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1. 发明专利

JPH08227969A BRIDGE MODULE 失效
公开(公告)号：JPH08227969A
公开(公告)日：1996-09-03
申请号：JP31155295
申请日：1995-11-06
申请人： EUPEC GMBH & CO KG
发明人： SCHULZE GERHARD , SPANKE REINHOLD , SOMMER KARL-HEINZ
IPC分类号： H01L25/07 , H01L25/11 , H01L25/18 , H02M7/00 , H02M7/04 , H02M7/12
摘要： PROBLEM TO BE SOLVED: To form a symmetrical construction and improve electrical characteristics by a method, wherein two DC connection conductors and two DC terminals are provided in each bridge branch and all the same polarity DC terminals of three bridge branches are connected to each other with adjacent conductors provided outside a vessel. SOLUTION: A bridge module is housed in a vessel 1 installed on a metallic bottom plate 2. A three-phase bridge having three power semiconductor branches is attached between the vessel 1, and the bottom plate 2 and each branch has two semiconductor switches. Two DC terminals 4 and 3, 7 and 6 or 10 and 9 are provided for each bridge branch. The negative polarity DC terminals 3, 6 and 9 are connected electrically to each other with a connection plate 12 provided outside the vessel. Similarly, the positive polarity DC terminals 4, 7 and 10 are connected electrically to each other with a connection conductor 14 provided outside the vessel. Both the DC connection plates 12 and 14 are laid adjacent to each other for maintaining an inductance lower than the inductance of an external DC circuit.

2. 发明专利

JPH0869997A SEMICONDUCTOR DEVICE WITH PASSIVATION LAYER 失效
公开(公告)号：JPH0869997A
公开(公告)日：1996-03-12
申请号：JP22472095
申请日：1995-08-09
申请人： EUPEC GMBH & CO KG , SIEMENS AG
发明人： ARUBERUTO HANMAASHIYUMITSUTO , GERUHARUTO SHIYUMITSUTO , RAINAA BARUTERUMESU
IPC分类号： H01L21/314 , H01L23/29 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having a passivation layer and a passivation layer for the semiconductor device, without forming an inversion layer. SOLUTION: Amorphous hydrogen, containing carbon (a-C:H) and doped with oxygen of 0.01 to 20 wt.% is used for a passivation layer, covering a part near a surface of a p-n junction of a semiconductor substrate.

3. 发明专利

JPH07307336A SEMICONDUCTOR DEVICE WITH PASSIVATION LAYER 失效
公开(公告)号：JPH07307336A
公开(公告)日：1995-11-21
申请号：JP11955094
申请日：1994-05-09
申请人： EUPEC GMBH & CO KG , SIEMENS AG
发明人： ARUBERUTO HANMAASHIYUMITSUTO , GERUHARUTO SHIYUMITSUTO , RORUFU SHIYURUTE
IPC分类号： H01L21/31 , C23C16/26 , H01L21/314 , H01L23/29 , H01L23/31
摘要： PURPOSE: To improve the passivation layer, consisting of amorphous hydrogen containing carbon, of a semiconductor device so that it may fit for a p-doped semiconductor layer. CONSTITUTION: A passivation layer consisting of a-C:H doped with boron of 0.010/00-4% and covering the section near a pn junction at least is deposited on a semiconductor substrate which has at least one pn junction near the surface of itself by high-frequency low voltage plasma.

4. 发明专利

JPH07249645A MOUNTING METHOD OF SEMICONDUCTOR ONTO BOARD 失效
公开(公告)号：JPH07249645A
公开(公告)日：1995-09-26
申请号：JP2486893
申请日：1993-01-20
申请人： EUPEC GMBH & CO KG
发明人： FURANTSU KAUSEN , MARUCHIN FUIGUURA
IPC分类号： H01L21/52 , H01L21/58 , H01L23/13
摘要： PURPOSE: To eliminate the need for a soldering pattern when a semiconductor is installed onto a substrate by fixing a side face by a wire bonded on a metallic layer of the substrate, before the connection of the semiconductor. CONSTITUTION: A metallic layer 2 is executed on the main surface of the substrate 1, and the two semiconductors 3 to be bonded with the metallic layer 2 are mounted on the metallic layer 2 through solder layers 4. Wires 5 are bonded on the metallic layer 2 for fixing the side faces of the semiconductors 3 on the substrate 1. The wires 5 are bonded, the solder layers 4 are executed, and the semiconductors 3 are arranged onto the solder layers 4. The semiconductor 3 are brazed onto the substrate 1 in a passing oven. Accordingly, small members can be simply fastened onto a large member respectively. When the semiconductors 3 are set up onto the substrate 1, no soldering pattern is required.

5. 发明专利

JPH098225A SEMICONDUCTOR MODULE FOR ELECTRIC POWER 失效
公开(公告)号：JPH098225A
公开(公告)日：1997-01-10
申请号：JP17720396
申请日：1996-06-19
申请人： EUPEC GMBH & CO KG
发明人： ANDOREASU RENIGAA
IPC分类号： H01L23/52 , H01L23/538 , H01L25/07 , H01L25/16 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module for power in which numerous different circuits can be formed by only changing the bonding connection in the module. SOLUTION: A semiconductor module for power is provided with six semiconductor devices 1-6 for controllable power arranged on an insulating substrate carrying conducting paths 24-29. Conducting paths 37, 38, and 39 corresponding to each two of the semiconductor devices arranged in parallel with each other are additionally provided on the insulating substrate and are connected to one of six load current terminals, one of the conductive paths, and one of the semiconductor devices. Therefore, a plurality of different circuits can be formed in the module without changing the structure.

6. 发明专利

JPH07183436A SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH07183436A
公开(公告)日：1995-07-21
申请号：JP29795794
申请日：1994-11-07
申请人： EUPEC GMBH & CO KG
发明人： UERUNAA KEERAA , RAINHORUTO SHIYUPANKE
IPC分类号： H01L23/14 , H01L23/13 , H01L23/367 , H01L23/40 , H01L25/04 , H05K3/00 , H05K3/34
摘要： PURPOSE: To provide a semiconductor module which can be fixed using a simple wax pattern while ensuring good thermal contact between a bottom plate and a cooling body. CONSTITUTION: In order to ensure good thermal contact between the bottom plate 1 and the cooling body 12 of a module, the bottom plate 1 is provided with a convex lower surface 2 and a flat upper surface 5. According to the structure, a substrate 6 and chips 8, 9 can be fixed easily onto the upper surface of the bottom plate 1.

7. 发明授权

US6431259B2 Spring clip for fixing semiconductor modules to a heat sink 有权
标题翻译：用于将半导体模块固定到散热器的弹簧夹
公开(公告)号：US6431259B2
公开(公告)日：2002-08-13
申请号：US79335201
申请日：2001-02-26
申请人： EUPEC GMBH & CO KG
发明人： HELLBRUECK HORST , JOERKE RALF , KANELIS KONSTANTIN , LODDENKOETTER MANFRED , STOLZE THILO
IPC分类号： H01L23/40 , F28F7/00 , H01L23/34 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.
摘要翻译：为了将半导体模块固定到散热器，半导体模块和散热器由一个或多个由弹簧材料制成的夹子夹紧在一起，即弹簧夹。弹簧夹的相互匹配的形式优化了散热器和半导体模块之间的连接。夹体和散热器或半导体模块的相应连接有利地有效地使得弹簧夹可以插入到相应的弹簧夹插座中并且自动保持在散热器或半导体模块上/内。

8. 发明专利

JP2001298129A POWER SEMICONDUCTOR MODULE 失效
公开(公告)号：JP2001298129A
公开(公告)日：2001-10-26
申请号：JP2001051229
申请日：2001-02-26
申请人： EUPEC GMBH & CO KG
发明人： LODDENKOETTER MANFRED , STOLZE THILO
IPC分类号： H01L23/32 , H01L23/051 , H01L23/055 , H01L23/16 , H01L23/433 , H01L23/495 , H01L23/498 , H01L25/00 , H01L29/74 , H01R13/52 , H01R43/02 , H05K3/34 , H05K3/40 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor module which brings a terminal of a power semiconductor module into direct contact with a substrate for compensating thermally limited mechanical stress by a simple means by improving a power semiconductor module of a type where bushes 2a, 2b are provided, the bushes 2a, 2b are connected to a substrate 4 of a power semiconductor module 1, a wire rod pin 3 is provided, and the wire rod 3 is formed to be introduced into the bushes 2a, 2b during operation for forming an electrical connection part to a panel 5. SOLUTION: An introduced wire rod pin can be held by bushes 2a, 2b, and the bushes 2a, 2b have a minimum diameter region which is smaller than a diameter of the wire rod pin.

9. 发明专利

JP2001284800A SUBSTRATE FOR OUTPUT SEMICONDUCTOR MODULE HAVING THROUGH CONTACT BY SOLDER AND METHOD FOR MANUFACTURING SUBSTRATE 失效
公开(公告)号：JP2001284800A
公开(公告)日：2001-10-12
申请号：JP2001038608
申请日：2001-02-15
申请人： EUPEC GMBH & CO KG
发明人： STOLZE THILO , LODDENKOETTER MANFRED
IPC分类号： B23K1/00 , B23K1/008 , B23K101/42 , H01L21/48 , H01L23/12 , H01L23/373 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/34 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a substrate for an output semiconductor module having through contacts which can be manufactured easily and at a low cost. SOLUTION: A through hole (4) is bored in one metallic plate (3o) in such a way that it is matched with a through hole (2a) in a ceramic plate (2) a solder paste (9) is applied to one side of a substrate 1 and is allowed to flow into the through holes (2a) and (4) by performing soldering in a solder tank, and two metallic plates 3o and 3u are made into permanent contact with each other by the solder (9).

10. 发明专利

JP2001244393A SEMICONDUCTOR MODULE, COOLER AND FIXING DEVICE TO FIX COOLER TO SEMICONDUCTOR MODULE 失效
公开(公告)号：JP2001244393A
公开(公告)日：2001-09-07
申请号：JP2001045281
申请日：2001-02-21
申请人： EUPEC GMBH & CO KG
发明人： HELLBRUECK HORST , JOERKE RALF , KANELIS KONSTANTIN , LODDENKOETTER MANFRED , STOLZE THILO
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To provide cheap, easy and sure combination of the semiconductor module and the cooler by means of improving the spring clips 4 and 5 for fixing the cooler 1 to the semiconductor module 2. SOLUTION: This solution installs at least one of the sides that are conformed to the first spring clip acceptors 3a, 3b, 3c and/or the second spring clip acceptors 3d, 3e of the cooler 1 for fixing automatically in the first and/or second spring clip acceptors 3a, 3b, 3c, 3d, 3e, at least under the tightening condition that the semiconductor module 2 is combined with the cooler 1 by the spring clips 4 and 5.

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