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1. 发明申请

US20120100774A1 TRANSPARENT SUBSTRATE WITH THIN FILM AND METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE WITH CIRCUIT PATTERN WHEREIN SUCH TRANSPARENT SUBSTRATE WITH THIN FILM IS USED 审中-公开
标题翻译：具有薄膜的透明衬底和用于制造透明衬底的方法，其中使用具有薄膜的这种透明衬底的电路图案
公开(公告)号：US20120100774A1
公开(公告)日：2012-04-26
申请号：US13342553
申请日：2012-01-03
申请人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Takamitsu Isono , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
发明人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Takamitsu Isono , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
IPC分类号： H01J9/30 , H05K3/00
CPC分类号： H01J9/02 , C03C17/2453 , C03C23/0025 , C03C23/007 , C03C2217/211 , C03C2217/23 , C03C2217/231 , C03C2217/24 , C03C2218/151 , H05K3/027 , H05K2201/0108 , H05K2201/0326 , Y10T29/49124 , Y10T29/49155
摘要： An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.
摘要翻译：本发明的目的是提供一种制造具有氧化锡薄膜的透明基板的方法，该方法即使通过用能量低的激光照射也能令人满意地进行图案化，因为其中发生烧蚀现象。本发明涉及具有电路图案的透明基板的制造方法，其特征在于，对具有载体浓度为5×1019 / cm3以上的透明导电膜的透明基板进行照射，使用波长为1064nm的激光，以在透明基板上形成电路图案。

2. 发明授权

US08655630B2 Apparatus, system, and method for construction of a design workflow 有权
标题翻译：用于构建设计工作流的装置，系统和方法
公开(公告)号：US08655630B2
公开(公告)日：2014-02-18
申请号：US13201854
申请日：2010-02-16
申请人： Yoshiharu Iwata , Ryohei Satoh , Keiji Kudo , Atsushi Taya , Kazuya Okamoto , Hidenori Murata , Koichiro Atsumi , Eiji Arai , Eiji Morinaga
发明人： Yoshiharu Iwata , Ryohei Satoh , Keiji Kudo , Atsushi Taya , Kazuya Okamoto , Hidenori Murata , Koichiro Atsumi , Eiji Arai , Eiji Morinaga
IPC分类号： G06F17/50
CPC分类号： G06Q10/06 , G06Q10/0633
摘要： A design workflow construction apparatus is provided for supporting design of an object having a plurality of design elements. In constructing the design workflow, the apparatus uses input variables, design variables, and intermediate variables. The design workflow construction apparatus includes means for acquiring object design elements and means for determining an order of designing the object design elements. The apparatus also includes means for determining the important design variables.
摘要翻译：提供了一种用于支持具有多个设计元素的对象的设计的设计工作流构建装置。在构建设计工作流程中，设备使用输入变量，设计变量和中间变量。设计工作流程构建装置包括用于获取对象设计元素的装置和用于确定设计对象设计元素的顺序的装置。该装置还包括用于确定重要设计变量的装置。

3. 发明授权

US08418359B2 Method for manufacturing circuit pattern-provided substrate 有权
标题翻译：制造电路图形衬底的方法
公开(公告)号：US08418359B2
公开(公告)日：2013-04-16
申请号：US12364314
申请日：2009-02-02
申请人： Ryohei Satoh , Koji Nakagawa , Eiji Morinaga , Reo Usui , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
发明人： Ryohei Satoh , Koji Nakagawa , Eiji Morinaga , Reo Usui , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： G03F7/2022 , H01J9/02 , H01J11/10 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49155
摘要： A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.
摘要翻译：一种制造电路图形衬底的方法，包括在衬底上形成抗蚀剂层，形成与电路图形相对应的开口，并且在抗蚀剂层中具有檐形横截面形状，形成薄膜层，该薄膜层形成在开口中的基板和形成在抗蚀剂层上的部分，并且去除抗蚀剂层，使得抗蚀剂层和形成在抗蚀剂层上的薄膜层的部分从基板上去除。开口的形成包括用改变抗蚀剂层的曝光量的掩模装置曝光抗蚀剂层，使得檐横截面形状在抗蚀剂层和基底之间的边界处具有空间。

4. 发明申请

US20080202798A1 TRANSPARENT SUBSTRATE WITH THIN FILM AND METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE WITH CIRCUIT PATTERN WHEREIN SUCH TRANSPARENT SUBSTRATE WITH THIN FILM IS USED 审中-公开
标题翻译：具有薄膜的透明衬底和用于制造透明衬底的方法，其中使用具有薄膜的这种透明衬底的电路图案
公开(公告)号：US20080202798A1
公开(公告)日：2008-08-28
申请号：US12110707
申请日：2008-04-28
申请人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Takamitsu Isono , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
发明人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Takamitsu Isono , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
IPC分类号： H05K1/03 , H05K3/22
CPC分类号： H01J9/02 , C03C17/2453 , C03C23/0025 , C03C23/007 , C03C2217/211 , C03C2217/23 , C03C2217/231 , C03C2217/24 , C03C2218/151 , H05K3/027 , H05K2201/0108 , H05K2201/0326 , Y10T29/49124 , Y10T29/49155
摘要： An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.
摘要翻译：本发明的目的是提供一种制造具有氧化锡薄膜的透明基板的方法，该方法即使通过用能量低的激光照射也能令人满意地进行图案化，因为其中发生烧蚀现象。本发明涉及一种用于制造承载电路图案的透明基板的方法，该方法包括：照射带有透明基板的薄膜附着透明基板，该透明基板上具有载流子浓度为5×10 19 / > / cm 3以上，具有波长为1064nm的激光，以在透明基板上形成电路图案。

5. 发明申请

US20120053905A1 DESIGN WORKFLOW CONSTRUCTION APPARATUS, DESIGN WORKFLOW CONSTRUCTION METHOD, DESIGN SYSTEM, DESIGN METHOD, DESIGN WORKFLOW CONSTRUCTION PROGRAM, AND COMPUTER READABLE RECORDING MEDIUM IN WHICH DESIGN WORKFLOW CONSTRUCTION PROGRAM IS STORED 有权
标题翻译：设计工作流施工设备，设计工作流程施工方法，设计系统，设计方法，设计工作流程构造程序和设计工作流程构建程序存储的计算机可读记录介质
公开(公告)号：US20120053905A1
公开(公告)日：2012-03-01
申请号：US13201854
申请日：2010-02-16
申请人： Yoshiharu Iwata , Ryohei Satoh , Keiji Kudo , Atsushi Taya , Kazuya Okamoto , Hidenori Murata , Koichiro Atsumi , Eiji Arai , Eiji Morinaga
发明人： Yoshiharu Iwata , Ryohei Satoh , Keiji Kudo , Atsushi Taya , Kazuya Okamoto , Hidenori Murata , Koichiro Atsumi , Eiji Arai , Eiji Morinaga
IPC分类号： G06F17/50
CPC分类号： G06Q10/06 , G06Q10/0633
摘要： A design system (1) is provided with a function of acquiring a design specification of an object to be designed and an evaluation index for evaluating a value of the object to be designed in the design specification; a function of acquiring profile data of the object to be designed; a function (design order determining section (12)) of extracting entity design elements and important design variables from the profile data and prioritizing the entity design elements and the important design variables so as to construct a design workflow; a function (evaluation approach construction section (13)) of constructing an evaluation formula for performance/evaluation of a design result of each of the entity design elements in conformity with the design workflow; a function of finding an appropriate solution by performing automatic optimization while evaluating the design result with use of the evaluation index in accordance with the design workflow with which the evaluation formula is associated; and a function of outputting the appropriate solution thus found. This allows the object to be designed to be parametrically handled, and makes it possible to create a design workflow for efficiently finding an optimum design solution by properly combining a series of design elements and to find an appropriate solution with the use of the design workflow.
摘要翻译：设计系统（1）具有获取要设计的对象的设计规范和评估设计规范中要设计的对象的值的评估指标的功能; 获取要设计的对象的简档数据的功能; 从简档数据中提取实体设计元素和重要设计变量的功能（设计顺序确定部分（12）），并对实体设计元素和重要设计变量进行优先排序，从而构建设计工作流程; （评估方法构建部（13）），其根据设计工作流程构建用于对每个实体设计元素的设计结果进行性能/评估的评估公式; 通过根据与评估公式相关联的设计工作流程使用评估指数来评估设计结果，通过执行自动优化来找到适当的解决方案的功能; 以及输出由此找到的适当解决方案的功能。这允许将对象设计为参数化处理，并且可以创建设计工作流，以通过适当地组合一系列设计元素来有效地找到最佳设计解决方案，并使用设计工作流程找到适当的解决方案。

6. 发明申请

US20090205851A1 ELECTRONIC CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电子电路装置及其制造方法
公开(公告)号：US20090205851A1
公开(公告)日：2009-08-20
申请号：US12364314
申请日：2009-02-02
申请人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
发明人： Ryohei SATOH , Koji Nakagawa , Eiji Morinaga , Reo Usui , Kenji Tanaka , Satoru Takaki , Kenichi Ebata , Hiroshi Sakamoto
IPC分类号： H05K1/00 , G03F7/00
CPC分类号： G03F7/2022 , H01J9/02 , H01J11/10 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49155
摘要： The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or the like. The invention relates to a method for manufacturing a circuit pattern-provided substrate, in which a desired circuit pattern comprising a thin film layer is formed on a substrate, which method includes: a step of forming a resist layer on the substrate; a step of forming an opening of a shape corresponding to a desired circuit pattern in the resist layer; a step of forming a thin film layer; and a step of peeling off the resist layer and the thin film layer formed on the resist layer, wherein the cross-sectional shape in the opening of the resist layer has a cross-sectional shape of eaves type having a space at a boundary part between the resist layer and the substrate, the height and the width of the space are determined such that when the thin film layer is formed in the thin film layer forming step, an end of the thin film layer formed on the substrate in the opening does not go up onto a foot of the resist layer.
摘要翻译：本发明提供一种制造具有电路图案的透明基板的方法，该透明基板具有无图案剥离和残留抗蚀剂的电路图案，并且具有良好的图案精度，并且当用作电子的电极时不会断开电路等。本发明涉及一种用于制造电路图形提供的基板的方法，其中在基板上形成包括薄膜层的期望的电路图案，该方法包括：在基板上形成抗蚀剂层的步骤; 在抗蚀剂层中形成与期望的电路图形相对应的形状的开口的步骤; 形成薄膜层的步骤; 以及剥离形成在抗蚀剂层上的抗蚀剂层和薄膜层的步骤，其中抗蚀剂层的开口中的横截面形状具有檐形的横截面形状，在其间的边界部分具有空间确定抗蚀剂层和基板，空间的高度和宽度，使得当在薄膜层形成步骤中形成薄膜层时，开口中形成在基板上的薄膜层的端部不爬到抗蚀剂层的脚下。

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