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1. 发明授权

US5415944A Solder clad substrate 失效
标题翻译：焊接基板
公开(公告)号：US5415944A
公开(公告)日：1995-05-16
申请号：US236615
申请日：1994-05-02
申请人： Vahid Kazem-Goudarzi , Edwin L. Bradley, III , Kingshuk Banerji , Henry F. Liebman
发明人： Vahid Kazem-Goudarzi , Edwin L. Bradley, III , Kingshuk Banerji , Henry F. Liebman
IPC分类号： B22F1/00 , B23K35/02 , B23K35/26 , C22C1/04 , H05K3/12 , H05K3/34 , B22F7/00 , H01L23/02
CPC分类号： H05K3/3484 , B22F1/0003 , B23K35/0244 , B23K35/262 , C22C1/04 , H05K2201/0215 , H05K2201/0272 , H05K2203/043 , H05K2203/0568 , H05K3/1216 , H05K3/3452 , H05K3/3463 , Y10T428/12014 , Y10T428/12028 , Y10T428/12063 , Y10T428/12097 , Y10T428/12104 , Y10T428/1216
摘要： A solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.
摘要翻译：焊料包覆印刷电路板（100）具有布置在第二焊料合金（115）的基体内的一种合金（120）的焊料颗粒。这种布置形成了与衬底上的焊盘（105）合金化的平坦结构。焊料颗粒（120）具有预定的熔融温度，并且由以下元素中的一种或多种制成：锡，铅，铋，铟，铜，锑，镉，砷，铝，镓，金，银。第二焊料合金（115）在组成上不同于焊料颗粒，并且具有低于焊料颗粒的熔化温度的熔化温度。焊料颗粒可以包含约88重量％，并且第二焊料合金可以包含约12重量％的焊料包层。

2. 发明授权

US5573602A Solder paste 失效
标题翻译：焊膏
公开(公告)号：US5573602A
公开(公告)日：1996-11-12
申请号：US358489
申请日：1994-12-19
申请人： Kingshuk Banerji , Edwin L. Bradley, III
发明人： Kingshuk Banerji , Edwin L. Bradley, III
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H05K3/34 , B23K35/34
CPC分类号： B23K35/262 , B23K35/0244 , B23K35/025 , H05K3/3484 , H05K2201/0218 , H05K3/3463 , Y10T428/12181
摘要： A solder paste is made from solder powder having two different alloys. The individual particles in the solder powder consist of a low melting solder coating (115) that surrounds a nucleus (120) of a higher melting solder. The low melting solder is compositionally distinct from the higher melting solder. The particles are suspended in a matrix of a solder paste vehicle, which may also contain a fluxing agent. In one embodiment of the invention, the low melting solder is an alloy of 43% tin, 43% lead and 14% bismuth, and the higher melting solder is an alloy of 52% tin, and 48% bismuth.
摘要翻译：焊膏由具有两种不同合金的焊料粉末制成。焊料粉末中的单个颗粒由围绕较高熔点焊料的核（120）的低熔点焊料涂层（115）组成。低熔点焊料在组成上不同于较高熔点的焊料。颗粒悬浮在焊膏载体的基质中，焊膏载体也可以含有助熔剂。在本发明的一个实施例中，低熔点焊料是43％锡，43％铅和14％铋的合金，而较高熔点的焊料是52％锡和48％铋的合金。

3. 发明授权

US5540379A Soldering process 失效
标题翻译：焊接工艺
公开(公告)号：US5540379A
公开(公告)日：1996-07-30
申请号：US236611
申请日：1994-05-02
申请人： Vahid Kazem-Goudarzi , Henry F. Liebman , Kingshuk Banerji , William B. Mullen, III , Edwin L. Bradley, III
发明人： Vahid Kazem-Goudarzi , Henry F. Liebman , Kingshuk Banerji , William B. Mullen, III , Edwin L. Bradley, III
IPC分类号： B23K35/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/0244 , B23K35/26 , H05K3/3484 , B23K35/025 , H05K2201/0272 , H05K2203/043 , H05K3/3463
摘要： A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.
摘要翻译：公开了使用两种不同类型的焊料合金的焊接工艺。第一焊料合金（115）在第一温度下经历固 - 液转变。第二焊料合金（120）在第二温度下经历该固 - 液转变，第二温度大于第一温度。将焊接组合物沉积在具有可焊接部分（105）的基底（100）上，并被加热到高于第一温度但低于第二温度（32）的温度。在此期间，第一焊料合金液化，而第二焊料合金保持固体。焊接组合物随后被冷却（40）以固化第一焊料材料。向固化的焊料材料添加部件或电子部件（80），并且焊料材料再次被加热到高于第二温度（30）以便回流焊料并在基板和电子部件之间形成冶金结合。

4. 发明授权

US5499756A Method of applying a tacking agent to a printed circuit board 失效
标题翻译：将粘合剂施加到印刷电路板的方法
公开(公告)号：US5499756A
公开(公告)日：1996-03-19
申请号：US383145
申请日：1995-02-03
申请人： Kingshuk Banerji , Edwin L. Bradley, III , Francisco Da Costa Alves
发明人： Kingshuk Banerji , Edwin L. Bradley, III , Francisco Da Costa Alves
IPC分类号： B23K1/00 , H05K3/12 , H05K3/34 , B23K31/02
CPC分类号： B23K1/0016 , H05K3/1225 , H05K3/3489 , B23K2201/36 , H05K2203/0143 , H05K2203/0191 , H05K2203/0264
摘要： A method of applying a tacking agent to a printed circuit board. The printed circuit board (10) has a number of solder pads (12), and each solder pad is preclad with a layer of solder (14) between 0.02 and 0.3 mm thick. A plastic film (16) is temporarily adhered to the printed circuit board by a pressure sensitive adhesive. The plastic film has a number of apertures (22) that correspond to the solder pads, and is positioned so that the apertures in the film expose the solder coated pads. There is a breakaway tab (20) on the plastic film that is used to peel the film from the printed circuit board in a later operation. The film is roller coated with a high viscosity tacking agent (30) so that a layer of the tacking agent is applied to the exposed interconnect pads. The plastic film is then peeled cleanly away from the printed circuit board using the breakaway tab, leaving the tacking agent only on the solder pads. An electronic component (35) can then be placed on the printed circuit board in contact with the coated solder pads. The printed circuit board and the electronic component can then be heated to reflow the clad solder and form a solder joint between the solder pads and the component.
摘要翻译：一种将印染电路板施加到印刷电路板上的方法。印刷电路板（10）具有多个焊盘（12），并且每个焊盘预先具有0.02-0.3mm厚的焊料层（14）。通过压敏粘合剂将塑料膜（16）暂时粘附到印刷电路板上。塑料膜具有与焊盘相对应的多个孔（22），并且被定位成使得膜中的孔露出焊料涂覆的焊盘。在塑料膜上有一个分离片（20），用于在稍后的操作中从印刷电路板剥离膜。该薄膜用高粘度粘合剂（30）辊涂，以便将一层粘合剂施加到暴露的互连垫上。然后使用分离片将塑料膜从印刷电路板上干净地剥离，仅将粘合剂留在焊盘上。然后可以将电子部件（35）放置在与涂覆的焊盘接触的印刷电路板上。然后可以加热印刷电路板和电子部件以回流包覆焊料并在焊盘和部件之间形成焊接接头。

5. 发明授权

US5427865A Multiple alloy solder preform 失效
标题翻译：多合金焊料预制件
公开(公告)号：US5427865A
公开(公告)日：1995-06-27
申请号：US236614
申请日：1994-05-02
申请人： William B. Mullen, III , Kingshuk Banerji , Edwin L. Bradley, III , Vahid Kazem-Goudarzi
发明人： William B. Mullen, III , Kingshuk Banerji , Edwin L. Bradley, III , Vahid Kazem-Goudarzi
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H05K3/34 , B22F7/02
CPC分类号： B23K35/0244 , B23K35/262 , H05K3/3484 , H05K2201/0272 , H05K2203/0338 , H05K2203/043 , H05K3/3452 , H05K3/3463 , Y10T428/12014 , Y10T428/12028 , Y10T428/12063 , Y10T428/12097 , Y10T428/12104 , Y10T428/1216
摘要： A solder preform (250) has solder particles of one alloy (210) arranged within a matrix of a second solder alloy (200). This arrangement forms a structure having the desired predetermined shape of the solder preform. The solder particles comprise one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The particles have a predetermined melting temperature. The second solder alloy is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight of the solder preform, and the second solder alloy comprises about 12% by weight of the preform.
摘要翻译：焊料预制件（250）具有布置在第二焊料合金（200）的基体内的一个合金（210）的焊料颗粒。这种布置形成了具有所需预定形状的焊料预制件的结构。焊料颗粒包括以下元素中的一种或多种：锡，铅，铋，铟，铜，锑，镉，砷，铝，镓，金，银。颗粒具有预定的熔融温度。第二焊料合金在组成上不同于焊料颗粒，并且具有低于焊料颗粒的熔化温度的熔化温度。焊料颗粒可以包含约88重量％的焊料预制件，第二焊料合金占预制件的约12重量％。

6. 发明授权

US5623127A Single alloy solder clad substrate 失效
标题翻译：单合金焊包覆基板
公开(公告)号：US5623127A
公开(公告)日：1997-04-22
申请号：US348427
申请日：1994-12-02
申请人： Edwin L. Bradley, III , Kingshuk Banerji , William B. Mullen, III
发明人： Edwin L. Bradley, III , Kingshuk Banerji , William B. Mullen, III
IPC分类号： B23K35/14 , B23K35/26 , H05K3/24 , H05K3/34 , H05K1/02
CPC分类号： B23K35/262 , H05K3/3484 , H05K2203/043 , H05K3/3463
摘要： A solder clad printed circuit board (100) consists of an electrically insulating substrate that has copper circuit traces (105), portions of which are solderable. A substantially planar layer (120) of a soldering composition is fused to the solderable traces, to form a solder pad that is not domed. The layer is composed of a mass of off-eutectic solder particles (115) that are fused together to form an agglomeration (120) having a porous structure. The solder particles are fused together by heating the off-eutectic solder to a temperature that is between the solidus temperature and the liquidus temperature of the solder. The solder is then cooled below the solidus temperature to solidify it.
摘要翻译：焊料包覆印刷电路板（100）由具有铜电路迹线（105）的电绝缘基板组成，其一部分是可焊接的。焊接组合物的基本平坦的层（120）被熔合到可焊接迹线，以形成不是圆顶的焊盘。该层由大量的非共熔焊料颗粒（115）组成，它们被熔合在一起以形成具有多孔结构的附聚物（120）。通过将非共晶焊料加热到固相线温度和焊料的液相线温度之间的温度将焊料颗粒熔合在一起。然后将焊料冷却至固相线温度以使其固化。

7. 发明授权

US5429293A Soldering process 失效
标题翻译：焊接工艺
公开(公告)号：US5429293A
公开(公告)日：1995-07-04
申请号：US358295
申请日：1994-12-19
申请人： Edwin L. Bradley, III , Kingshuk Banerji , Vahid Kazem-Goudarzi
发明人： Edwin L. Bradley, III , Kingshuk Banerji , Vahid Kazem-Goudarzi
IPC分类号： B23K35/02 , B23K35/26 , H05K3/12 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/025 , B23K35/26 , H05K3/3484 , B23K2201/04 , B23K2201/12 , H05K2201/035 , H05K2201/10992 , H05K2203/043 , H05K3/1216
摘要： A soldering process uses two or more different solder alloys. A first solder alloy (115) that undergoes a solid-to-liquid transition at a first temperature is coated (20) onto the solderable surfaces (105) of a printed circuit board (100). A solder paste (120) that undergoes this solid-to-liquid transition at a temperature greater than the first temperature is deposited on the coated solderable potions, and is heated to a temperature that is above the first temperature but below the second temperature. During this time, the first solder alloy liquifies, while the solder paste does not. The first solder alloy wets to the individual particles in the solder paste, and alloys to the solderable surfaces and the solder particles in the solder paste. The soldering composition is subsequently cooled (40) to solidify the first solder material, forming a solid and substantially planar coating on the solderable potions of the printed circuit board.
摘要翻译：焊接工艺使用两种或更多种不同的焊料合金。在第一温度下经历固 - 液过渡的第一焊料合金（115）涂覆（20）到印刷电路板（100）的可焊接表面（105）上。在大于第一温度的温度下经历该固 - 液过渡的焊膏（120）沉积在涂覆的可焊接部分上，并被加热到高于第一温度但低于第二温度的温度。在此期间，第一焊料合金液化，而锡膏不发生。第一焊料合金润湿焊锡膏中的各个颗粒，并将其焊接到可焊接表面和焊膏中的焊料颗粒。焊接组合物随后被冷却（40）以固化第一焊料材料，在印刷电路板的可焊接部分上形成固体和基本上平面的涂层。

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