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    • 1. 发明申请
    • GROWTH OF HETEROJUNCTION BIPOLAR TRASISTOR STACKS BY REMOTE INJECTION
    • 通过远程注射生长双极双极柱堆叠
    • WO2007001672A3
    • 2008-08-21
    • PCT/US2006019234
    • 2006-05-17
    • ATMEL CORPENICKS DARWIN GCARVER DAMIAN A
    • ENICKS DARWIN GCARVER DAMIAN A
    • H01L29/73H01L29/732H01L31/072
    • H01L29/7378H01L29/66242
    • A method, and a resulting device, for fabricating a heterojunction bipolar transistor (HBT). HBT devices have a high transconductance typical of bipolar devices and are additionally capable of high- power operation. To achieve the aforementioned characteristics, HBT devices are generally of the npn type, preferably with a thin, heavily doped base (117). The thin, heavily doped base (117) maintains a low base- spreading resistance, leading to a high maximum oscillation frequency. In order to maintain a high doping concentration while minimizing outdiffusion of the dopant material, carbon is remotely doped into the base region (117). Details of the carbon dopant techniques and procedures are described with respect to fabrication of an exemplary HBT device.
    • 一种用于制造异质结双极晶体管(HBT)的方法和所得到的器件。 HBT器件具有典型的双极器件的高跨导,并且还能够进行高功率操作。 为了实现上述特征,HBT器件通常是npn型,优选地具有薄的重掺杂碱(117)。 薄的重掺杂基极(117)保持低的基极扩展电阻,导致高的最大振荡频率。 为了保持高掺杂浓度同时最小化掺杂剂材料的扩散,碳被远程掺杂到基极区域(117)中。 关于制造示例性HBT装置来描述碳掺杂剂技术和程序的细节。
    • 3. 发明申请
    • A HETEROJUNCTION BIPOLAR TRANSISTOR (HBT) WITH PERIODIC MULTI LAYER BASE
    • 具有周期性多层基板的异相双极晶体管(HBT)
    • WO2008024587A3
    • 2008-09-04
    • PCT/US2007074232
    • 2007-07-24
    • ATMEL CORPENICKS DARWIN G
    • ENICKS DARWIN G
    • H01L31/11
    • H01L29/161H01L29/165H01L29/66242H01L29/7378H01L29/7781H01L29/7782
    • A method and resulting electronic device utilizing periodic multi-layer (ML) (500) and/or superlattice (SL) structures in the base of a SiGe heteroj unction bipolar transistor (HBT) is disclosed. The SL is a special case of an ML, in which layers that are chemically different from adjacent neighbors are successively repeated. The use of the ML (500) in electronic and photonic devices enables strategic engineering of the energy band gap (551, 553) and carrier mobilities. Principles disclosed herein relate to npn- and pnp-type SiGe HBTs as well as HBTs made with other compound semiconductor materials (e.g., other Group III-V or II-VI materials). Additionally, technology and methods disclosed herein benefit other devices types such as, for example, metal oxide semiconductor field effect transistors (MOSFETs), high electron mobility transistors (HEMTs), high hole mobility transistors (HHMTs), bipolar junction transistors (BJTs), and FINFETs.
    • 公开了一种在SiGe异质结双极晶体管(HBT)的基极中利用周期性多层(ML)(500)和/或超晶格(SL)结构的方法和所得到的电子器件。 SL是ML的特殊情况,其中连续重复与相邻邻居化学不同的层。 在电子和光子器件中使用ML(500)可以实现能带隙(551,553)和载波移动性的战略工程。 本文公开的原理涉及npn-和pnp型SiGe HBT以及用其它化合物半导体材料(例如其它III-V族或II-VI族材料)制成的HBT。 此外,本文公开的技术和方法还有益于其它器件类型,例如金属氧化物半导体场效应晶体管(MOSFET),高电子迁移率晶体管(HEMT),高空穴迁移率晶体管(HHMT),双极结型晶体管(BJT) 和FINFETs。
    • 7. 发明申请
    • A METHOD FOR MANIPULATION OF OXYGEN WITHIN SEMICONDUCTOR MATERIALS
    • 一种用于在半导体材料中操作氧的方法
    • WO2007133949A1
    • 2007-11-22
    • PCT/US2007/068107
    • 2007-05-03
    • ATMEL CORPORATIONENICKS, Darwin, G.
    • ENICKS, Darwin, G.
    • H01L31/00
    • H01L29/167H01L21/265
    • Methods and electronic devices fabricated by those methods are disclosed where the method allows controlled movement of oxygen during fabrication of electronic and photonic devices, facilitated by a technique of oxygen updiffusion (OUD). The method includes fabrication of a compound semiconductor film (1303), doped with either carbon or boron, over a substrate (1301) and incorporating a quantity of oxygen (1307, 1309) into either the substrate (1301) or an adjacent film layer (1305). One or more anneal steps may be used as a partial control mechanism, along with dopant types, concentrations, and profiles, to control movement of the oxygen (1307, 1309) from the semiconductor substrate (1301) or adjacent films (1305) into the compound semiconductor film (1303).
    • 公开了通过这些方法制造的方法和电子器件,其中该方法允许在通过氧更新扩散(OUD)技术促进电子和光子器件的制造期间受控的氧气移动。 该方法包括在衬底(1301)上制造掺杂有碳或硼的化合物半导体膜(1303),并将一定数量的氧(1307,1309)掺入衬底(1301)或相邻膜层 1305)。 可以将一个或多个退火步骤用作部分控制机制以及掺杂剂类型,浓度和分布,以控制氧(1307,1309)从半导体衬底(1301)或相邻薄膜(1305)移动到 化合物半导体膜(1303)。