨液体供给装置包括用于储存具有预定浓度的研磨液的供应罐，用于将研磨液从罐转移到抛光装置的研磨液体管，以及将具有预定浓度的添加剂供给到坦克。它还包括一个添加剂浓度测量装置，其测量供应罐中研磨液中的添加剂的浓度，测量装置中的磨料液体量的测量装置，以及计算添加剂量的控制装置基于通过添加剂浓度测量装置测量的添加剂的浓度和由计量装置测量的研磨液的量补充到罐中。保持研磨液中过氧化氢水溶液的浓度。

2. 发明授权

US06338671B1 Apparatus for supplying polishing liquid 失效
标题翻译：用于提供抛光液的设备
公开(公告)号：US06338671B1
公开(公告)日：2002-01-15
申请号：US09533779
申请日：2000-03-24
申请人： Kiyotaka Kawashima , Mitsunori Komatsu , Mutsumi Tanikawa , Fujihiko Toyomasu
发明人： Kiyotaka Kawashima , Mitsunori Komatsu , Mutsumi Tanikawa , Fujihiko Toyomasu
IPC分类号： B24G900
CPC分类号： B24B37/04 , B24B49/00 , B24B57/02
摘要： An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.
摘要翻译：用于将研磨液供给到研磨部的装置用于研磨研磨部中的半导体基板的表面。该装置包括用于存储具有给定特性的抛光液的供应罐，用于将抛光液供给到抛光部的供应管，用于检测流过供给管的抛光液的性质的检测装置，以及用于维持基于来自感测装置的输出信号，存储在供应罐中的抛光液的特性或者通过供给管流动在允许范围内。

3. 发明授权

US06802762B2 Method for supplying slurry to polishing apparatus 失效
标题翻译：向抛光装置供应浆料的方法
公开(公告)号：US06802762B2
公开(公告)日：2004-10-12
申请号：US09970621
申请日：2001-10-05
申请人： Takashi Tanaka , Takashi Tsuzuki , Fujihiko Toyomasu
发明人： Takashi Tanaka , Takashi Tsuzuki , Fujihiko Toyomasu
IPC分类号： B24B5702
CPC分类号： B24B37/04 , B24B57/02
摘要： A method for feeding slurry, and a slurry feeder capable of feeding slurry to a chemical mechanical polishing apparatus, are disclosed. Slurry is fed from a slurry supply tank, that stores slurry at a given concentration, to chemical mechanical polishing apparatuses via slurry feed pumps. Operations of the slurry feed pumps are suspended during a period of time other than during a time of feeding slurry to the chemical mechanical polishing apparatuses. A slurry feeder for feeding a slurry to a polishing apparatus includes a pump for feeding slurry at a flow rate Q from a slurry supply tank to the polishing apparatus. When a given sedimentation velocity of slurry is indicated by V, a horizontal sectional area of the slurry supply tank is set to become smaller than Q/V.
摘要翻译：公开了一种用于进料浆料的方法和一种能够将浆料送入化学机械抛光装置的浆料给料机。浆料从浆料供应罐进料，浆料供应罐通过浆料进料泵将浆料以特定浓度储存在化学机械抛光装置中。浆料供给泵的操作在将浆料供给到化学机械抛光装置之前的时间段内暂停。用于将浆料供给到抛光装置的浆料给料器包括用于以从浆料供应罐到抛光装置的流量Q供给浆料的泵。当浆料的给定沉降速度用V表示时，浆料供应罐的水平截面积设定为小于Q / V。

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