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1. 发明授权

US08741998B2 Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof 有权
标题翻译：含有热绝缘填料的导热和电绝缘聚合物组合物及其用途
公开(公告)号：US08741998B2
公开(公告)日：2014-06-03
申请号：US13402202
申请日：2012-02-22
申请人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
发明人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
IPC分类号： C08K3/28
CPC分类号： C09K5/14 , C08K3/013
摘要： Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm·cm. Also disclosed are articles and methods of use therefor.
摘要翻译：本文公开的是包含a。 35〜80体积％的热塑性聚合物; b。 5至45vol％的本征热导率小于或等于10W / mK的绝热填料; 和c。 5至15体积％的本征热导率大于或等于50W / mK的导热填料，其特征在于：i。至少1.0W / mK的热导率; ii。总填料体积分数的至少7倍的热导率乘以纯热塑性聚合物的导热率; 和iii。体积电阻率至少为107欧姆·厘米。还公开了用于其的物品和方法。

2. 发明申请

US20120228542A1 THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE POLYMER COMPOSITIONS CONTAINING A LOW THERMALLY CONDUCTIVE FILLER AND USES THEREOF 有权
标题翻译：包含低导热填料的导热和电绝缘聚合物组合物及其用途
公开(公告)号：US20120228542A1
公开(公告)日：2012-09-13
申请号：US13402216
申请日：2012-02-22
申请人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
发明人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
IPC分类号： C09K5/00
CPC分类号： H01B3/004 , C08K3/01 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.
摘要翻译：本文公开的是包含a。 35〜80体积％的热塑性聚合物; b。 5至45vol％的导热性低导电的电绝缘填料，其本征热导率为10至30W / mK; C。 5至15体积％的具有大于或等于50W / mK的固有热导率的高导热电绝缘填料; 和d。 5至15体积％的具有大于或等于50W / mK的本征热导率的高导热导电填料，其特征在于：i。至少1.0W / mK的热导率; 和ii。体积电阻率至少为107欧姆·厘米。还公开了用于其的物品和方法。

3. 发明申请

US20120217434A1 THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE POLYMER COMPOSITIONS CONTAINING A THERMALLY INSULATIVE FILLER AND USES THEREOF 有权
标题翻译：含有绝热绝热填料的导热和电绝缘聚合物组合物及其用途
公开(公告)号：US20120217434A1
公开(公告)日：2012-08-30
申请号：US13402202
申请日：2012-02-22
申请人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
发明人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
IPC分类号： C09K5/00
CPC分类号： C09K5/14 , C08K3/013
摘要： Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.
摘要翻译：本文公开的是包含a。 35〜80体积％的热塑性聚合物; b。 5至45vol％的本征热导率小于或等于10W / mK的绝热填料; 和c。 5至15体积％的本征热导率大于或等于50W / mK的导热填料，其特征在于：i。至少1.0W / mK的热导率; ii。总填料体积分数的至少7倍的热导率乘以纯热塑性聚合物的导热率; 和iii。体积电阻率至少为107欧姆·厘米。还公开了用于其的物品和方法。

4. 发明申请

US20150232664A1 THERMALLY CONDUCTIVE BLENDED POLYMER COMPOSITIONS WITH IMPROVED FLAME RETARDANCY 审中-公开
标题翻译：具有改进火焰延迟性的导热混合聚合物组合物
公开(公告)号：US20150232664A1
公开(公告)日：2015-08-20
申请号：US14110334
申请日：2012-09-07
申请人： Mingcheng Guo , Frans Mercx
发明人： Mingcheng Guo , Frans Mercx
IPC分类号： C08L77/02 , C09K5/14
CPC分类号： C08L77/02 , C08K3/04 , C08K3/042 , C08K3/22 , C08K7/14 , C08K2201/001 , C08L23/02 , C08L67/02 , C08L81/02 , C09K5/14
摘要： Disclosed herein are methods and compositions of thermally conductive polymers with improved flame retardancy. The resulting compositions can be used in the manufacture of articles while still retaining the advantageous physical properties of thermally conductive polymers with improved flame retardancy. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
摘要翻译：本文公开了具有改进的阻燃性的导热聚合物的方法和组合物。所得组合物可用于制品制品，同时仍保持具有改进的阻燃性的导热聚合物的有利物理性能。该摘要旨在作为用于在特定技术中进行搜索的扫描工具，而不意在限制本发明。

5. 发明申请

US20080142494A1 THERMALLY REGULATED HEATER FOR MOTOR VEHICLES 审中-公开
标题翻译：用于电动车辆的热调节加热器
公开(公告)号：US20080142494A1
公开(公告)日：2008-06-19
申请号：US11612508
申请日：2006-12-19
申请人： Barre Blake , Thomas M. Goral , Eric Kowal , Frans Mercx , Arthur Vermolen
发明人： Barre Blake , Thomas M. Goral , Eric Kowal , Frans Mercx , Arthur Vermolen
IPC分类号： H05B11/00 , H05B3/10
CPC分类号： B60N2/5685 , H05B2214/04 , Y10T29/49083
摘要： A thermally regulating heater and a heated seat made using these heaters wherein the resulting heated seat provides enhanced temperature control without the need of any temperature control system. The heaters include the use of a polymeric positive temperature coefficient composition that operates at lower trip temperatures than previous polymeric positive temperature coefficient compositions. The polymeric positive temperature coefficient composition have a trip temperature below the heat deflection temperature of the composition such that the polymeric positive temperature coefficient composition heats the heated seat to a temperature closer to the comfort level of an individual using the heated seat. Since the polymeric positive temperature coefficient composition uses plastic materials, the polymeric positive temperature coefficient composition can be formed into different shapes as needed using a molding process, such as injection molding.
摘要翻译：一种热调节加热器和使用这些加热器制成的加热座椅，其中所得到的加热座椅提供增强的温度控制，而不需要任何温度控制系统。加热器包括使用在比以前的聚合物正温度系数组合物更低的行程温度下操作的聚合物正温度系数组成。聚合物正温度系数组合物具有低于组合物的热变形温度的跳闸温度，使得聚合物正温度系数组合物将加热的座椅加热到更接近使用加热座椅的个体舒适度的温度。由于聚合物正温度系数组合物使用塑料材料，因此聚合物正温度系数组合物可以根据需要使用诸如注射成型的成型方法形成不同的形状。

6. 发明授权

US06242519B1 Polyester molding composition 失效
标题翻译：聚酯成型组合物
公开(公告)号：US06242519B1
公开(公告)日：2001-06-05
申请号：US09231104
申请日：1999-01-14
申请人： Estelle Cheret , Richard De Vries , Frans Mercx , Vladimir Kwiecinski
发明人： Estelle Cheret , Richard De Vries , Frans Mercx , Vladimir Kwiecinski
IPC分类号： C08K504
CPC分类号： C08L51/003 , C08L51/04 , C08L67/02 , C08L77/12 , C08L2666/14 , C08L51/00 , C08L2666/02
摘要： A thermoplastic glass filled resin composition having improved heat distortion properties consisting essentially of a resin blend consisting essentially of an alkylene aryl polyester, a core-shell ASA (acrylate-styrene-acrylonitrile interpolymer) and an effective amount of talc, polyesteramide, or dicarboxcylic acid salt for enhancing the heat distortion properties of the resin.
摘要翻译：具有改进的热变形性能的热塑性玻璃填充树脂组合物基本上由基本上由亚烷基芳基聚酯，核 - 壳ASA（丙烯酸酯 - 苯乙烯 - 丙烯腈互聚物）和有效量的滑石，聚酯酰胺或二羧酸盐，用于增强树脂的热变形性能。

7. 发明授权

US08552101B2 Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof 有权
标题翻译：含有低导热性填料的导热性和电绝缘性聚合物组合物及其用途
公开(公告)号：US08552101B2
公开(公告)日：2013-10-08
申请号：US13402216
申请日：2012-02-22
申请人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
发明人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
IPC分类号： C08K3/06
CPC分类号： H01B3/004 , C08K3/01 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.
摘要翻译：本文公开的是包含a。 35〜80体积％的热塑性聚合物; b。 5至45vol％的导热性低导电的电绝缘填料，其本征热导率为10至30W / mK; C。 5至15体积％的具有大于或等于50W / mK的固有热导率的高导热电绝缘填料; 和d。 5至15体积％的具有大于或等于50W / mK的本征热导率的高导热导电填料，其特征在于：i。至少1.0W / mK的热导率; 和ii。体积电阻率至少为107欧姆·厘米。还公开了用于其的物品和方法。

8. 发明申请

US20070134411A1 Method for making compositions containing microcapsules and compositions made thereof 审中-公开
标题翻译：制备含有微胶囊的组合物的方法及其制备的组合物
公开(公告)号：US20070134411A1
公开(公告)日：2007-06-14
申请号：US11326213
申请日：2006-01-05
申请人： Nicola Cont , Frans Mercx , Robert Borst
发明人： Nicola Cont , Frans Mercx , Robert Borst
IPC分类号： B01J13/02
CPC分类号： C08J3/22 , B01J13/02 , C08K9/10
摘要： In the process of the invention, a composition is made by mixing a plurality of microcapsules containing at least an additive such as lubricants, oils, fragrances, colorants, etc., with a dispersing polymeric material to form a first blend, and compounding the first blend into a base containing at least a polymeric material at a temperature of less than 370° C., whereas the resulting composition is substantially free of segregated microcapsules and heat degraded shell.
摘要翻译：在本发明的方法中，通过将包含至少一种添加剂如润滑剂，油，香料，着色剂等的多个微胶囊与分散聚合物材料混合以形成第一共混物来制备组合物，并将第一在低于370℃的温度下共混成至少含有聚合物材料的基质，而所得组合物基本上不含分离的微胶囊和热降解壳。

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