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1. 发明授权

US08412052B2 Surface mount (SMT) connector for VCSEL and photodiode arrays 有权
标题翻译：用于VCSEL和光电二极管阵列的表面贴装（SMT）连接器
公开(公告)号：US08412052B2
公开(公告)日：2013-04-02
申请号：US10971234
申请日：2004-10-22
申请人： Edris M. Mohammed
发明人： Edris M. Mohammed
IPC分类号： H04B10/00
CPC分类号： G02B6/4257 , G02B6/4249 , G02B6/4292 , G02B6/43 , H01L31/167
摘要： Self alignment of Optoelectronic (OE) chips, such as photodiode (PD) modules and vertical cavity surface emitting laser (VCSEL) modules, to external waveguides or fiber arrays may be realized by packaging the OE chips directly in the fiber optic connector.
摘要翻译：可以通过将OE芯片直接封装在光纤连接器中来实现诸如光电二极管（PD）模块和垂直腔表面发射激光器（VCSEL）模块的光电（OE）芯片到外部波导或光纤阵列的自对准。

2. 发明授权

US08383949B2 Method to form lateral pad on edge of wafer 有权
标题翻译：在晶片边缘形成横向焊盘的方法
公开(公告)号：US08383949B2
公开(公告)日：2013-02-26
申请号：US12649328
申请日：2009-12-29
申请人： Edris M. Mohammed , Hinmeng Au
发明人： Edris M. Mohammed , Hinmeng Au
IPC分类号： H05K1/03 , H05K1/00 , H05K1/11 , H05K7/10 , H05K1/18 , H01L23/58 , H01L23/04 , H01L23/48
CPC分类号： H05K1/181 , H05K3/403 , H05K2201/10454 , Y02P70/611 , Y10T29/49124
摘要： Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.
摘要翻译：实施例涉及在衬底晶片衬底的边缘上形成衬垫阵列的装置和制造方法。本发明的实施例使得可以使用标准的半导体组装工艺将表面贴装器件垂直地（即在它们的侧面上）粘结。

3. 发明申请

US20080267231A1 DETUNED DUO-CAVITY LASER-MODULATOR DEVICE AND METHOD WITH DETUNING SELECTED TO MINIMIZE CHANGE IN REFLECTIVITY 有权
标题翻译：被解除的DUO-CAVITY激光器调制器装置和方法，其选择最小化反射率变化
公开(公告)号：US20080267231A1
公开(公告)日：2008-10-30
申请号：US11742049
申请日：2007-04-30
申请人： Serge OKTYABRSKY , Vadim TOKRANOV , Michael YAKIMOV , Jobert VanEISDEN , Edris M. MOHAMMED , Ian YOUNG
发明人： Serge OKTYABRSKY , Vadim TOKRANOV , Michael YAKIMOV , Jobert VanEISDEN , Edris M. MOHAMMED , Ian YOUNG
IPC分类号： H01S3/10
CPC分类号： H01S5/18302 , H01S5/0425 , H01S5/06226 , H01S5/1021 , H01S5/1039 , H01S5/18311 , H01S5/18352 , H01S5/18358 , H01S5/3095 , H01S2301/176
摘要： A detuned duo-cavity laser-modulator device and method are provided which include lower, middle and upper reflectors, a gain region and an absorber region integrated into a semiconductor die. The middle reflector is disposed between the lower and upper reflectors. Together, the lower and middle reflectors define a first resonant cavity, while the upper and middle reflectors define a second resonant cavity. A gain region is disposed within a laser cavity of the resonant cavities to generate an optical carrier wave, while an absorber region is disposed within a modulator cavity of the resonant cavities to modulate a signal on the optical carrier wave. The laser and modulator cavities are detuned resonant cavities, with the detuning of the laser and modulator cavities being selected to minimized change in reflection from the modulator cavity to the laser cavity when the absorber region modulates the signal on the optical carrier wave.
摘要翻译：提供了一种失谐的二腔激光调制装置和方法，其包括下反射器，中上反射器和上反射器，集成到半导体管芯中的增益区域和吸收器区域。中间反射器设置在下反射器和上反射器之间。一起，下反射器和中间反射器限定第一谐振腔，而上反射器和中反射器限定第二谐振腔。增益区域设置在谐振腔的激光腔内以产生光载波，而吸收体区域设置在谐振腔的调制器腔内，以调制光载波上的信号。激光器和调制器腔是失谐的谐振腔，当吸收器区域调制光载波上的信号时，选择激光器和调制器空腔的失谐以最小化从调制器腔到激光腔的反射变化。

4. 发明申请

US20160091776A1 INTEGRATED TERAHERTZ SENSOR 有权
标题翻译：集成的TERAHERTZ传感器
公开(公告)号：US20160091776A1
公开(公告)日：2016-03-31
申请号：US14499115
申请日：2014-09-27
申请人： Edris M. Mohammed , Ibrahim Ban
发明人： Edris M. Mohammed , Ibrahim Ban
IPC分类号： G02F1/35 , H01L31/14
CPC分类号： G02F1/353 , A61B5/1135 , A61B5/14532 , G01N21/3586 , G01N2021/1793 , G01V8/005 , G02F2203/13 , H01L31/14
摘要： Systems and methods may provide for an integrated miniature sensor that operates in the Terahertz region of the electromagnetic spectrum. The integrated miniature sensor may detect a remote target and operate in a non-contact, non-invasive manner. Numerous signal analysis techniques may be employed such as Doppler radar technology, absorption spectroscopy, and others when the integrated miniature sensor is used in biomedical, physiological and other settings where prolonged recording of bio-signals is needed.
摘要翻译：系统和方法可以提供在电磁频谱的太赫兹区域中操作的集成微型传感器。集成的微型传感器可以检测远程目标并以非接触，非侵入的方式操作。可以采用多种信号分析技术，例如多普勒雷达技术，吸收光谱学等，当集成的微型传感器用于需要延长生物信号记录的生物医学，生理和其他设置时。

5. 发明申请

US20140177625A1 ELECTRO-OPTICAL ASSEMBLY INCLUDING A GLASS BRIDGE 有权
标题翻译：电光装置包括玻璃桥
公开(公告)号：US20140177625A1
公开(公告)日：2014-06-26
申请号：US13722951
申请日：2012-12-20
申请人： Peter L.D. Chang , Edris M. Mohammed , Henning Braunisch , Hengju Cheng
发明人： Peter L.D. Chang , Edris M. Mohammed , Henning Braunisch , Hengju Cheng
IPC分类号： H04Q11/00 , H05K13/04 , H05K13/00
CPC分类号： G02B6/43 , H01L2224/73204 , Y10T29/49117 , Y10T29/4913
摘要： Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供了使用玻璃桥路由电光学组件路由信号的技术和配置。在一个实施例中，电光学组件包括具有激光器件的激光器管芯和通过一个或多个互连结构与激光管芯电耦合的玻璃桥，所述玻璃桥接器包括被配置为将电信号路由到激光器管芯从发射机设备。可以描述和/或要求保护其他实施例。

6. 发明申请

US20140177995A1 OPTICAL PHOTONIC CIRCUIT COUPLING 有权
标题翻译：光电子电路耦合
公开(公告)号：US20140177995A1
公开(公告)日：2014-06-26
申请号：US13721965
申请日：2012-12-20
申请人： Edris M. Mohammed , Peter L. Chang , Ibrahim Ban
发明人： Edris M. Mohammed , Peter L. Chang , Ibrahim Ban
IPC分类号： G02B6/12 , G02B6/132 , G02B6/136 , G02B6/36
CPC分类号： G02B6/36 , G02B6/12002 , G02B6/12004 , G02B6/1228 , G02B6/132 , G02B6/32 , G02B6/4214 , G02B2006/12176 , G02B2006/12195
摘要： Systems and methods may couple on-chip optical circuits to external fibers. An SOI waveguide structure may include mirror structures and tapered waveguides to optically couple optical circuits to fibers in a vertically oriented external connector. The mirror structure(s) may be angularly disposed at the ends of the silicon waveguide structure. An oxide layer may cover a buried oxide layer and the silicon waveguide structure. The tapered waveguide(s) may have a narrow end and a wide end. The narrow end of the tapered waveguide(s) may be disposed above the mirror structures. The tapered waveguide(s) may extend through the oxide layer from the narrow end in a direction perpendicular to the silicon waveguide structure. An external connector may fit over the tapered waveguide(s) and uses a fiber array traveling through a connector body to optically couple to the external fiber.
摘要翻译：系统和方法可以将片上光电路耦合到外部光纤。 SOI波导结构可以包括镜面结构和锥形波导，以将光学电路光耦合到垂直定向的外部连接器中的光纤。反射镜结构可以角度地设置在硅波导结构的端部处。氧化物层可以覆盖掩埋氧化物层和硅波导结构。锥形波导可以具有窄端和宽端。锥形波导的窄端可以设置在反射镜结构的上方。锥形波导可以在垂直于硅波导结构的方向上从窄端延伸穿过氧化物层。外部连接器可以装配在锥形波导上，并且使用穿过连接器主体的光纤阵列来光耦合到外部光纤。

7. 发明申请

US20130223800A1 SURFACE MOUNT (SMT) CONNECTOR FOR VCSEL AND PHOTODIODE ARRAYS 审中-公开
标题翻译：用于VCSEL和光电二极管阵列的表面安装（SMT）连接器
公开(公告)号：US20130223800A1
公开(公告)日：2013-08-29
申请号：US13855616
申请日：2013-04-02
申请人： Edris M. Mohammed
发明人： Edris M. Mohammed
IPC分类号： G02B6/42 , H01L31/167
CPC分类号： G02B6/4257 , G02B6/4249 , G02B6/428 , G02B6/4292 , G02B6/43 , H01L31/167
摘要： Self alignment of Optoelectronic (OE) chips, such as photodiode (PD) modules and vertical cavity surface emitting laser (VCSEL) modules, to external waveguides or fiber arrays may be realized by packaging the OE chips directly in the fiber optic connector.
摘要翻译：可以通过将OE芯片直接封装在光纤连接器中来实现诸如光电二极管（PD）模块和垂直腔表面发射激光器（VCSEL）模块的光电（OE）芯片到外部波导或光纤阵列的自对准。

8. 发明申请

US20110155435A1 METHOD TO FORM LATERAL PAD ON EDGE OF WAFER 有权
标题翻译：形成边缘边缘的方法
公开(公告)号：US20110155435A1
公开(公告)日：2011-06-30
申请号：US12649328
申请日：2009-12-29
申请人： EDRIS M. MOHAMMED , Hinmeng Au
发明人： EDRIS M. MOHAMMED , Hinmeng Au
IPC分类号： H05K1/11 , H05K3/00
CPC分类号： H05K1/181 , H05K3/403 , H05K2201/10454 , Y02P70/611 , Y10T29/49124
摘要： Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.
摘要翻译：实施例涉及在衬底晶片衬底的边缘上形成衬垫阵列的装置和制造方法。本发明的实施例使得可以使用标准的半导体组装工艺将表面贴装器件垂直地（即在它们的侧面上）粘结。

9. 发明授权

US07508858B2 Detuned duo-cavity laser-modulator device and method with detuning selected to minimize change in reflectivity 有权
标题翻译：选择失谐二腔激光调制器装置和失谐方法以最小化反射率变化
公开(公告)号：US07508858B2
公开(公告)日：2009-03-24
申请号：US11742049
申请日：2007-04-30
申请人： Serge Oktyabrsky , Vadim Tokranov , Michael Yakimov , Jobert VanEisden , Edris M. Mohammed , Ian Young
发明人： Serge Oktyabrsky , Vadim Tokranov , Michael Yakimov , Jobert VanEisden , Edris M. Mohammed , Ian Young
IPC分类号： H01S3/08
CPC分类号： H01S5/18302 , H01S5/0425 , H01S5/06226 , H01S5/1021 , H01S5/1039 , H01S5/18311 , H01S5/18352 , H01S5/18358 , H01S5/3095 , H01S2301/176
摘要： A detuned duo-cavity laser-modulator device and method are provided which include lower, middle and upper reflectors, a gain region and an absorber region integrated into a semiconductor die. The middle reflector is disposed between the lower and upper reflectors. Together, the lower and middle reflectors define a first resonant cavity, while the upper and middle reflectors define a second resonant cavity. A gain region is disposed within a laser cavity of the resonant cavities to generate an optical carrier wave, while an absorber region is disposed within a modulator cavity of the resonant cavities to modulate a signal on the optical carrier wave. The laser and modulator cavities are detuned resonant cavities, with the detuning of the laser and modulator cavities being selected to minimized change in reflection from the modulator cavity to the laser cavity when the absorber region modulates the signal on the optical carrier wave.
摘要翻译：提供了一种失谐的二腔激光调制装置和方法，其包括下反射器，中上反射器和上反射器，集成到半导体管芯中的增益区域和吸收器区域。中间反射器设置在下反射器和上反射器之间。一起，下反射器和中间反射器限定第一谐振腔，而上反射器和中反射器限定第二谐振腔。增益区域设置在谐振腔的激光腔内以产生光载波，而吸收体区域设置在谐振腔的调制器腔内，以调制光载波上的信号。激光器和调制器腔是失谐的谐振腔，当吸收器区域调制光载波上的信号时，激光器和调制器腔的失谐被选择为使得从调制器腔到激光腔的反射最小化。

10. 发明申请

US20090003763A1 Forming a surface-mount opto-electrical subassembly (SMOSA) 审中-公开
标题翻译：形成表面贴装光电子组件（SMOSA）
公开(公告)号：US20090003763A1
公开(公告)日：2009-01-01
申请号：US11823933
申请日：2007-06-29
申请人： Edris M. Mohammed , Ian Young
发明人： Edris M. Mohammed , Ian Young
IPC分类号： G02B6/12
CPC分类号： G02B6/4292 , G02B6/4249 , G02B6/43 , H01L31/0203
摘要： In one embodiment, the present invention includes an apparatus having a three-dimensional (3D) interconnect with a first cavity and a second cavity, and an integrated device formed of an electronic integrated circuit (IC) bonded to at least one optoelectronic (OE) die. The integrated device is bonded to the 3D interconnect and at least partially extends into the second cavity. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，本发明包括具有第一空腔和第二空腔的三维（3D）互连的装置，以及由电子集成电路（IC）形成的集成装置，该电子集成电路与至少一个光电子（OE）死。集成器件被结合到3D互连件并且至少部分延伸到第二腔中。描述和要求保护其他实施例。

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