会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • Automatic testing equipment instrument card and probe cabling system and apparatus
    • 自动测试设备仪表卡和探头布线系统及仪器
    • US20070096756A1
    • 2007-05-03
    • US11262001
    • 2005-10-28
    • Frank ParrishArash Behziz
    • Frank ParrishArash Behziz
    • G01R31/02
    • G01R31/2889G01R1/07378
    • A device for interfacing a test head and a prober is disclosed using wires or cables to provide the connection from a probe card interface boards to the probe card. The use of wires or cables, in place of the traditional pogo pin arrangement allows for more reliable and efficient testing, as well as additional high performance tests to be run. Optionally, a probe interface contains a stiffening member with multiple sidewalks and individual, configuration-specific probe card interface strips are connected to a probe card through zero insertion force clamps. The probe card interface attaches to the test head using standard probe interface board (“PIB”) docking mechanics. The assembly is then connected to a probe to carry out the testing procedures.
    • 使用电线或电缆公开了用于连接测试头和探测器的装置,以提供从探针卡接口板到探针卡的连接。 使用电线或电缆代替传统的pogo引脚布置,可以进行更可靠和高效的测试,以及进行额外的高性能测试。 可选地,探针接口包含具有多个人行道的加强构件,并且单独的配置专用探针卡接口条通过零插入力夹具连接到探针卡。 探头卡接口使用标准探头接口板(“PIB”)对接机构连接到测试头。 然后将组件连接到探头以执行测试程序。
    • 3. 发明授权
    • Low-cost tester interface module
    • 低成本测试仪接口模块
    • US06686732B2
    • 2004-02-03
    • US10026861
    • 2001-12-20
    • Frank Parrish
    • Frank Parrish
    • G01R3102
    • G01R31/2889G01R1/06772G01R1/07371G01R1/18
    • An interface module for connecting a plurality of signal paths from a first electronic assembly to a second electronic assembly is disclosed. The interface module includes a plurality of coaxial cables having distal ends adapted for coupling to the first electronic assembly and proximal ends, each cable having a shield conductor and a center conductor. A stiffener formed with a plurality of throughbores receives the proximal ends of the plurality of signal cables, the stiffener having a flat termination side at one end of the plurality of throughbores. The module further includes a signal transition assembly having a flat substrate bonded to the stiffener termination side. The substrate includes respective opposite sides and is formed with spaced-apart signal paths and ground paths extending from one side to the other side. Each center conductor and shield conductor are electrically coupled to the signal paths and ground paths and mounted to the signal transition assembly to minimize relative axial displacement.
    • 公开了一种用于将多个信号路径从第一电子组件连接到第二电子组件的接口模块。 接口模块包括多个同轴电缆,其具有适于联接到第一电子组件和近端的远端,每个电缆具有屏蔽导体和中心导体。 形成有多个通孔的加强件容纳多个信号电缆的近端,加强件在多个通孔的一端具有平坦的终端侧。 模块还包括信号转换组件,其具有结合到加强件终端侧的平坦基底。 衬底包括相应的相对侧并且形成有间隔开的信号路径和从一侧延伸到另一侧的接地路径。 每个中心导体和屏蔽导体电耦合到信号路径和接地路径,并安装到信号转换组件以最小化相对轴向位移。
    • 4. 发明授权
    • Modular semiconductor tester interface assembly for high performance coaxial connections
    • 用于高性能同轴连接的模块化半导体测试仪接口组件
    • US06515499B1
    • 2003-02-04
    • US09676041
    • 2000-09-28
    • Frank ParrishArash BehzizArthur E. LeColstDerek CastellanoDonald Eric ThompsonJonathan M. Becker
    • Frank ParrishArash BehzizArthur E. LeColstDerek CastellanoDonald Eric ThompsonJonathan M. Becker
    • G01R3102
    • G01R1/07378
    • A tester interface assembly is disclosed for coupling a plurality of tester electronic channels to a device-interface-board. The tester interface assembly includes at least one harness assembly having a plurality of coaxial cables, each cable including a body having a center conductor and a shield. The shield is formed coaxially around the center conductor and separated therefrom by a layer of dielectric. Each cable further includes a distal tip formed substantially similar to the body and including respective formed conductive pads disposed on the distal extremities of the center conductor and the shield. The harness employs a housing formed with an internal cavity for receiving and securing the cable distal ends in close-spaced relationship such that the distal tips form an interface engagement plane. A compliant interconnect is interposed between the harness assembly and the device-interface-board, and includes a plurality of conductors formed to engage the cable distal ends along the engagement plane.
    • 公开了用于将多个测试仪电子通道耦合到设备接口板的测试器接口组件。 测试器接口组件包括至少一个具有多个同轴电缆的线束组件,每个电缆包括具有中心导体和屏蔽的主体。 屏蔽层同轴地形成在中心导体周围并与电介质层分离。 每个电缆还包括形成为基本上类似于主体并且包括设置在中心导体和屏蔽件的远端上的各自形成的导电焊盘的远端。 线束采用形成有内腔的壳体,用于以紧密隔开的关系接收和固定电缆远端,使得远端尖端形成界面接合平面。 柔性互连被插入在线束组件和器件接口板之间,并且包括多个导体,其形成为沿着接合平面接合电缆远端。
    • 8. 发明授权
    • High power interface
    • 大功率接口
    • US06916990B2
    • 2005-07-12
    • US10261738
    • 2002-09-30
    • Arash BehzizFrank ParrishDonald ThompsonArthur LeColstKeith BreinlingerBrian BrechtGerald H. Johnson
    • Arash BehzizFrank ParrishDonald ThompsonArthur LeColstKeith BreinlingerBrian BrechtGerald H. Johnson
    • H01B7/00H01B7/08
    • H01B7/0838H01B7/0018
    • In one embodiment a high power interface apparatus is provided having a multilayer laminated cable including force conductor planes having flush and recessed portions and return conductor planes having flush and recessed portions. The flush portions of the conductor planes extend to a contact end of the laminated cable and the recessed portions are removed from the contact end. The flush portions are aligned along axes at the contact end. The flush portions of the return conductor planes are aligned at the contact end along axes aligned within recessed portions of the force conductor planes. A dielectric material separates the force and return conductor planes. Surface contact pads may be provided on the contact end including force contact pads, each contacting and extending along aligned flush portions of the force conductor planes, and including return conductor pads, each contacting and extending along aligned flush portions of the return conductor planes. The contact pads may be formed by plating the end, and then scoring. The multilayer laminate cable can be formed with a rigid portion near the contact end and a flexible portion between the cable ends. In some embodiments the force and return conductor planes of the flexible portion extend to the ends of the cable while the rigid portion can be formed with additional force and return conductor planes. Through vias may be included at the rigid portion to electrically couple the force conductor planes together and to electrically coupling the return conductor planes together.
    • 在一个实施例中,提供了一种高功率接口装置,其具有包括具有平齐和凹陷部分的力导体平面和具有平齐和凹陷部分的返回导体平面的多层层叠电缆。 导体平面的平齐部分延伸到层压电缆的接触端,并且凹部从接触端移除。 冲洗部分沿接触端的轴线对齐。 返回导体平面的平齐部分在接触端处沿着对准在力导体平面的凹部内的轴线对齐。 电介质材料分离力和返回导体平面。 表面接触焊盘可以设置在接触端上,包括力接触焊盘,每个接触焊盘接触并延伸到力导体平面的对齐的齐平部分,并且包括返回导体焊盘,每个接触焊盘接触并沿着对准的返回导体平面的齐平部分延伸。 接触垫可以通过电镀端部形成,然后进行刻痕。 多层叠层电缆可以形成在接触端附近的刚性部分和电缆端部之间的柔性部分。 在一些实施例中,柔性部分的力和返回导体平面延伸到电缆的端部,而刚性部分可以由附加的力和返回导体平面形成。 通孔可以被包括在刚性部分中以将力导体平面电耦合在一起并且将返回导体平面电耦合在一起。
    • 9. 发明申请
    • Rotational positioner and methods for semiconductor wafer test systems
    • 半导体晶圆测试系统的旋转定位器和方法
    • US20080174330A1
    • 2008-07-24
    • US11656825
    • 2007-01-23
    • Frank Parrish
    • Frank Parrish
    • G01R31/26H01L23/48
    • G01R1/07342G01R1/0491G01R31/2887
    • A semiconductor wafer prober is configured to rotate a semiconductor wafer into relative alignment with a wafer-interface probe adapted to simultaneously probe a number of integrated circuits within a sector of the semiconductor wafer. The wafer can include integrated circuits having different orientations, such that all of the integrated circuits within a given sector being tested have the same orientation. For example, a semiconductor wafer can include two semicircular sectors, with the integrated circuits on either sector having a common orientation rotated 180 degrees from a common orientation of the integrated circuits of the other sector. A wafer-interface probe, or probe card, adapted to test the entire semicircular sector during a single touch down is able to test the entire wafer with one rotational translation between testing.
    • 半导体晶片探测器被配置为使半导体晶片与适于同时探测半导体晶片的扇区内的多个集成电路的晶片接口探头相对对准。 晶片可以包括具有不同取向的集成电路,使得被测试的给定扇区内的所有集成电路具有相同的取向。 例如,半导体晶片可以包括两个半圆形扇区,其中两个扇区上的集成电路具有从另一扇区的集成电路的共同定向旋转180度的共同定向。 适用于在单次触摸下测试整个半圆形扇区的晶圆接口探针或探针卡能够在测试之间以一个旋转平移进行测试。