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    • 1. 发明授权
    • Printed circuit board and method for its manufacture
    • 印刷电路板及其制造方法
    • US06370292B1
    • 2002-04-09
    • US09382258
    • 1999-08-24
    • Engelbert Strake
    • Engelbert Strake
    • G02B612
    • G02B6/43G02B6/10G02B6/42G02B6/4214H05K1/0274
    • An optoelectronic, multilayer printed circuit board having at least one layer to be fitted with components. The printed circuit board having an electrical printed circuit trace on the exterior of the layer structure and optical signal-transmission paths which are patterned as integrated multimode waveguides in a system having additional, optically transparent layers. According to this structure, a cost-effective implementation is achieved with respect to optical multimode interconnect lines with passive structures, coupling points for optical fibers and for optoelectronic components for transmitting and receiving optical signals, and conventional electrical signaling links on a shared carrier. The transparent layers are located in the interior of the layer structure, and largely conventional methods are used to pattern these layers.
    • 一种具有至少一层待组装的光电多层印刷电路板。 印刷电路板在层结构的外部具有电印刷电路迹线,并且在具有附加的光学透明层的系统中被图案化为集成多模波导的光信号传输路径。 根据该结构,对于具有无源结构的光多模互连线,用于光纤的耦合点和用于发送和接收光信号的光电元件以及共用载波上的传统电信令链路,实现了成本有效的实现。 透明层位于层结构的内部,并且使用常规的方法来对这些层进行图案化。