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    • 2. 发明授权
    • Manufacturing process for non-volatile floating gate memory cells integrated on a semiconductor substrate and comprised in a cell matrix with an associated control circuitry
    • 集成在半导体衬底上并且包括在具有相关联的控制电路的单元矩阵中的非易失性浮动栅极存储器单元的制造工艺
    • US06420223B2
    • 2002-07-16
    • US09730518
    • 2000-12-05
    • Emilio Camerlenghi
    • Emilio Camerlenghi
    • H01L218238
    • H01L27/105H01L27/1052H01L27/11526H01L27/11534
    • A process for forming floating gate non-volatile memory cells in a cell matrix with associated control circuitry comprising both N-channel and P-channel MOS transistors is provided. The process includes forming active areas in a substrate for the cell matrix and the associated control circuitry. A first thin oxide layer and a first polysilicon layer are deposited on the active areas to produce floating gate regions of the memory cells, and a second dielectric layer is deposited on the active areas. A second polysilicon layer is then deposited on the active areas. A masking and etching step is performed for exposing the substrate for the associated control circuitry followed by the deposition of a third polysilicon layer. The third polysilicon layer is defined to produce the gate regions of the transistors for the associated control circuitry while the third polysilicon layer is removed from the cell matrix. A self-aligned etching step is performed to define the gate regions of the memory cells, and dopants are implanted in the junction areas to produce the source/drain regions of the memory cells.
    • 提供了一种用于在具有包括N沟道和P沟道MOS晶体管的相关控制电路的单元矩阵中形成浮栅非易失性存储单元的过程。 该过程包括在用于单元矩阵和相关联的控制电路的衬底中形成有源区。 第一薄氧化物层和第一多晶硅层沉积在有源区上以产生存储单元的浮动栅区,并且第二介电层沉积在有源区上。 然后将第二多晶硅层沉积在有源区上。 执行掩模和蚀刻步骤,用于暴露相关控制电路的衬底,随后沉积第三多晶硅层。 第三多晶硅层被定义为产生用于相关联的控制电路的晶体管的栅极区域,而第三多晶硅层从单元矩阵中移除。 执行自对准蚀刻步骤以限定存储器单元的栅极区域,并且在结区域中注入掺杂剂以产生存储器单元的源极/漏极区域。