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1. 发明授权

US06364762B1 Wafer atmospheric transport module having a controlled mini-environment 有权
标题翻译：晶圆大气输送模块具有受控的微型环境
公开(公告)号：US06364762B1
公开(公告)日：2002-04-02
申请号：US09410190
申请日：1999-09-30
申请人： Farro F. Kaveh , David E. Jacob , Dean Jay Larson , Martin R. Maraschin
发明人： Farro F. Kaveh , David E. Jacob , Dean Jay Larson , Martin R. Maraschin
IPC分类号： B01L104
CPC分类号： H01L21/67778
摘要： An atmospheric transport module is provided. The module includes an enclosed housing having a top region, a central region, a bottom region, and a load cell region. A blower is located in the top region of the enclosed housing and is configured to generate a flow of air downward into the central region. A shelf in the load cell region defines a separation between the central region and the bottom region of the enclosed housing. The shelf is at least partially spaced apart from a wall of the load cell region to thereby define a slot behind the shelf. A perforated sheet is configured to extend horizontally from the shelf and further define the separation between the central region and the bottom region. In this example, air flow generated by the blower is restricted from freely flowing through the perforated sheet and is partially caused to be redirected toward the shelf of the load cell, through the slot and into the bottom region of the enclosure housing. A cassette having one or more wafers is configured to sit on the shelf in the load cell and thus be subjected to the redirected air flow. This redirected air flow will thus gently flow over the surfaces of the wafers and assist in removing post-process gases and particles from over the wafer surfaces while the wafers temporarily sit in the atmospheric transport module.
摘要翻译：提供大气传输模块。模块包括具有顶部区域，中心区域，底部区域和负载单元区域的封闭壳体。鼓风机位于封闭壳体的顶部区域中并且构造成产生向下流入中心区域的空气流。称重传感器区域中的搁架限定了封闭壳体的中心区域和底部区域之间的间隔。搁板至少部分地与称重传感器区域的壁间隔开，从而在搁板后面限定狭槽。穿孔板被构造成从搁架水平延伸，并进一步限定中心区域和底部区域之间的间隔。在该示例中，由鼓风机产生的空气流被限制为自由地流过穿孔板，并且部分地被引导通过该狭槽重新定向到测力传感器的搁架，并进入外壳壳体的底部区域。具有一个或多个晶片的盒被配置为坐在称重传感器中的搁架上，并因此受到重定向的空气流。因此，这种重新定向的空气流将轻轻地流过晶片的表面，并且有助于在晶片临时位于大气输送模块中时从晶片表面上除去后处理气体和颗粒。

2. 发明授权

US6142163A Method and apparatus for pressure control in vacuum processors 失效
标题翻译：真空处理器中压力控制的方法和装置
公开(公告)号：US6142163A
公开(公告)日：2000-11-07
申请号：US53530
申请日：1998-03-31
申请人： Brian K. McMillin , Farro F. Kaveh , Michael S. Barnes
发明人： Brian K. McMillin , Farro F. Kaveh , Michael S. Barnes
IPC分类号： G05D16/20 , F16K17/34 , F17D1/16
CPC分类号： G05D16/2013 , Y10T137/0396 , Y10T137/2572 , Y10T137/7761
摘要： A method and apparatus is disclosed for controlling the pressure of a reaction chamber in wafer processing equipment. The disclosed apparatus and method uses a ballast port for inserting gas into the evacuation system, thereby controlling the pressure in the reaction chamber. The disclosed apparatus and method further uses estimation curves to estimate the desired position of a controlled gate valve which is located between the reaction chamber and turbo pump. The disclosed apparatus and method achieves a set point pressure by prepositioning a throttle valve followed by repositioning the throttle valve based on the difference between a measure pressure and the set point pressure using proportional and integral control, wherein enablement of integral control is delay for a pre-specified period.
摘要翻译：公开了一种用于控制晶片加工设备中的反应室的压力的方法和装置。所公开的装置和方法使用用于将气体插入抽空系统中的压载端口，从而控制反应室中的压力。所公开的装置和方法还使用估计曲线来估计位于反应室和涡轮泵之间的受控闸阀的期望位置。所公开的装置和方法通过使用比例和积分控制基于测量压力和设定点压力之间的差异来预先设定节流阀，然后重新定位节流阀来实现设定点压力，其中积分控制的启用是预先的延迟规定期

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